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Wood chemical copper-plating solution adopting non-aldehyde reductant and chemical copper-plating method on surface of wood

An electroless copper plating and wood surface technology, applied in liquid chemical plating, metal material coating process, coating, etc., can solve the problems of difficult activation and poor bonding strength of the plating layer, and achieve pollution reduction, high bonding strength, and bonding tight effect

Inactive Publication Date: 2011-10-26
NORTHEAST FORESTRY UNIVERSITY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The present invention aims to solve the problem that there is formaldehyde polluting the environment in the chemical copper plating solution for wood in the prior art as a reducing agent, and the activation of the chemical copper plating process for wood is difficult to control, and the bonding strength of the coating formed on the surface of wood is poor. Wood electroless copper plating bath with reducing agent and method for wood surface electroless copper plating

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  • Wood chemical copper-plating solution adopting non-aldehyde reductant and chemical copper-plating method on surface of wood
  • Wood chemical copper-plating solution adopting non-aldehyde reductant and chemical copper-plating method on surface of wood
  • Wood chemical copper-plating solution adopting non-aldehyde reductant and chemical copper-plating method on surface of wood

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specific Embodiment approach 1

[0009] Specific embodiment one: present embodiment provides a kind of wood electroless copper plating bath of non-aldehyde reducing agent, concrete composition is as follows:

[0010] The non-aldehyde reducing agent chemical copper plating solution for wood is prepared from copper sulfate, disodium edetate, glyoxylic acid, 2,2'-bipyridine, potassium ferrocyanide and water, in which acetaldehyde The mass ratio of acid to copper sulfate is 1:(1~4), the mass ratio of glyoxylic acid to disodium edetate is 1:(3~7), the mass ratio of glyoxylic acid to 2,2'-bipyridyl The mass ratio is 1:(0.5×10 -3 ~1.5×10 -3 ), the mass ratio of 2,2'-bipyridine to potassium ferrocyanide is 1: (0.5~2), and the mass-volume concentration of glyoxylic acid in the wood electroless copper plating bath of non-aldehyde reducing agent is 7 ~11g / L, the pH of the non-aldehyde reducing agent wood electroless copper plating solution is between 11~13.

[0011] The non-aldehyde reducing agent wood electroless co...

specific Embodiment approach 2

[0016] Specific embodiment two: the difference between this embodiment and specific embodiment one is: the mass ratio of described glyoxylic acid and copper sulfate is 1: (2~3), glyoxylic acid and disodium edetate The mass ratio of glyoxylic acid and 2,2'-bipyridine is 1:(4~5), and the mass ratio of glyoxylic acid is 1:(0.8×10 -3 ~1.2×10 -3 ), the mass ratio of 2,2'-bipyridine to potassium ferrocyanide is 1: (1~1.5), and the mass-volume concentration of glyoxylic acid in the wood electroless copper plating bath of non-aldehyde reducing agent is 8 ~10g / L. Others are the same as in the first embodiment.

specific Embodiment approach 3

[0017] Specific embodiment three: the difference between this embodiment and specific embodiment one or two is: the mass ratio of glyoxylic acid to copper sulfate is 9:20, and the mass ratio of glyoxylic acid to disodium edetate The mass ratio is 9:40, and the mass ratio of glyoxylic acid to 2,2'-bipyridine is 9:10 -2 , The mass ratio of 2,2'-bipyridine to potassium ferrocyanide is 1:1.25, and the mass-volume concentration of glyoxylic acid in the non-aldehyde reducing agent wood electroless copper plating bath is 9g / L. Others are the same as in the first or second embodiment.

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Abstract

The invention provides wood chemical copper-plating solution adopting the non-aldehyde reductant and a chemical copper-plating method on the surface of wood. The invention relates to the technical field of chemical copper plating on the surface of wood. The invention aims to solve the problems of the prior art that the wood chemical copper-plating solution uses formaldehyde which can pollute the environment, as reductant, the activation of the chemical copper-plating process is difficult to control and the coating formed on the surface of wood has poor bonding strength. The wood chemical copper-plating solution adopting the non-aldehyde reductant provided by the invention is prepared from copper sulfate, disodium ethylene diaminetetraacetate, glyoxalic acid, 2,2'-bipyridine, potassium ferrocyanide and water. The chemical copper-plating method on the surface of wood provided by the invention comprises the following steps: 1) performing pretreatment; and 2) performing chemical copper plating. The wood chemical copper-plating solution is mainly used in the chemical copper plating on the surface of wood.

Description

technical field [0001] The invention relates to the technical field of chemical copper plating on wood surfaces. Background technique [0002] Wood is an important renewable material widely used in construction, packaging, furniture and interior decoration. Wood has the characteristics of high strength-to-weight ratio, beautiful patterns, sound insulation, and heat preservation. But dry wood is a poor conductor of electricity. [0003] Electroless plating is an important way of metallization of non-metals. It has the characteristics of uniform coating, no need for large equipment and external electric energy, and easy to adapt to complex shapes and surface structures. Most of the prior art uses colloidal palladium activator for activation, and formaldehyde is used as reducing agent in the plating solution. However, formaldehyde will overflow into the environment during the plating process, pollute the environment and endanger the health of the staff. Although there are a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C18/40C23C18/30
Inventor 王立娟李坚孙丽丽冯昊
Owner NORTHEAST FORESTRY UNIVERSITY