Method for cutting LED chip

Abstract

The invention provides a method for cutting an LED (Light Emitting Diode) chip, which comprises the steps of: on the back face of the chip, sawing along the middle position of two electrodes on the front face, wherein the sawing depth is 1 / 6 to 2 / 3 of the thickness of the chip, and then splitting the chip on the front face of the chip along the sawing mark by using a splitter. The method is simple in process and free from the manufacturing of a scribing slot and adopts the manner of sawing on the back face and splitting on the front face so that each side on the front face of the chip only loses the area as large as 1 micron to 5 microns of splitting width, more tube cores can be formed on each chip by splitting so as to increase the chip productivity remarkably, the chip is free from edge breaking, corner breaking, burr, cracking and other problems owing to the manner of sawing on the back face and splitting on the front face as well as incomplete sawing on the back face, and simultaneously, the method is free from the problems of pollution, arsenic evaporation and arsenic oxides and the like.

Description

technical field [0001] The invention relates to a method for cutting LED (light-emitting diode) chips, including gallium arsenide, gallium phosphide, and silicon light-emitting diode chips, and belongs to the technical field of semiconductor chip cutting. Background technique [0002] In the LED chip manufacturing process, cutting is a very important link. The purpose of cutting is to divide the electrodes and connected chips into independent chips one by one. For LED chips, there are currently two cutting processes: saw blade cutting and laser cutting. The traditional and most widely used cutting method in the industry is saw blade cutting. [0003] Saw blade cutting is to use a high-speed rotating saw blade to completely saw (cut through) the chip into a single die according to the set program. Saw cutting technology has been quite mature, and it is still the mainstream technology for gallium arsenide chip cutting. However, there are some troublesome problems in this cu...

AI Technical Summary

Problems solved by technology

However, there are some troublesome problems in this cutting method: some semiconductor materials are physically brittle, which makes them easier to break during processing; after saw blade cutting, edge chipping, chipping, burrs, etc. , which seriously affects product quality; saw blade cutting takes a lot of time, and the production efficiency is low; the LED light-emitting area is 1 / 20 to 1 / 3 away from the chip surface, and the cutting groove formed by the existing cutting process will reduce the area of ​​the light-emitting area 10-20μm chip area should be sawed off on each side of the chip, so that the chip with the same repeating pitch will reduce the light-emitting area by two grooves after cutting.

However, both saw blade and laser scribing will destroy a certain area of ​​light-emitting area, which directly affects chip production capacity

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