[0034] The foregoing and other technical content, features, and effects of the present invention will be clearly presented in the following detailed description of the preferred embodiment with reference to the drawings.
[0035] See figure 1 , figure 2 , Figure 3A , Figure 3B , Figure 4A , Figure 4B and Figure 4C , Are the three-dimensional exploded structure diagram, three-dimensional combined structure diagram, three-dimensional structure diagram of heat dissipation fins, top view of the heat dissipation fins, and schematic diagram of liquid circulation heat dissipation of the liquid-cooled heat dissipation structure of the present invention. It can be seen from the figure that the liquid-cooled heat dissipation structure includes:
[0036] A base 1 has at least one liquid input pipe 11, at least one liquid output pipe 12, and at least one groove 13, and the inside of the groove 13 is respectively communicated with the liquid input pipe 11 and the liquid output pipe 12 An opening (the inflow opening 14 and the outflow opening 15) are formed respectively for the heat dissipation liquid 2 flowing into the liquid input pipe 11 to pass through the groove 13 and then flow out from the liquid output pipe 12;
[0037] At least one heat dissipation fin 3, the heat dissipation fin 3 has a plate 31 that can be inserted into and closes the groove 13, and the surface of the plate 31 is provided with a plurality of guide fins 32 that can be inserted into the groove 13 Moreover, the baffle 32 and the groove 13 form a plurality of flow channels 4 that allow the heat dissipation liquid 2 to diverge.
[0038] So like Figure 4A , Figure 4B and Figure 4C As shown, the inlet 111 of the liquid input pipeline 11 and the outlet 121 of the liquid output pipeline 12 are respectively connected to an inlet pipe joint 51 and an outlet pipe joint 52, and a heat dissipation liquid 2 flows into the water inlet pipe joint 51. The liquid is fed into the pipeline 11, and the inflow opening 14 can allow the heat dissipation liquid 2 to enter the groove 13 (such as Figure 4B As shown), and after the heat dissipation liquid 2 is shunted and passed through the plurality of flow channels 4 through a plurality of flow channels 4, the heat dissipation liquid 2 can contact the plate body 31 of the heat dissipation fin 3 to absorb the plate body 31 heat dissipated; finally, through the outflow opening 15 (such as Figure 4C (Shown), the heat-absorbing liquid 2 flows into the liquid output pipe 12, and the heat-absorbing liquid 2 is discharged through the outlet pipe joint 52, so that the heat-dissipating liquid 2 continuously flows in and out Between the multiple flow channels 4, the inside of the base 1 can be continuously circulated for heat dissipation.
[0039] It is worth mentioning that the board 31 of the heat dissipation fin 3 can carry at least one electronic component, and the electronic component is an insulated gate bipolar transistor.
[0040] It is worth mentioning that the board body 31 of the heat dissipation fin 3 can carry at least one printed circuit board with electronic components.
[0041] It is worth mentioning that the base 1 is made of a material with heat dissipation characteristics.
[0042] It is worth mentioning that the plate body 31 of the heat dissipation fin 3 is made of a material with heat dissipation characteristics.
[0043] It is worth mentioning that the deflector 32 of the heat dissipation fin 3 is made of a material with heat dissipation characteristics.
[0044] It is worth mentioning that the liquid input pipe 11 can be connected to a pipe opening joint (water inlet pipe joint 51), so that the heat dissipation liquid 2 can flow into the liquid input pipe through the pipe opening joint (water inlet pipe joint 51). 11 internal.
[0045] It is worth mentioning that the liquid output pipe 12 can be connected to a pipe opening joint (outlet pipe joint 52), so that the heat dissipation liquid 2 can be transferred from the liquid output pipe through the pipe opening joint (outlet pipe joint 52). 12 Flow out from inside.
[0046] It is worth mentioning that the liquid input pipeline 11 is a flow channel gradually narrowing inward from the inlet 111, and the liquid output pipeline 12 is a flow channel gradually expanding toward the outlet 121, and the flow channel The design of tapered and divergent flow channels can control and change the flow rate and pressure of the fluid, so that the temperature of the liquid flowing into and out of any groove 13 in the base 1 can be as uniform as possible, and it can also be adjusted to make the groove The temperature difference between 13 is reduced in order to achieve the effect of uniform temperature between the grooves 13.
[0047] See Figure 5A and Figure 5B , Are the three-dimensional exploded structure diagram and the three-dimensional combined structure diagram of the embodiment of the liquid-cooled heat dissipation structure of the present invention. It can be seen from the figure that the plate body 31 of the heat dissipation fin 3 carries an insulated gate bipolar transistor 6. And the insulated gate bipolar transistor 6 is combined with a printed circuit board 71 with electronic components 72; therefore, when the insulated gate bipolar transistor 6 and the printed circuit board 71 with electronic components 72 start to operate, the The insulated gate bipolar transistor 6 generates heat due to energy loss and transfers the heat to the plate body 31 of the heat dissipation fin 3; and the heat dissipation liquid circulating between the multiple flow channels can continue Ground the plate body 31 is absorbed, and the heat-dissipating liquid 2 that has absorbed the heat is continuously discharged, so that the inside of the base 1 can circulate and dissipate the heat generated by the insulated gate bipolar transistor 6.
