Liquid-cooled radiation structure

A heat dissipation structure and liquid cooling technology, applied in the direction of cooling/ventilation/heating transformation, electrical components, electric solid devices, etc., can solve the problems of low thermal resistance, damage, heat generation, etc., and achieve the effect of low thermal resistance and good heat dissipation effect

Inactive Publication Date: 2011-08-17
致茂电子(苏州)有限公司
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  • Abstract
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Problems solved by technology

[0002] Due to the characteristics of the components, the current high-power components (Power Device) will inevitably generate large amounts of heat. Take the Insulated Gate Bipolar Transistor (IGBT) as an example. The IGBT combines the field-effect transistor gate Easy-to-drive characteristics and bipolar transistor high current resistance and low conduction voltage drop characteristics, usually used in high-capacity power applications (such as switching power supplies, motor control, induction cooker or hundreds of amperes and six kilovolt power system field); if the IGBT is used in a switching power supply, the power is converted from AC power to the required DC power output by high-frequency switching. During the conversion process, the power components are damaged due to energy loss Heat generation, overheating will lead to performance degradation or even damage to power components
[0003] Therefore, in order to avoid overheating, the usual solution is to use heat sinks and forced air convection for direct hea

Method used

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[0034] The foregoing and other technical content, features, and effects of the present invention will be clearly presented in the following detailed description of the preferred embodiment with reference to the drawings.

[0035] See figure 1 , figure 2 , Figure 3A , Figure 3B , Figure 4A , Figure 4B and Figure 4C , Are the three-dimensional exploded structure diagram, three-dimensional combined structure diagram, three-dimensional structure diagram of heat dissipation fins, top view of the heat dissipation fins, and schematic diagram of liquid circulation heat dissipation of the liquid-cooled heat dissipation structure of the present invention. It can be seen from the figure that the liquid-cooled heat dissipation structure includes:

[0036] A base 1 has at least one liquid input pipe 11, at least one liquid output pipe 12, and at least one groove 13, and the inside of the groove 13 is respectively communicated with the liquid input pipe 11 and the liquid output pipe 12 An o...

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Abstract

The invention discloses a liquid-cooled radiation structure, which comprises a substrate and at least one radiation fins, wherein the substrate is provided with at least one liquid input pipeline, at least one liquid output pipeline and at least one groove; the inner side of the groove is communicated with the liquid input pipeline and the liquid output pipeline to form an opening respectively; in addition, the radiation fin is provided with a plate body which can be embedded into and seal the groove; and the surface of the plate body is provided with a plurality of flow deflectors which can be embedded into the groove. The flow deflectors and the groove form a plurality of runners allowing the shunting of liquid, and the liquid flowing through the liquid input pipeline and the liquid output pipeline can flow among the plurality of runners by flowing in and out of the two openings of the groove, so that continuous cyclic radiation can be realized in the substrate.

Description

technical field [0001] The present invention relates to a liquid-cooled heat dissipation structure, in particular to a heat dissipation structure with micro-channels for carrying electronic components to cool down and dissipate heat through liquid circulation. Background technique [0002] Due to the characteristics of the components, the current high-power components (Power Device) will inevitably generate large amounts of heat. Take the Insulated Gate Bipolar Transistor (IGBT) as an example. The IGBT combines the field-effect transistor gate Easy-to-drive characteristics and bipolar transistor high current resistance and low conduction voltage drop characteristics, usually used in high-capacity power applications (such as switching power supplies, motor control, induction cooker or hundreds of amperes and six kilovolt power system field); if the IGBT is used in a switching power supply, the power is converted from AC power to the required DC power output by high-frequency ...

Claims

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Application Information

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IPC IPC(8): H05K7/20H01L23/473H01L23/367
Inventor 陈基漳吴信毅林宗宪
Owner 致茂电子(苏州)有限公司
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