Novel printed circuit board (PCB) manufacturing technology
A technology for PCB circuit boards and manufacturing methods, applied in multilayer circuit manufacturing, printed circuit manufacturing, printed circuit, etc., can solve problems such as harm, waste of copper resources, low utilization rate, etc., achieve huge social benefits, promote development, and enrich The effect of economic benefits
Inactive Publication Date: 2013-11-06
BEIJING TIANYI RUNDA TECH DEV
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Problems solved by technology
[0002] Judging from the current method of circuit board production, there are discharges of waste water, waste liquid and waste gas, as well as leftover materials, waste materials and unqualified products in the production process, which cause serious damage to the environment and ecological balance, and even permanent damage. , the manufacture of circuit boards with various substrates requires a certain thickness of copper foil on the substrate, and it is corroded by acid and alkali to form a circuit
Most of the copper foil is not used, and the utilization rate is extremely low, even less than 5%, which is a great waste of copper resources
Method used
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[0022] Operation of metal substrates:
[0023] 1. Insulation layer treatment
[0024] 1. Screen-print the insulating and heat-conducting material on the metal substrate, put it in an oven for semi-curing, the temperature is 120°C-140°C, and the time does not exceed 15 minutes.
[0025] 2. Put it into a hot press and press it for 15 minutes at a temperature of 145°C.
[0026] 2. Bonding lines
[0027] 1. Screen-print the circuit primer on the insulating layer, then print the composite conductive powder on the primer, and put it in an oven for 5 minutes at a temperature of 140°C.
[0028] 2. Put it into the press for 15 minutes at a temperature of 145°C.
[0029] Aluminum substrates, copper substrates, and iron substrates are suitable for this method of operation.
[0030] Non-metal based operations:
[0031] 1. Bonding lines
[0032] 1. Screen-print the circuit primer on the substrate, then print the composite conductive powder on the primer, and put it in an oven for 5 m...
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The invention discloses a printed circuit board (PCB) manufacturing technology which aims to thoroughly solve the problem that pollution is generated when circuit boards are manufactured at present and completely omit the production of circuit board base materials. The PCB manufacturing technological process comprises substrate blanking, drilling, insulation treatment, circuit bonding, solder-proof ink silk-screening, finished product detection, electrical testing and packaging. Compared with the traditional technology, the technology disclosed by the invention has the advantages of 1) short technological process: the technological process is 1 / 2 of the traditional technological process, thus facilitating management so as to greatly improve the production efficiency; 2) environment-friendly manufacturing technology: electrochemical treatment technology, acid-alkaline etching technology and alkaline solder mask imaging technology in the traditional technology are omitted, thereby realizing green manufacturing technology; 3) energy conservation, consumption reduction and reduced investment of equipment: the process is short and facilitates management, equipment cost and management cost are greatly reduced, for example, the high temperature sintering equipment for a ceramic circuit board is not required, and one million tons of copper coil materials can be saved every year; and 4) avoidance of the copper cladding manufacturing technology for all substrates.
Description
technical field [0001] "A manufacturing method for PCB circuit boards" completely solves the pollution problems caused by current circuit board production. It is a cross-technology containing new materials and new methods. It is a revolutionary method reform that will bring huge social benefits. Benefits and rich economic benefits can effectively promote the development of the electronics industry. Background technique [0002] Judging from the current method of circuit board production, there are discharges of waste water, waste liquid and waste gas, as well as leftover materials, waste materials and unqualified products in the production process, which cause serious damage to the environment and ecological balance, and even permanent damage. , The manufacture of circuit boards with various substrates requires a certain thickness of copper foil on the substrate, and the circuit is formed by acid and alkali corrosion. Most of the copper foil is not used, and the utilization...
Claims
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IPC IPC(8): H05K3/00H05K3/10H05K3/46
Inventor 秦玉行张京平
Owner BEIJING TIANYI RUNDA TECH DEV