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Semiconductor devices and integrated semiconductor devices

A semiconductor and device technology, applied in the field of semiconductor devices and integrated semiconductor devices, to achieve the effect of reducing the number of terminals

Inactive Publication Date: 2011-12-14
SONY CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This will bring the following problems during the manufacturing stage: the layered chip semiconductor device of the multilayer semiconductor device is measured separately during the test

Method used

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  • Semiconductor devices and integrated semiconductor devices
  • Semiconductor devices and integrated semiconductor devices
  • Semiconductor devices and integrated semiconductor devices

Examples

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no. 1 example

[0030][Typical structure of an integrated semiconductor device]

[0031] figure 1 A typical structure of an integrated semiconductor device 100 as a first embodiment of the present invention is schematically shown. The integrated semiconductor device 100 includes (N+1) chips from a 0th chip 200 - 0 to an Nth chip 200 -N. exist figure 1 In , it is shown that the 0th chip 200-0 to the Nth chip 200-N are connected in a multi-layer manner. Each of the 0th chip 200 - 0 to the Nth chip 200 -N is an independent semiconductor device. Because these chips are made with the same process, they have the same structure. In the first embodiment, it can be assumed that each chip 200 is functionally a DRAM (Dynamic Random Access Memory), but is not limited to this function.

[0032] A typical structure of a single chip 200 consists of figure 1 The schematic structure indication of the 0th chip 200-0 in . The chip 200 has the following terminals: (N+1) chip selection signal input term...

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Abstract

The invention provides a semiconductor device and a semiconductor integrated device. The semiconductor device includes: a semiconductor identifier holding section configured to hold a semiconductor identifier for identifying the semiconductor device; and a control section configured so that once a predetermined period of time elapses after receiving an external input instruction to hold the semiconductor identifier, The part issues an instruction to hold the semiconductor identifier of the semiconductor device immediately downstream to the semiconductor device immediately downstream of the semiconductor device, and issues an instruction to hold the semiconductor identifier thereof at the same time as receiving the external input instruction. During the time period between the time points of the semiconductor devices succeeding downstream, the control section causes the semiconductor identifier holding section to hold the externally input identifier.

Description

technical field [0001] The present invention relates to semiconductor devices and integrated semiconductor devices. More particularly, the present invention relates to a semiconductor device having a circuit structure for supporting testing at the time of manufacture and an integrated semiconductor device. Background technique [0002] An integrated semiconductor device such as a multilayer semiconductor device formed by stacking semiconductor chips in multiple layers has a plurality of chip select terminals for individually controlling configured semiconductor chips. In many cases, an appropriate number of chip select terminals is provided in order to address layered semiconductor chips. It is therefore necessary to increase the number of chip select terminals in proportion to the increase in the number of layers of the semiconductor chip. [0003] Techniques for determining which of a plurality of chip select terminals to use on a semiconductor device are known. Regardi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G11C8/00
CPCG11C29/48G11C16/20G11C2029/4402H01L2224/16145H01L2224/48091H01L2924/15311H01L2924/00014
Inventor 岛田学黑田真实
Owner SONY CORP