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Wide thermal hysteresis tininb shape memory alloy memory ring and its preparation method and application

A memory alloy and memory alloy wire technology are used in memory alloy fastened connection, wide thermal hysteresis TiNiNb shape memory alloy memory ring and its preparation fields, which can solve the problem that reliability and safety are difficult to be guaranteed, and mechanical connection technology is difficult to achieve. , low service life and other issues, to achieve significant weight reduction effect, small footprint, good sealing effect

Inactive Publication Date: 2011-12-28
沈阳天贺新材料开发有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] At present, the connection of wires, pipes and cables mainly adopts mechanical connection. This method is not only inconvenient to operate, but also has a low service life, and it is difficult to guarantee reliability and safety.
Especially in communication technology and signal devices, it is often encountered that thin-walled metals are sealed with thin-walled metals, ceramics, and plastics, and traditional mechanical connection processes are difficult to achieve

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] The machined size of the memory ring and the size of the diameter expansion directly affect the tightness of the subsequent memory ring and the connected pipe. Generally, the inner diameter of the memory ring after machining is smaller than 2%-4% of the outer diameter of the connected pipe; the inner diameter of the memory ring after expansion is larger than 2%-4% of the outer diameter of the connected pipe. Taking the external connecting pipe Φ10.0mm as an example, the preparation process of the memory ring is as follows:

[0034] 1. Melting

[0035] 1) The raw materials are titanium sponge, nickel plate and niobium bar, and its components are calculated by atomic ratio: Ti-44, Ni-47.6, Nb-8.4 are smelted by vacuum ultra-pure smelting technology;

[0036] 2) Homogenize the alloy composition, and keep the ingot at 850°C for 5 hours;

[0037] 3) Forged into a Φ8mm bar at 800°C;

[0038] 4) Heat turning at 700℃ to form Φ6.5mm wire;

[0039] 5) 700°C hot drawing into Φ...

Embodiment 2

[0047] The outer connecting pipe is a hexagonal pipe with a circumference of 336 mm and a memory ring with a diameter of Φ1.0 mm in section as an example.

[0048] 1. Melting

[0049] 1) The raw materials are titanium sponge, nickel plate and niobium bar, and its components are calculated by atomic ratio: Ti-44, Ni-47.4, Nb-8.6 are smelted by vacuum ultra-pure smelting technology;

[0050] 2) Homogenize the alloy composition, and keep the ingot at 850°C for 5 hours;

[0051] 3) Forged into a Φ8mm bar at 800°C;

[0052] 4) Heat turning at 700℃ to form Φ6.5mm wire;

[0053] 5) 700°C hot drawing into Φ1.0mm wire.

[0054] 2. Preparation of memory ring

[0055] 1) Winding: Wind the Φ1.0mm wire into a hexagon with a circumference of 323mm, and weld it with micro-beam plasma welding equipment;

[0056] 2) Diameter expansion: under the condition of -60°C, use a tapered diameter expansion rod to expand the diameter of the memory ring through mechanical extrusion. Coat the expand...

Embodiment 3

[0061] Take a rectangular memory ring with a diameter of Φ28.50mm and a cross-sectional shape of 8mm×0.5mm as an example.

[0062] 1. Melting

[0063] 1) The raw materials are titanium sponge, nickel plate and niobium bar, and its components are calculated by atomic ratio: Ti-44, Ni-47.2, Nb-8.8 are smelted by vacuum ultra-pure smelting technology;

[0064] 2) Homogenize the alloy composition, and keep the ingot at 850°C for 5 hours;

[0065]3) Forged into a Φ8mm bar at 800°C;

[0066] 4) Hot rolling at 700°C into a plate of 8mm×0.5mm.

[0067] 2. Preparation of memory ring

[0068] 1) Winding: Wind the 8mm×0.5mm plate into a ring with an inner diameter of Φ27.70mm, and weld it with micro-beam plasma welding equipment;

[0069] 2) Diameter expansion: under the condition of -60°C, use a tapered diameter expansion rod to expand the diameter of the memory ring through mechanical extrusion. Coat the expanding rod with dry film lubricant, and apply low-temperature grease and p...

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Abstract

A wide thermal hysteresis TiNiNb shape memory alloy memory ring and its preparation method and application, characterized in that the alloy components of the memory ring are Ti: 42-47; Ni: 44-49; Nb: 6-14; the preparation method is : 1) Melting: Melting by vacuum ultra-pure smelting technology; 2) Homogenization treatment: 700-1000°C, time 3-6h; 3) Forging at 700-900°C; 4) Hot drawing at 400-750°C Wire is required; 5) The wire is wound into a ring and welded by micro-beam plasma welding technology; 6) The diameter is expanded under the condition of -60°C. The memory ring prepared by the present invention has the characteristics of high connection strength, small space occupation, light weight, and convenient installation. It can be used for storage and transportation at -190°C-+60°C ambient temperature, and can be used at -60°C-+ after fastening. Keep fastening without loosening in the range of 200°C.

Description

technical field [0001] The invention relates to a memory alloy fastening connection technology, in particular to a wide thermal hysteresis TiNiNb shape memory alloy memory ring and its preparation method and application, belonging to the technical field of new metallurgical materials. Background technique [0002] At present, the connection of wires, pipes and cables is mainly by mechanical connection. This method is not only inconvenient to operate, but also has a low service life, and it is difficult to guarantee reliability and safety. Especially in communication technology and signal devices, it is often encountered that the sealing of thin metal walls and metal, ceramics, and plastic thin walls is difficult to achieve by traditional mechanical connection processes. [0003] Therefore, researching and developing a suitable connection technology for wires, pipes and cables is one of the key issues to be solved urgently in this industry in recent years. Contents of the i...

Claims

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Application Information

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IPC IPC(8): C22C30/00C22C1/02B23P15/00
Inventor 高淑春裴峰胡金玲胡毅钧高原黄国静
Owner 沈阳天贺新材料开发有限公司
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