Weight and pressure reducing compacting method of copper-clad plate
A copper-clad laminate and drop-pressing technology, which is applied in the field of copper-clad laminate manufacturing, can solve problems such as residual internal stress of copper-clad laminates, and achieve the effects of reducing internal stress, improving dimensional stability, and reducing warpage probability
Active Publication Date: 2012-01-11
GOLDENMAX INTERNATIONAL TECHNOLOGY (ZHUHAI) LTD
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Problems solved by technology
[0008] The purpose of the present invention is to solve the problem of residual internal stress in copper clad laminates. By adjusting the way of pressing, the two residual internal stresses in the plate can be released, especially for polymer resin polymerization stress can be stretched and released, thereby improving Sheet flatness and dimensional stability
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[0017] combine figure 2 Shown, the weight-reducing drop pressure pressing method that the present embodiment provides is in the process of resin polymerization again in pressing, that is, in high temperature, high pressure stage (i.e. figure 2 After 180°C, enter the stage of 205°C), periodically reduce the pressure to the set value, such as 8kg / cm 2 , so that the polymer molecules can be stretched, and the internal stress can be released. Then, the pressure can be increased to the process pressure. After repeated several times, the internal stress in the plate will be effectively released, such as figure 2 As shown, the design of the present embodiment reduces the weight and falls three times.
[0018] The steps of using a press to press copper clad laminates mainly include: pushing the assembled laminated sheet into the press; closing the mold and closing the press door; starting the pressing program, and the system automatically vacuumizes. In this embodiment, after the...
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The invention discloses a weight and pressure reducing compacting method of a copper-clad plate. The method comprises steps of: (1) a compacting process with a temperature from low to high gradually and an increasing pressure; (2) a compacting process after a temperature continuously rises to a rated high value and a pressure continuously rises to a rated high value; (3) a compacting process with a temperature reducing from the rated high value to a low value and a pressure reducing from the rated high value to a low value, wherein, in the compacting process in step (2), reducing the pressure to a preset low value and returning to the rated high pressure is repeated more than twice. According to the weight and pressure reducing compacting method provided by the invention, the pressure is reduced to a preset low value repeatedly during a traditional high temperature and high pressure compacting process, so as to release stress continuously and reduce internal stress of a sheet material. Copper-clad plate produced by the method of the invention has better sheet material planarization, greatly reduced warping probability and obviously improved dimension stability.
Description
technical field [0001] The invention relates to the field of manufacturing copper-clad laminates, in particular to the press molding technology of copper-clad laminates. Background technique [0002] The basic skeleton of electronic and electrical products is the PCB board, and the PCB is built on the basis of copper clad laminates (hereinafter referred to as: copper clad laminates), and is formed by printing circuit processes such as drilling, electroplating, circuit pattern transfer, etching, and solder mask. . With the rapid development of electronic technology, various assembly technologies are changing with each passing day, and the assembly density of components per unit area is getting higher and higher. Especially in terms of packaging modules and BGA technology, higher requirements are put forward for the flatness and dimensional stability of PCB. Requirements, which correspondingly require that the basic material of the PCB board, the copper clad laminate, has the...
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Login to View More IPC IPC(8): B32B37/10B32B37/06
Inventor 马憬峰
Owner GOLDENMAX INTERNATIONAL TECHNOLOGY (ZHUHAI) LTD