Manufacturing method for front electrode of crystalline silicon solar battery
A solar cell, front electrode technology, applied in circuits, electrical components, semiconductor devices, etc., can solve the problems of high sintering temperature, easy damage to silicon wafers, high price, etc., to reduce manufacturing costs, improve product quality, and reduce costs. Effect
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Embodiment 1
[0020] Step 1. Prepare indium gallium copper paste:
[0021] In a constant temperature operating table at 160°C, copper powder particles with a particle size of 2 microns to 20 microns and a purity of 99.99% are added to the indium gallium liquid alloy and stirred to form a viscous slurry. According to the mass percentage, in the entire mixture The content of copper powder is 60%;
[0022] Step 2. Preparation of selective emitter:
[0023] On the silicon wafer surface, press figure 1 The area shown is laser grooved on the silicon wafer to create a selective emitter;
[0024] Step 3. Screen printing front electrode:
[0025] Put the silicon wafer after the selective emitter preparation into the HF solution to remove the phosphosilicate glass layer, then take out the silicon wafer, and precisely print the composite paste on the figure 1 on the laser grooved area shown;
[0026] Step 3, low temperature sintering:
[0027] Put the silicon wafer into the sintering furnace and...
Embodiment 2
[0029] Step 1. Prepare indium gallium copper paste:
[0030] In a constant temperature operating table at 220°C, copper powder particles with a particle size of 2 microns to 20 microns and a purity of 99.99% are added to the indium gallium liquid alloy and stirred to form a viscous slurry. According to the mass percentage, in the entire mixture The content of copper powder is 80%;
[0031] Step 2. Preparation of selective emitter:
[0032] On the silicon wafer surface, press figure 1 The area shown is laser grooved on the silicon wafer to create a selective emitter;
[0033] Step 3. Screen printing front electrode:
[0034] Put the silicon wafer after the selective emitter preparation into the HF solution to remove the phosphosilicate glass layer, then take out the silicon wafer, and precisely print the composite paste on the figure 1 on the laser grooved area shown;
[0035] Step 3, low temperature sintering:
[0036] Put the silicon wafer into the sintering furnace and...
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