Underwater solvent-free epoxy anchoring adhesive and preparation method thereof

A solvent-free, rebar-planting adhesive technology, which is applied in the field of underwater solvent-free epoxy rebar-planting adhesive and its preparation, can solve the problem that the safety and reliability cannot be guaranteed, and the pull-out strength, shear strength, and positive tensile bond strength decrease. and other problems, to achieve the effects of safety and reliability guarantee, positive tensile bond strength improvement, good wettability and toughness

Active Publication Date: 2011-10-12
长沙普照材料科技有限责任公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Underwater solvent-free epoxy planting glue can be used with water under underwater or wet conditions, and is widely used in underwater or wet environments of construction projects such as dams, tunnels, water pipes, pools, aqueducts, and civil air defense. Bonding and defect repair, but when the commonly used epoxy planting glue in China is used in a humid or water environment, because the epoxy amine curing agent reacts with water and carbon dioxide in the water or air to form carbonate, resulting in sticking The junction layer is isolated by carbonates, resulting in an extreme decrease in pull-out strength, shear strength, and positive tensile bond strength. In the reinforcement of hydraulic structures such as dams, bridges, and tunnels with water or underwater reinforcement, safety Reliability cannot be guaranteed

Method used

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  • Underwater solvent-free epoxy anchoring adhesive and preparation method thereof
  • Underwater solvent-free epoxy anchoring adhesive and preparation method thereof
  • Underwater solvent-free epoxy anchoring adhesive and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] A component, calculated in parts by weight:

[0024]

[0025] B component, calculated in parts by weight:

[0026] 1085A curing agent 52 parts

[0027] Active silica powder 47.6 parts

[0028] 0.4 parts of organic bentonite,

[0029] The first step, the preparation of component A:

[0030] Mix 45 parts of epoxy resin E44, 5 parts of epoxy resin E51, 8 parts of benzyl alcohol, 0.5 parts of KH560, 0.3 parts of BYKA 530, 0.2 parts of BYKP104S, stir well and then add 0.4 parts in sequence 5 parts of white carbon black, 5 parts of aluminum oxide, 5.6 parts of quartz sand, 25 parts of active silicon micropowder, 5 parts of calcium carbonate, then stir, stir evenly and pack after grinding and defoaming;

[0031] The second step, the preparation of component B:

[0032] Pour 52 parts by weight of 1085A curing agent into an airtight container, then pour 0.4 parts of organic bentonite and 47.6 parts of active silicon micropowder in sequence, stir evenly, grind and defoam,...

Embodiment 2

[0041] A component, calculated by weight percentage:

[0042]

[0043]

[0044] B component, calculated in parts by weight:

[0045] 1085A curing agent 48 parts

[0046] Active silica powder 50 parts

[0047] 0.2 parts of organic bentonite,

[0048] The first step, the preparation of component A:

[0049] Pour 30 parts by weight of epoxy resin E44, 13 parts of epoxy resin E51, 5 parts of benzyl alcohol, 0.75 parts of KH560, 0.1 parts of BYKA 530, and 0.1 parts of BYKP104S into the stirring and dispersing tank in sequence , Stir, stir evenly and then pour 0.4 parts of white carbon black, 12 parts of quartz sand, 2 parts of alumina, 6.5 parts of calcium carbonate, 30 parts of active silica powder, and then stir, stir evenly, Packaging after grinding and defoaming;

[0050] The second step, the preparation of component B:

[0051] Pour 48 parts by weight of 1085A curing agent into an airtight container, then pour in 0.2 parts of organic bentonite and 50 parts of activ...

Embodiment 3

[0060] A component, calculated in parts by weight:

[0061]

[0062] B component, calculated in parts by weight:

[0063] 1085A curing agent 54 parts

[0064] Active silica powder 44 parts

[0065] Organic bentonite 0.2 parts

[0066] The first step, the preparation of component A:

[0067] Pour 40 parts by weight of epoxy resin E44, 10 parts of epoxy resin E51, 3 parts of benzyl alcohol, 0.6 parts of KH560, 0.2 parts of BYKA530, and 0.20 parts of BYK P104S into the stirring and dispersing tank in sequence , Stir, stir evenly and then pour 3 parts of organic bentonite, 20 parts of active silica powder, 8 parts of calcium carbonate, 12 parts of quartz sand, 3 parts of alumina, and then stir, stir evenly and grind to eliminate Packaging after blistering;

[0068] The second step, the preparation of component B:

[0069] Pour 54 parts by weight of 1085A curing agent into an airtight container, then pour 0.2 parts of organic bentonite and 44 parts of active silica powder in...

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PUM

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Abstract

The invention provides an underwater solvent-free epoxy anchoring adhesive and a preparation method thereof. The underwater solvent-free epoxy anchoring adhesive consists of a component A and a component B in the weight percentage of 1:1, wherein the component A consists of the following components in parts by weight: 30-45 parts of epoxy resin E-44, 5-13 parts of epoxy resin E51, 3-8 parts of diluting agent, 0.5-0.75 part of coupling agent, 0.1-0.2 part of dispersant, 0.1-0.3 part of antifoaming agent, 0.4-3 parts of thixotropic agent, 20-30 parts of active micro silicon powder, 5-8 parts ofcalcium carbonate, 5.6-12 parts of quartz sand and 2-5 parts of aluminum oxide; the component B consists of the following components in parts by weight: 48-54 parts of completely-underwater epoxy curing agent 1085A, 44-50 parts of active micro silicon powder and 0.2-0.4 part of thixotropic agent; the diluting agent is benzyl alcohol; the coupling agent is ND-42 or KH 560; the dispersant is BYK P104S; the antifoaming agent is BYKA530; and the thixotropic agent is bentonite or white carbon black or a mixture of the bentonite and the white carbon black. The underwater solvent-free epoxy anchoring adhesive is prepared by mixing the prepared component A with the prepared component B in the weight ratio of 1:1.

Description

technical field [0001] The invention relates to a planting glue and a preparation method thereof, in particular to an underwater solvent-free epoxy planting glue and a preparation method thereof. Background technique [0002] Underwater solvent-free epoxy planting glue can be used with water under underwater or wet conditions, and is widely used in underwater or wet environments of construction projects such as dams, tunnels, water pipes, pools, aqueducts, and civil air defense. Bonding and defect repair, but when the commonly used epoxy planting glue in China is used in a humid or water environment, because the epoxy amine curing agent reacts with water and carbon dioxide in the water or air to form carbonate, resulting in sticking The junction layer is isolated by carbonates, resulting in an extreme decrease in pull-out strength, shear strength, and positive tensile bond strength. In the reinforcement of hydraulic structures such as dams, bridges, and tunnels with water or...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C04B26/14C04B111/72
Inventor 范明费岳峰胡铁桥赵红敏
Owner 长沙普照材料科技有限责任公司
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