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Machine cabinet, machine cabinet radiating system and movable data center

A heat dissipation system and cabinet technology, applied in the computer field, can solve problems such as low heat dissipation efficiency, rising internal temperature of equipment, dead heat dissipation angles, etc., and achieve the effects of improving heat dissipation efficiency, increasing density, and reducing interconnection lines

Active Publication Date: 2013-06-05
LENOVO (BEIJING) LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Under the current cooling method, the entire computer room or the layout area is mostly air-cooled and circulated for refrigeration. The cooling capacity is limited, and it is difficult to increase the density of the equipment in the cabinet. If the density increases, the internal temperature of the equipment will rise sharply, and effective cooling cannot be achieved.
[0006] The heat dissipation method is open, the noise is loud, and the air cooling will have local turbulence and heat dissipation dead angle, the heat dissipation efficiency is also low, and the heat dissipation effect is poor

Method used

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  • Machine cabinet, machine cabinet radiating system and movable data center
  • Machine cabinet, machine cabinet radiating system and movable data center
  • Machine cabinet, machine cabinet radiating system and movable data center

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0064] Embodiment 1. A cabinet, such as figure 2 shown, including:

[0065] a backplane perpendicular to the top and bottom surfaces of the cabinet and parallel to the front and rear of the cabinet;

[0066] The backboard divides the cabinet into two spaces, front and rear, respectively the first and second spaces;

[0067] At least one first socket for an operable computing system to be connected to is arranged on the first surface of the backplane, wherein when the operable computing system is connected to the first socket, the operable a computing system is located within the first space;

[0068] At least one second socket for an operable computing system to be connected to is arranged on the second surface of the backplane, wherein when the operable computing system is connected to the second socket, the operable a computing system is located within the second space;

[0069] Both the left side and the right side of the cabinet have vents, and the vents are used for ...

Embodiment 2

[0074] Embodiment 2. A cooling system for a cabinet, comprising:

[0075] At least one cabinet housing multiple operational computing systems;

[0076] The cabinet includes a backplane perpendicular to the top and bottom surfaces of the cabinet and parallel to the front and back of the cabinet; the backplane divides the cabinet into two spaces, the front and the back, respectively the first and second spaces ;

[0077] At least one first socket for an operable computing system to be connected to is arranged on the first surface of the backplane, wherein when the operable computing system is connected to the first socket, the operable a computing system is located within the first space;

[0078] At least one second socket for an operable computing system to be connected to is arranged on the second surface of the backplane, wherein when the operable computing system is connected to the second socket, the operable a computing system is located within the second space;

[00...

Embodiment 3

[0110] Embodiment 3, a mobile data center, comprising:

[0111] a container;

[0112] at least one cabinet housing a plurality of operable computing systems mounted within the container, wherein the cabinet includes a backplane perpendicular to the top and bottom surfaces of the cabinet and parallel to the front and rear of the cabinet; The backboard divides the cabinet into two spaces, front and rear, respectively the first and second spaces;

[0113] At least one first socket for an operable computing system to be connected to is arranged on the first surface of the backplane, wherein when the operable computing system is connected to the first socket, the operable a computing system is located within the first space;

[0114] At least one second socket for an operable computing system to be connected to is arranged on the second surface of the backplane, wherein when the operable computing system is connected to the second socket, the operable a computing system is locat...

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Abstract

The invention provides a machine cabinet, a machine cabinet radiating system and a data center. The machine cabinet radiating system comprises at least one machine cabinet in which a plurality of operable computation systems are installed and a first liquid cooling exchanger, wherein the machine cabinet comprises a back plate which is vertical to the top surface and the bottom surface of the machine cabinet and is parallel to the front surface and the rear surface of the cabinet; the back plate is used for partitioning the machine cabinet into a front space and a rear space which mean a firstspace and a second space respectively; both the left side surface and the right side surface of the machine cabinet are provided with a vent hole; the vent holes are used for air inflow or air outflow; and the first liquid cooling exchanger is positioned on the left side or the right side of a first machine cabinet in the machine cabinet in which the plurality of operable computation systems are installed and is used for feeding cooled airflow into the vent holes of the first machine cabinet. By the machine cabinet, the machine cabinet radiating system and the data center, the radiating efficiency can be improved.

Description

technical field [0001] The invention relates to the field of computers, in particular to a cabinet, a cooling system for the cabinet and a movable data center. Background technique [0002] There are more and more servers installed in the computer room or data center, and more servers are required to be installed in the cabinet, that is, a high-density cabinet layout is required, and as many cabinets as possible can be installed in the limited space of the computer room. In this way, high-density cluster equipment will generate a lot of heat, and the heat dissipation of the system has become the biggest challenge for high-density clusters. If the heat dissipation problem cannot be effectively solved, the high density of the cluster cannot be achieved. [0003] Multiple servers (or other equipment) are placed in the existing cabinet, and each server is placed at different heights; the heat dissipation method is as follows: figure 1 As shown, the server is placed in the cabi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06F1/20H05K7/20
Inventor 崔吉顺
Owner LENOVO (BEIJING) LTD
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