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Circuit component built-in module and manufacturing method therefor

A technology of a circuit component and a manufacturing method, which is applied to the manufacturing field of a circuit component built-in module and a circuit component built-in module, can solve the problem that the electrical conductivity of the conductive resin composition decreases, the electrical connection reliability decreases, and the compression rate decreases. and other problems, to achieve the effect of improving the reliability of heat dissipation and electrical connection

Inactive Publication Date: 2014-03-26
PANASONIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0012] On the other hand, if ceramic powder or the like is filled into the material of the substrate at a high density in order to improve thermal conductivity, the compressibility in the Z direction will be lowered, so there will be a problem that the conductivity of the conductive resin composition will be lowered. , the reliability of the electrical connection between layers is reduced
In particular, modules with built-in circuit components have a greater problem of lower compressibility in the Z direction due to the thicker insulating resin layer for built-in components compared to ordinary printed circuit boards.

Method used

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  • Circuit component built-in module and manufacturing method therefor
  • Circuit component built-in module and manufacturing method therefor
  • Circuit component built-in module and manufacturing method therefor

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0056] Next, the circuit component built-in module in Embodiment 1 of the present invention will be described.

[0057] figure 1 It is a cross-sectional configuration diagram of a module with built-in circuit components according to the first embodiment. Such as figure 1 As shown, the circuit component built-in module 100 of this embodiment includes a first substrate 101 , a second substrate 108 , and a component built-in layer 110 sandwiched between the first substrate 101 and the second substrate 108 . Substrate electrodes 102 are formed on the main surfaces of the first substrate 101 and the second substrate 108 on the component-embedded layer 110 side, respectively.

[0058] Furthermore, the component-embedded layer 110 has an electrically insulating substrate 104 as an example of the insulating substrate of the present invention, a semiconductor chip 105 and a chip component 106 disposed therein, and a substrate electrode 102 of the first substrate 101 and a substrate...

Embodiment approach 2

[0107] Next, the circuit component built-in module according to Embodiment 2 of the present invention will be described. The structure of the module with built-in circuit components of the second embodiment is basically the same as that of the first embodiment, but differs in that circuit components are embedded in internal via holes. Therefore, in this Embodiment 2, the difference from Embodiment 1 will be mainly described. In addition, about the same structure as Embodiment 1, the same code|symbol is attached|subjected.

[0108] Figure 5 It is a cross-sectional configuration diagram of a module with built-in circuit components 300 according to the second embodiment. Figure 6 It is an enlarged cross-sectional photograph of chip component 107 arranged in internal via hole 103 .

[0109] Such as Figure 5 As shown, the circuit component built-in module 300 of this embodiment includes a first substrate 101 , a second substrate 108 , and a component built-in layer 110 forme...

Embodiment 1

[0131] Example 1 is an example of producing a module with built-in circuit components by the method described in Embodiment 1. FIG.

[0132] In this example, as the liquid epoxy resin, epoxy resin (EPIKOTE828) manufactured by Nippon Epoxy Resin Co., Ltd. was used. As a solid resin, epoxy resin (1001) manufactured by Nippon Epoxy Resin Co., Ltd. was used. As the latent curing agent, a latent curing agent (2200) manufactured by Triple Bond Co., Ltd. was used. As the rubber component, an acrylic-modified resin (HTR-860P-3) produced by Teikoku Sangyo Co., Ltd. was used.

[0133] In addition, as an inorganic filler, Al 2 o 3 (Mix equal amounts of AS-20 and AS-40 produced by Showa Denko Co., Ltd.) 85% by weight, 2% by weight of liquid epoxy resin, 6% by weight of solid epoxy resin, and 6% by weight of rubber component % by weight, 0.3% by weight of the curing agent, and 0.7% by weight of the coupling agent (manufactured by Ajinomoto Co., Ltd., phthalates, 46B) were mixed.

[01...

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Abstract

The invention provides a manufacturing method for circuit component built-in modules with heat dissipation property and reliability, wherein the connection between layers are electrically connected with each other via a conductive composition. During the inner hole forming process, through holes formed on an electrically insulating substrate are arranged at the thickness direction thereof so as to form one or more inner holes for the electrical connection between layers. During the filling process, the inner holes are filled with a conductive composition. During the heating process, heating is performed so that the diameter of the central portion of the inner holes is smaller than the diameter of an opening portion thereof. During the laminating process, the two surfaces of the electrically insulating substrate are overlapped with a first substrate and a second substrate. During a pressurized heating process, the electrically insulating substrate, the first and second substrates are pressurized and heated.

Description

technical field [0001] The invention relates to a built-in module of circuit components and a manufacturing method of the built-in module of circuit components. Background technique [0002] With recent miniaturization, thinning, and multifunctionalization of electronic equipment, there has been an increasing demand for high-density mounting of electronic components mounted on printed circuit boards and improved functionality of circuit boards on which electronic components are mounted. Under such circumstances, component-embedded substrates in which electronic components are embedded in a substrate have been developed (for example, refer to Patent Document 1). [0003] In the component-embedded substrate, active components (for example, semiconductor elements) and passive components (for example, capacitors) mounted on the surface of the printed circuit board are generally embedded in the substrate, so that the area of ​​the substrate can be reduced. In addition, compared ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/56H01L23/31H01L23/14H01L25/065H05K3/46H05K3/40
CPCH01L2224/73265H01L2224/48227H01L2224/32225H01L2924/19105H01L24/73H01L2224/48091H01L2924/181H01L2924/30107H01L2924/00012H01L2924/00H01L2924/00014
Inventor 石丸幸宏林祥刚
Owner PANASONIC CORP