Regenerated solution of alkaline copper etching solution and method for increasing etching speed thereof

A technology for copper etching and regenerating solution, which is applied in the field of regenerating solution of alkaline copper etching solution by accelerating agent, can solve the problems of affecting the etching quality, the service life of the productive regenerating solution, and the inability to guarantee the stable performance of the etching regenerating solution, so as to improve the use of the regenerating solution. Longevity, improved etching rate, stable effect

Inactive Publication Date: 2011-07-06
SHENZHEN JECH TECH
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  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0012] The first purpose of the embodiments of the present invention is to provide a regeneration solution for alkaline copper etching solution, which aims to solve the problem that the etching speed of the regeneration solution of the existing alkaline co

Method used

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  • Regenerated solution of alkaline copper etching solution and method for increasing etching speed thereof
  • Regenerated solution of alkaline copper etching solution and method for increasing etching speed thereof
  • Regenerated solution of alkaline copper etching solution and method for increasing etching speed thereof

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Embodiment 1

[0030] Taking the etching rate of the alkaline copper chloride etching regeneration solution that has been recycled for about half a year as the baseline value, this rate is set as a relative value of 1 for comparison. Then, by adding sodium chlorite to the etching regeneration solution, investigate the relative speed of the regeneration solution after adding sodium chlorite and the original regeneration solution.

[0031] The existing alkaline copper etch regeneration solution used to determine the baseline value consists of:

[0032] Cu 2+ 135~165g / L

[0033] Cl - 175~195g / L

[0034] NH 3 Adjust to PH8.2~8.6

[0035] NH 4 HCO 3 20~30g / L

[0036] (NH 4 ) 2 HPO 4 0.5~2g / L

[0037] Thiourea or dithiobiurea 0.1~1g / L

[0038] The etching conditions are as follows: the temperature is 50±2° C., the pH=8.3˜8.6 and the pressure i...

Embodiment 2

[0041] It is basically the same as Example 1, except that the speed-accelerating agent added to the alkaline copper chloride etching regeneration solution is sodium perborate. Carried out 5 experiments by increasing the concentration of sodium perborate added to the above-mentioned alkaline copper chloride etching regeneration solution, the experimental results can be found in figure 2 . figure 2 Test results are shown for each concentration tested, expressed as relative etch rates. The test results show that when the added perborate ion is in the concentration range of 100mg / L-900mg / L, the etching speed is improved compared with the original regeneration solution. When the added perborate ion concentration reaches 400mg / L, the etching The speed increased significantly, and the relative etching speed reached 1.4. When the concentration exceeds 400mg / L, the etching rate increases very slowly. When the concentration reaches 600mg / L, the relative etching rate is 1.45, which m...

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Abstract

The invention provides a regenerated solution of alkaline copper etching solution and a method for increasing the etching speed thereof. The regenerated solution of alkaline copper etching solution contains a first accelerating agent and a second accelerating agent, wherein the first accelerating agent contains an organic thio-acid compound with a NH2-CS-NH-group, and the second accelerating agent is selected from at least one of a chlorition compound and a perboric acid ion compound. According to the method for increasing the etching speed of the regenerated solution of alkaline copper etching solution, an effective amount of second accelerating agent is added to the regenerated solution of alkaline copper etching solution, wherein the second accelerating agent is selected from at least one of the chlorition compound and the perboric acid ion compound. The regenerated solution of alkaline copper etching solution provided by the invention can effectively improve the etching speed of the alkaline etching solution, and can keep the etching speed stable, thereby prolonging the service life of the etching regenerated solution.

Description

technical field [0001] The invention relates to a regeneration solution of an alkaline copper etching solution, a method for increasing the etching speed of the regeneration solution of an alkaline copper etching solution, and an application of a speed increasing agent in the regeneration solution of an alkaline copper etching solution. Background technique [0002] Alkaline etching is an essential process in the process of manufacturing printed circuit boards. Alkaline etching is generally suitable for the production of outer circuit patterns of multilayer printed boards and the etching of pure tin printed boards. The main resist is the metal resist layer of pattern plating, such as plating gold, nickel, lead-tin alloy Wait. Alkaline etching solution is generally composed of copper chloride, ammonium chloride and excess ammonia water, and is divided into etching sub-liquid (excluding copper), etching cylinder solution (working liquid) and etching waste liquid according to ...

Claims

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Application Information

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IPC IPC(8): C23F1/34C23F1/46
Inventor 李建光何世武崔磊赵业伟罗宝奎李琪杰
Owner SHENZHEN JECH TECH
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