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Process for producing substrate provided with metal pattern and substrate provided with metal laminate

一种金属图案、制造方法的技术，应用在带金属图案的基板的制造及带金属层叠体的基板领域，能够解决金属膜能量吸收差、难以得到高输出激光、难加工等问题

Inactive Publication Date: 2011-10-12
AGC INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, if the laser processing method described in Patent Document 1 or Patent Document 2 is directly applied to the processing of the metal film, there is a problem that it is difficult to process the metal film.
Specifically, there is a problem that, for the metal film to be processed, the region where the heat absorption efficiency of laser light is high is the ultraviolet region, but it is difficult to obtain high output laser light in the ultraviolet region.
On the other hand, if a YAG laser with a wavelength of 1064nm is used to obtain a high laser output, there is a problem that the energy absorption of the metal film is poor, and it is difficult to process unless the laser power is increased considerably.
For example, if the thickness of the metal film is more than 1 μm, there is a problem that high-precision processing cannot be performed even if the power of the laser is increased to more than 400W.

Method used

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  • Process for producing substrate provided with metal pattern and substrate provided with metal laminate
  • Process for producing substrate provided with metal pattern and substrate provided with metal laminate
  • Process for producing substrate provided with metal pattern and substrate provided with metal laminate

Examples

Experimental program
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Effect test

Embodiment approach 1

[0093] Figure 1 to Figure 7 It is a figure which shows an example of each process of the manufacturing method of the board|substrate with a metal pattern of Embodiment 1.

[0094] figure 1 It is a figure which shows an example of the process of preparing the board|substrate 10 in the manufacturing method of the board|substrate with a metal pattern of this embodiment. figure 1 The middle indicates a state in which the substrate 10 is placed and prepared. As the substrate 10 , substrates of various materials can be used, and it is preferable to use, for example, a glass substrate 10 . The glass substrate 10 is widely used as a display panel material of flat panel displays such as plasma display panels and liquid crystal panels. In the present embodiment, an example in which a glass substrate is used as the substrate 10 is described, but various substrates 10 can be used as long as the substrate 10 is resistant to heat generated during laser processing and laser irradiation a...

Embodiment approach 2

[0135] Figure 10 ~ Figure 14 It is a figure which shows an example of the manufacturing process of the manufacturing method of the board|substrate with a metal pattern of Embodiment 2.

[0136] Figure 10 It is a figure which shows an example of the process of preparing the board|substrate 10 in the manufacturing method of the board|substrate with a metal pattern of Embodiment 2. Figure 10 The process shown is the same as that in Embodiment 1 figure 1 Since the steps described in are the same as those described in , the same reference numerals are attached and their descriptions are omitted.

[0137] Figure 11 It is a figure which shows an example of the metal layer formation process of the manufacturing method of the board|substrate with a metal pattern of Embodiment 2. In the metal layer forming step, the metal layer 30 is formed on the substrate 10 . In Embodiment 1, the low-reflection layer 20 is formed on the substrate 10, but in the manufacturing method of the su...

example 1

[0151] Figure 15 (a) in (a) shows the result of Example 1. In Example 1, a copper (Cu) metal layer 30 was formed on a substrate 10 for a plasma display (PD), and laser processing was performed. The thickness of the copper metal layer 30 is As a result, it can be seen that if the metal layer 30 is copper alone, even if its surface is irradiated with a power of 74W and an energy density of 1.2J / cm 2 laser, even if its thickness is as thin as Also, the metal layer 30 could not be removed at all, so that a metal pattern could not be formed.

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Abstract

The present invention relates to a process for producing a substrate provided with a metal pattern by forming a pattern of a metal layer on a substrate using a laser light, the process including: a step of preparing a substrate in which the metal layer is formed on a surface thereof; a step of forming on the metal layer an assist layer which comprises a metal material different from that of the metal layer and which has a light absorptivity for the laser light different from that of the metal layer, thereby forming a metal laminate on the substrate; and a step of patterning the metal layer by irradiating the metal laminate with the laser light to remove a laser light-irradiated portion of the metal laminate, thereby forming a metal pattern on the substrate.

Description

technical field [0001] The present invention relates to a method of manufacturing a substrate with a metal pattern and a substrate with a metal laminate in which a metal pattern is formed using a laser. Background technique [0002] Conventionally, as a method of manufacturing a display panel for a flat panel display such as a plasma display panel, a technique of forming a transparent electrode by providing a thin film for a transparent electrode on a glass substrate and patterning the thin film for a transparent electrode by irradiating a laser beam (for example, Refer to Patent Documents 1 and 2). According to this processing method using a laser beam, compared with the photolithography process, the number of steps can be reduced, and it is not necessary to make a large photomask. In addition, the floor space can be reduced by miniaturization of the production line, reducing number of processes and stabilize the process. [0003] Patent Document 1: Japanese Patent Laid-O...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01J9/24B23K26/36H01J9/02H01J11/22H01J11/34H05K3/00H05K3/08
CPCB23K26/0006B23K26/40B23K26/361B23K2103/172H01J9/02H01J17/04H01J17/49
Inventor 牛光耀
Owner AGC INC
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