[0048] See Image 6 , Is a diagram of the heat dissipation effect test structure diagram of the liquid-cooled heat dissipation structure of the present invention. It can be seen from the figure that the experimental structure uses a constant temperature bath 91, an electric water pump 92, an inlet thermometer 93, an inlet pressure gauge 94, and an outlet A pressure gauge 95, an outlet thermometer 96 and a flow meter 97 are used to test the heat dissipation and temperature reduction effect of the liquid-cooled heat dissipation structure 8. The liquid-cooled heat dissipation structure 8 in this test has an inlet 81 and an outlet 85. The first heat dissipation module 82, the second heat dissipation module 83 and the third heat dissipation module 84, and two heating devices are respectively placed on the first heat dissipation module 82, the second heat dissipation module 83 and the third heat dissipation module 84 (a total of six A heating device) to pump the liquid in the thermostatic bath 91 into the inlet 81 through the electric water pump 92, and test the temperature and pressure of the input liquid through the inlet thermometer 93 and the inlet pressure gauge 94; and the input liquid passes The first heat dissipation module 82, the second heat dissipation module 83, and the third heat dissipation module 84 can discharge liquid through the outlet 85, and the outlet thermometer 95, outlet pressure gauge 96 and flow meter 97 test the discharge of the liquid The temperature, pressure, and liquid flow rate can finally be understood by the measured measurement data through the liquid-cooled heat dissipation structure 8 to reduce the cooling effect of the heat generated by the heating device; therefore, the present invention uses three sets of tests The data materials verify the heat dissipation effect as follows:
[0049] First group:
[0050] The liquid-cooled heat dissipation structure 8 has a thermal impedance of 0.0264 (°C/W) and is heated by six heating devices to increase the temperature, wherein the temperature of the first heat dissipation module 82 is 45.76°C, and the temperature of the second heat dissipation module 83 The temperature of the third heat dissipation module 84 is 50.81°C and the temperature of the third heat dissipation module 84 is 55.39°C, the temperature detected by the inlet thermometer 93 is 25.29°C, and the temperature detected by the outlet thermometer 95 is 27.36°C. It can be seen that the first heat dissipation module 82. The temperature of the second heat dissipation module 83 and the third heat dissipation module 84 can be dissipated by the flowing liquid.
[0051] The calorific value of the first group is as follows:
[0052] Average temperature: (45.76+50.81+55.39)/3=50.6533℃
[0053] Average water temperature: (25.29+27.36)/2=26.325℃
[0054] Average temperature difference: 50.6533-26.325=24.33℃
[0055] Calorific value: 24.33/0.0264=921.52W
[0056] Second Group:
[0057] The liquid-cooled heat dissipation structure 8 has a thermal impedance of 0.0264 (°C/W) and is heated by six heating devices to increase the temperature, wherein the temperature of the first heat dissipation module 82 is 61.15°C, and the temperature of the second heat dissipation module 83 The temperature of the third heat dissipation module 84 is 66.13°C and the temperature of the third heat dissipation module 84 is 67.61°C. In addition, the temperature detected by the inlet thermometer 93 is 39.77°C, and the temperature detected by the outlet thermometer 95 is 41.74°C. It can be seen that the first heat dissipation module 82. The temperature of the second heat dissipation module 83 and the third heat dissipation module 84 can be dissipated by the flowing liquid.
[0058] The calorific value of the second group is as follows:
[0059] Average temperature: (61.15+66.13+67.61)/3=64.963℃
[0060] Average water temperature: (39.77+41.74)/2=40.755℃
[0061] Average temperature difference: 50.6533-26.325=24.208℃
[0062] Calorific value: 24.208/0.0264=916.96W
[0063] The third group:
[0064] The liquid-cooled heat dissipation structure 8 has a thermal impedance of 0.0264 (°C/W) and is heated by six heating devices to increase the temperature, wherein the temperature of the first heat dissipation module 82 is 85.74°C, and the temperature of the second heat dissipation module 83 The temperature of the third heat dissipation module 84 is 90.16°C and the temperature of the third heat dissipation module 84 is 92.57°C, and the temperature detected by the inlet thermometer 93 is 64.28°C, and the temperature detected by the outlet thermometer 95 is 66.05°C. It can be seen that the first heat dissipation module 82. The temperature of the second heat dissipation module 83 and the third heat dissipation module 84 can be dissipated by the flowing liquid.
[0065] The calorific value of the third group is as follows:
[0066] Average temperature N: (85.74+90.16+92.57)/3=89.49℃
[0067] Average water temperature: (64.28+66.05)/2=65.165℃
[0068] Average temperature difference: 89.49-65.165=24.325℃
[0069] Calorific value: 24.208/0.0264=921.4W
[0070] Based on the above three sets of experimental data, it can be proved that the heat dissipation structure of the present invention does have a good heat dissipation effect.
[0071] The liquid-cooled heat dissipation structure provided by the present invention has the following advantages when compared with other conventional technologies:
[0072] 1. The present invention uses a heat dissipation structure with micro-channels, so that when the heat dissipation liquid passes through, it can divide the flow and continuously take away heat, so that the temperature of the plate is more uniform, and it has lower thermal resistance and better The heat dissipation effect.
[0073] 2. The present invention can control the intensity of the internal liquid heat dissipation cycle by externally controlling the inflow and outflow speed of the heat dissipation liquid.
[0074] Based on the above detailed description of the preferred embodiments, it is hoped that the characteristics and spirit of the present invention can be described more clearly, rather than limiting the scope of the present invention by the preferred embodiments disclosed above. On the contrary, the purpose is to cover various changes and equivalent arrangements within the scope of the patent application for the present invention.
