Direct type ultrathin LED backlight module

Abstract

The invention relates to a direct type ultrathin LED backlight module which is characterized in that unpackaged LED chip light sources are directly arranged on a PCB (Printed Circuit Board), then transparent glue or fluorescent glue is coated on the surface of one LED chip light source or a transparent glue layer or fluorescent glue layer is coated on the surfaces of a plurality of LED chip light sources, thus the same effect with the packaged LED chip light sources can be realized, the process of packaging the LED chip light sources in advance is reduced, the condition that an optical device is arranged on an LED for reducing the thickness of a backlight source is avoided, and cost is greatly saved. Meanwhile, light rays emitted by the LED chip light sources are refracted in the transparent glue layer or fluorescent glue layer, thus light-exiting surfaces of the light rays are increased; and by increasing the arrangement density of the LED chip light sources, the distance of the crossed light rays among the LED chip light sources is greatly reduced, thus the thickness of the backlight module can be greatly reduced to ensure that the scheme of the direct type ultrathin LED backlight module is realized.

Description

technical field [0001] The invention relates to a backlight module, in particular to a direct-type ultra-thin LED backlight module, which is applied to the field of liquid crystal display devices (such as liquid crystal televisions, liquid crystal displays, etc.). Background technique [0002] The existing direct-type LED backlight module generally includes an LCD display screen, a diffusion film and a PCB board. There are several packaged LED light sources on the PCB board. After the LED light source emits light, the light becomes uniform and consistent after passing through the diffusion film. , and then irradiate evenly onto the LCD display screen, so as to realize the function of illuminating the liquid crystal display device. Although the existing backlight modules are relatively common, since most of the LED powers used are above 0.3 watts, the number of LEDs used for each backlight source is small, so the distribution density of the LED light sources is very small. T...

AI Technical Summary

Problems solved by technology

Although the existing backlight modules are relatively common, since most of the LED powers used are above 0.3 watts, the number of LEDs used for each backlight source is small, so the distribution density of the LED light sources is very small. The distance between the intersecting light rays is large. In order to use the light emitted by the LED, the thickness of the backlight module will be relatively large, and it is difficult to achieve ultra-thinness. To make an ultra-thin backlight source, it is necessary to add a lot of light to the LED. Optical refraction and optical reflection devices lead to high costs; in addition, LED light sources can only be used in backlight modules after packaging, and packaging LED light sources will inevitably increase production costs, and more importantly, because packaging Due to the structural limitation of the bracket and the added refraction and reflection device, the light output efficiency of the LED light source will also be partially limited, resulting in high cost and low efficiency

[0003] Therefore, there is no direct-type ultra-thin LED backlight module with high LED distribution density, low cost and high efficiency by directly manufacturing LED chips on the PCB in the prior art.

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