Liquid-cooled radiation structure

Abstract

The invention discloses a liquid-cooled radiation structure, which comprises a substrate and at least one radiation fins, wherein the substrate is provided with at least one liquid input pipeline, at least one liquid output pipeline and at least one groove; the inner side of the groove is communicated with the liquid input pipeline and the liquid output pipeline to form an opening respectively; in addition, the radiation fin is provided with a plate body which can be embedded into and seal the groove; and the surface of the plate body is provided with a plurality of flow deflectors which can be embedded into the groove. The flow deflectors and the groove form a plurality of runners allowing the shunting of liquid, and the liquid flowing through the liquid input pipeline and the liquid output pipeline can flow among the plurality of runners by flowing in and out of the two openings of the groove, so that continuous cyclic radiation can be realized in the substrate.

Description

technical field [0001] The present invention relates to a liquid-cooled heat dissipation structure, in particular to a heat dissipation structure with micro-channels for carrying electronic components to cool down and dissipate heat through liquid circulation. Background technique [0002] Due to the characteristics of the components, the current high-power components (Power Device) will inevitably generate large amounts of heat. Take the Insulated Gate Bipolar Transistor (IGBT) as an example. The IGBT combines the field-effect transistor gate Easy-to-drive characteristics and bipolar transistor high current resistance and low conduction voltage drop characteristics, usually used in high-capacity power applications (such as switching power supplies, motor control, induction cooker or hundreds of amperes and six kilovolt power system field); if the IGBT is used in a switching power supply, the power is converted from AC power to the required DC power output by high-frequency ...

AI Technical Summary

Problems solved by technology

[0002] Due to the characteristics of the components, the current high-power components (Power Device) will inevitably generate large amounts of heat. Take the Insulated Gate Bipolar Transistor (IGBT) as an example. The IGBT combines the field-effect transistor gate Easy-to-drive characteristics and bipolar transistor high current resistance and low conduction voltage drop characteristics, usually used in high-capacity power applications (such as switching power supplies, motor control, induction cooker or hundreds of amperes and six kilovolt power system field); if the IGBT is used in a switching power supply, the power is converted from AC power to the required DC power output by high-frequency switching. During the conversion process, the power components are damaged due to energy loss Heat generation, overheating will lead to performance degradation or even damage to power components

[0003] Therefore, in order to avoid overheating, the usual solution is to use heat sinks and forced air convection for direct heat dissipation. However, the air convection method has the disadvantages of noise and poor heat dissipation. The way to take away the heat is mainly through a cold plate close to the heat source, and a motor-driven liquid circulates through the cold plate to absorb the heat, and then dissipates the heat to the environment to clean the electronic components. cooling

[0004] However, although the above-mentioned liquid cooling method has the characteristics of low thermal resistance, large heat transfer capacity, and long transmission distance, due to the limitations of the cold plate material and the increase in the heat absorption temperature of the liquid, under a certain liquid driving force, its thermal The resistance value is fixed, which also prevents the thermal resistance of the cold plate from being reduced more effectively. Therefore, for some electronic components that will continue to accumulate high temperatures, the effect that the currently used liquid cooling structure can achieve is extremely limited.

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