Integrated cooling system of high-power amplifier using waveguide space synthesis method

A space synthesis and amplifier technology, which is applied to waveguide devices, semiconductor devices, semiconductor/solid-state device components, etc., can solve problems such as the ineffective elimination of heat dissipation, the increase of the total heat of the amplifier, and the unguaranteed reliability, etc., to achieve a small structure , improve life, improve the effect of heat dissipation characteristics

Inactive Publication Date: 2012-01-11
杨健
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Problems solved by technology

With the increase of the output power of the amplifier unit, the heat generated by it will also increase greatly, and the total heat generated by the entire amplifier will also increase to a level that cannot be effectively eliminated by traditional heat dissipation methods
In this way, each power amplifier unit will work at a very high temperature, resulting in a greatly reduced system life and reliability cannot be guaranteed

Method used

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  • Integrated cooling system of high-power amplifier using waveguide space synthesis method
  • Integrated cooling system of high-power amplifier using waveguide space synthesis method
  • Integrated cooling system of high-power amplifier using waveguide space synthesis method

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Embodiment Construction

[0026] exist figure 1 Among them, the amplifier 1 based on coaxial space synthesis introduced in the background technology is composed of the following parts: input coaxial joint 2, input coaxial tapered waveguide 3, middle synthetic coaxial waveguide 4, output coaxial tapered waveguide 5, output Coaxial connector 6, and two pairs of clamps 7. The central composite coaxial waveguide is fixed by two pairs of clamps. At the same time, the heat generated inside the central composite coaxial waveguide is first conducted to the outer surface of the central coaxial waveguide, then to the clamp, and then dissipated to the air through the heat sink on the clamp. middle. And because the feedthrough capacitor 8 that provides power for the internal amplifier of the coaxial cavity is located at the center of the card 9 forming the central coaxial waveguide, the clamps can only be placed at both ends of the central waveguide. And because the internal amplifier unit is located in the midd...

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Abstract

The invention relates to a novel cooling design for a space synthesis amplifier, which is characterized in that a heat pipe or a high-heat-conducting-factor material is implanted into the card of the amplifier to reduce the thermal impedance of the card; and at the same time, a cooling system for liquid refrigeration is directly implanted into the amplifier to improve the cooling capacity of the system. By using the novel cooling structure in the design of the high-power amplifier, the miniaturization of the system is realized, the internal temperature of the system can be effectively reduced and the service life of the system is improved.

Description

Technical field [0001] The patent of this invention relates to a heat dissipation system design technology for high power amplifiers, which can be widely used in microwave and millimeter wave systems. Background technique [0002] The space combining power amplifier using the waveguide structure has the advantages of large number of combining units and high combining efficiency, and is suitable for high power combining. As the requirements for the total output power gradually increase, the output power of the amplifier units used in the synthesis structure also requires high output power, especially for high-power broadband amplifiers, the efficiency of each amplifier unit is relatively high. Low. As the output power of the amplifier unit increases, the heat generated by it will also increase greatly, and the total heat generated by the entire amplifier will also increase to a level that cannot be effectively eliminated by traditional heat dissipation methods. In this way,...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01P5/12H01L23/367H01L23/373H01L23/427
Inventor 杨健
Owner 杨健
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