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Electroconductive connecting material, method for connecting terminals to each other using the electroconductive connecting material, and method for manufacturing connecting terminal

A conductive connection material and resin composition technology, which is applied in the direction of conductive connection, electrical component connection, printed circuit manufacturing, etc., can solve the problems of inability to print, high cost of solder ball production, and difficulty in making small-diameter solder balls. High conductivity and excellent connection reliability

Inactive Publication Date: 2011-08-03
SUMITOMO BAKELITE CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in this method, if the connection terminals have a narrow pitch, the cost of the mask used for printing the solder paste is high, and if the connection terminals are small, printing may not be possible.
In addition, in the method of mounting solder balls on connection terminals and heating and melting the solder balls using a solder reflow device, etc., if the connection terminals are small, the production cost of the solder balls is high, and it may be technically difficult to manufacture small-diameter solder balls. solder ball

Method used

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  • Electroconductive connecting material, method for connecting terminals to each other using the electroconductive connecting material, and method for manufacturing connecting terminal
  • Electroconductive connecting material, method for connecting terminals to each other using the electroconductive connecting material, and method for manufacturing connecting terminal
  • Electroconductive connecting material, method for connecting terminals to each other using the electroconductive connecting material, and method for manufacturing connecting terminal

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no. 1 approach

[0210]The connection method between terminals according to the first embodiment of the present invention includes: arranging a conductive connection material containing the aforementioned curable resin composition and metal foil between the terminals; a temperature at which the curing of the curable resin composition does not end; a heating step of heating the conductive connecting material; and a curing step of curing the curable resin composition.

[0211] In this connection method, heat-melted solder or tin is selectively aggregated between terminals to form a conductive region, and a curable resin composition is used to form an insulating region around it. As a result, insulation between adjacent terminals can be ensured to prevent leakage current, and thus the connection reliability of the connection between the terminals can be improved. In addition, electrical connection between a plurality of terminals can be performed at once even in a fine wiring circuit. Furthermor...

no. 2 approach

[0225] Next, a connection method between terminals according to a second embodiment of the present invention will be described. The terminal-to-terminal connection method according to the second embodiment of the present invention includes: arranging a conductive connection material containing the aforementioned thermoplastic resin composition and metal foil between opposing terminals; and a heating step of heating the conductive connecting material at a temperature at which the thermoplastic resin composition softens; and a curing step of curing the thermoplastic resin composition. Next, each step will be described.

[0226] (a) Configuration process

[0227] In the case of using a conductive connecting material containing a thermoplastic resin composition and metal foil, the conductive connecting material can also be arranged in the same manner as in the case of using the conductive connecting material containing the aforementioned thermosetting resin composition and metal ...

Embodiment 1

[0302] 39.3 parts by weight of epoxy resin ("EPICLON EXA830-LVP" manufactured by Dainippon Ink Chemical Industry Co., Ltd., epoxy equivalent 160g / eq), carboxyl-terminated butadiene-acrylonitrile copolymer (Ube Industries, Ltd.) manufactured "CTBN1008-SP") 0.8 parts by weight, gentisic acid (manufactured by Midori Kagaku Co., Ltd) 7.9 parts by weight, sebacic acid (manufactured by Tokyo Chemical Industry Co., Ltd.) 2.0 parts by weight, and 2-phenyl-4 - 0.2 parts by weight of methylimidazole ("Curezol 2P4MZ" manufactured by Shikoku Chemical Industry Co., Ltd.) was mixed to prepare a curable resin composition. The melt viscosity (160° C.) of the obtained curable resin composition was measured according to the method described above. The results are shown in Table 1.

[0303] This curable resin composition was coated on a solder foil (Sn / Bi=42 / 58, density=8.7g / cm 3 , thickness of 10 μm) on both sides, a thickness of 50 μm conductive connection material was produced.

[0304] Ne...

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Abstract

The present invention provides a conductive connecting material for electrically connecting terminals of electronic members, which has a layered structure comprising: a curable resin composition containing a resin component and a compound having a flux function; and a metal foil selected from a solder foil and a tin foil. Further, the present invention provides a method for connecting terminals comprising; a placement step in which the conductive connecting material is placed between opposed terminals; a heating step in which the conductive connecting material is heated at a temperature, which is equal to or higher than the melting point of the metal foil, and at which the resin composition is not completely cured or the resin composition is softened; and a curing step / solidifying step in which the resin composition is cured or solidified.

Description

technical field [0001] The present invention relates to a conductive connection material composed of a resin composition (containing a resin component and a compound having a flux function) and a metal foil (selected from solder foil or tin foil), and terminals facing each other to electronic components using the conductive connection material A method of electrically connecting between them, and a method of manufacturing a connection terminal using the conductive connecting material. Background technique [0002] In recent years, along with the demand for higher functionality and miniaturization of electronic devices, the pitch between connection terminals in electronic materials has gradually been narrowed, and the connection between terminals in fine wiring circuits has also tended to be high-level. As a connection method between terminals, for example, when electrically connecting an IC chip to a circuit board, it is known to use an anisotropic conductive adhesive or an ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/34C09J7/00C09J9/02C09J11/06C09J163/02C09J201/00H01R11/01
CPCH05K3/363H05K3/3478H05K3/3489H05K2201/10977H05K2203/1189C09J9/02C09J163/00H05K2203/0405Y10T428/24917Y10T29/49117Y10T428/31678Y10T428/31529Y10T428/31692Y10T428/31681Y10T428/31663H05K3/34H01L21/60H01R11/01
Inventor 冈田亘山本通典中马敏秋前岛研三键本奉広桂山悟藤井智绘
Owner SUMITOMO BAKELITE CO LTD
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