Inorganic particle dispersoid, energy ray-curable resin composition and film

A technology of inorganic particles and dispersions, applied in the field of dispersions, which can solve the problems of insufficient dispersion stability and no clear hardness of the cured product.

Active Publication Date: 2011-10-05
DIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the dispersion stability of the silica fine particles obtained by the method described in Patent Document 1 in the active energy ray-curable resin composition is sti...

Method used

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  • Inorganic particle dispersoid, energy ray-curable resin composition and film
  • Inorganic particle dispersoid, energy ray-curable resin composition and film
  • Inorganic particle dispersoid, energy ray-curable resin composition and film

Examples

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manufacture example 1

[0249] In a reaction device equipped with a stirring device, a cooling tube, a dropping funnel, and a nitrogen gas introduction pipe, add 250 g of glycidyl methacrylate (hereinafter referred to as GMA), and 1000 g of methyl isobutyl ketone (hereinafter referred to as MIBK) and 10 g of tert-butylperoxyethylhexanoate (hereinafter referred to as P-O), the temperature in the system was raised to about 90° C. for about 1 hour under a nitrogen flow, and kept for 1 hour. Next, from the dropping funnel previously charged with the mixed solution of 750 g of GMA and 30 g of P-O, the mixed solution was added dropwise to the system for about 2 hours under nitrogen flow, and kept at the same temperature for 3 hours. Then, the temperature was raised to 120° C., and the temperature was maintained for 2 hours. After cooling to 60°C, replace the nitrogen inlet tube with an air inlet tube, add 507g of acrylic acid (hereinafter referred to as AA), 2.3g of p-methoxyphenol (Metokinon) and 9.3g of ...

manufacture example 2

[0251] Using the same reaction apparatus as in Production Example 1, after adding 125g of GMA, 125g of methyl methacrylate (hereinafter referred to as MMA), 1000g of MIBK and 10g of P-O, the temperature in the system was raised to about 1 hour under nitrogen flow. 90°C, keep warm for 1 hour. Next, from the dropping funnel previously added the mixed solution formed by 375gGMA, 375g MMA, and 30g P-O, the mixed solution was added dropwise to the system under nitrogen flow for about 2 hours, and kept at the same temperature for 3 hours. Then, the temperature was raised to 120° C., and the temperature was maintained for 2 hours. After cooling to 60°C, the nitrogen inlet pipe was replaced with an air inlet pipe, 254g of AA, 2.3g of p-methoxyphenol, and 9.3g of triphenylphosphine were added and mixed, and the temperature was raised to 110°C with air blowing. After retaining at the same temperature for 8 hours, 1.6 g of p-methoxyphenol was added and cooled, and MIBK was added to make...

manufacture example 3

[0253] Using the same reaction device as in Production Example 1, after adding 75g GMA, 175g MMA, 1000g MIBK, and 8g P-O, the temperature in the system was raised to about 90° C. under nitrogen flow for about 1 hour, and kept for 1 hour. Then, from the dropping funnel previously added the mixed solution formed by 300g GMA, 700g MMA, and 23g P-O, the mixed solution was added dropwise to the system in about 2 hours under nitrogen flow, and kept at the same temperature for 3 hours. Then, the temperature was raised to 120° C., and the temperature was maintained for 2 hours. After cooling to 60°C, the nitrogen inlet pipe was replaced with an air inlet pipe, 152g of AA, 2.3g of p-methoxyphenol, and 5.6g of triphenylphosphine were added and mixed, and the temperature was raised to 110°C under air blowing. After maintaining at the same temperature for 8 hours, 1.6 g of p-methoxyphenol was added, cooled, MIBK was added so that the non-volatile content would be 50%, and a solution of a ...

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Abstract

The invention provides an inorganic particle dispersoid, an energy ray-curable resin composition and a film. The dispersoid of a cured product has high hardness and dispersion stability and is characterized in that the dispersoid is obtained by dispersing inorganic particles (A) for surface treatment into reactive dispersant. The inorganic particles (A) for surface treatment are obtained by treating surfaces of inorganic particles (C) with a compound (B) containing (methyl) acryloyl. The reactive dispersant is a reaction product generated during an additive reaction between monomers containing (methyl) acryloyl and carboxyl and (methyl) acrylic polymers containing epoxy radical; or a reaction product generated during an additive reaction between monomers containing (methyl) acryloyl and epoxy radical and acrylic polymers containing carboxyl (methyl) acrylic; wherein the content of the (methyl) acryloyl is 200-600, and the hydroxyl value is 90-280mg/KOH.

Description

technical field [0001] The present invention relates to a dispersion formed by dispersing surface-treated inorganic particles (A) in a reactive dispersant, and further relates to a method for producing the dispersion, a curable resin composition containing the dispersion, and the use of The composition cures the resulting film. Background technique [0002] In order to increase the hardness of a cured coating film obtained by curing the active energy ray-curable resin composition, there is a method of dispersing silica fine particles in the active energy ray-curable resin composition. Silica fine particles include colloidal silica produced by a wet process and fumed silica produced by a dry process. There are silanol groups on the surface of the silica fine particles, and the silica fine particles are hydrophilic. Therefore, the affinity with the organic phase which is a main component in compositions, such as an active-energy-ray-curable monomer and an oligomer, is poor. ...

Claims

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Application Information

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IPC IPC(8): C09D7/12C09D4/02B32B27/08
CPCC08J3/02C08J5/18C08J7/04C08J2300/00C08J2433/14C08K3/36C08K9/04C08K2201/003C08L33/14
Inventor 水口良山田雅生新井久由谷本洋一石田英之寺田浩之
Owner DIC CORP
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