Interlayer assembly for connecting Si3N4 ceramics and method
A connection method and ceramic technology, applied in the field of ceramic welding materials, can solve the problems of poor room temperature and high temperature performance of ceramics, achieve stable performance, improve room temperature strength and high temperature strength, and be easy to obtain
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Embodiment 1
[0020] 1. Selection of middle layer components:
[0021] 1. The components of amorphous solder foil 2 are: Ti: 40.0%; Zr: 25%; B: 0.2%; the rest is Cu; the total mass percentage is 100%, and the thickness is 40μm. product.
[0022] 2. The copper foil 3 is an industrial-grade product with a purity of 99.9% and a thickness of 70 μm.
[0023] 2. Connection steps and methods:
[0024] (1) Si to be connected 3 N 4 The end face of ceramic 1 is polished with 3.5um diamond abrasive paste, and the amorphous solder foil 2 and copper foil 3 are polished with No. 5 metallographic sandpaper before connection; then they are placed in acetone for ultrasonic cleaning for 10 minutes;
[0025] (2) The cleaned amorphous solder foil 2, copper foil 3, Si 3 N 4 Ceramic 1 by Si 3 N 4 Ceramic 1, amorphous solder foil 2, copper foil 3, amorphous solder foil 2, Si 3 N 4 The ceramics are tightly assembled in the special brazing fixture; at the same time, a small weight is placed on the weldmen...
Embodiment 2
[0029] 1. Selection of middle layer components:
[0030] 1. The components of amorphous solder foil 2 are: Ti: 45.0%; Zr: 20%; B: 0.3%; the rest is Cu; the total mass percentage is 100%, and the thickness is 45 μm. product.
[0031] 2. The copper foil 3 is an industrial-grade product with a purity of 99.9% and a thickness of 120 μm.
[0032] 2. Connection steps and methods:
[0033] (1) Si to be connected 3N 4 The end face of the ceramic sample is polished with 3.5um diamond abrasive paste, and the amorphous solder foil 2 and copper foil 3 are polished with No. 5 metallographic sandpaper before connection; then they are placed in acetone for ultrasonic cleaning for 10 minutes;
[0034] (2) The cleaned amorphous solder foil 2, copper foil 3, Si 3 N 4 Ceramic 1 by Si 3 N 4 Ceramic 1, amorphous solder foil 2, copper foil 3, amorphous solder foil 2, Si 3 N 4 The ceramics 1 are sequentially fitted tightly in the special brazing fixture; at the same time, a small weight is...
Embodiment 3
[0038] 1. Selection of middle layer components:
[0039] 1. The composition and content of amorphous solder foil 2 are as follows: Ti: 42.0%; Zr: 30%; B: 0.1%; the rest is Cu; the total mass percentage content is 100%, and the thickness is 35 μm. level products.
[0040] 2. The copper foil 3 is an industrial-grade product with a purity of 99.9% and a thickness of 100 μm.
[0041] 2. Connection steps and methods:
[0042] (1) Si to be connected 3 N 4 The end face of the ceramic sample is polished with 3.5um diamond abrasive paste, and the amorphous solder foil 2 and copper foil 3 are polished with No. 5 metallographic sandpaper before connection; then they are placed in acetone for ultrasonic cleaning for 10 minutes;
[0043] (2) The cleaned amorphous solder foil 2, copper foil 3, Si 3 N 4 Ceramic 1 by Si 3 N 4 Ceramic 1, amorphous solder foil 2, copper foil 3, amorphous solder foil 2, Si 3 N 4 The ceramics 1 are assembled tightly in the special brazing fixture in seq...
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