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Interlayer assembly for connecting Si3N4 ceramics and method

A connection method and ceramic technology, applied in the field of ceramic welding materials, can solve the problems of poor room temperature and high temperature performance of ceramics, achieve stable performance, improve room temperature strength and high temperature strength, and be easy to obtain

Inactive Publication Date: 2013-11-06
JIANGSU UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the invention is to solve the current problem of brazing Si 3 N 4 Ceramics have problems such as poor room temperature and high temperature performance, and provide a connection Si 3 N 4 Ceramic interlayer assembly and method

Method used

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  • Interlayer assembly for connecting Si3N4 ceramics and method

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] 1. Selection of middle layer components:

[0021] 1. The components of amorphous solder foil 2 are: Ti: 40.0%; Zr: 25%; B: 0.2%; the rest is Cu; the total mass percentage is 100%, and the thickness is 40μm. product.

[0022] 2. The copper foil 3 is an industrial-grade product with a purity of 99.9% and a thickness of 70 μm.

[0023] 2. Connection steps and methods:

[0024] (1) Si to be connected 3 N 4 The end face of ceramic 1 is polished with 3.5um diamond abrasive paste, and the amorphous solder foil 2 and copper foil 3 are polished with No. 5 metallographic sandpaper before connection; then they are placed in acetone for ultrasonic cleaning for 10 minutes;

[0025] (2) The cleaned amorphous solder foil 2, copper foil 3, Si 3 N 4 Ceramic 1 by Si 3 N 4 Ceramic 1, amorphous solder foil 2, copper foil 3, amorphous solder foil 2, Si 3 N 4 The ceramics are tightly assembled in the special brazing fixture; at the same time, a small weight is placed on the weldmen...

Embodiment 2

[0029] 1. Selection of middle layer components:

[0030] 1. The components of amorphous solder foil 2 are: Ti: 45.0%; Zr: 20%; B: 0.3%; the rest is Cu; the total mass percentage is 100%, and the thickness is 45 μm. product.

[0031] 2. The copper foil 3 is an industrial-grade product with a purity of 99.9% and a thickness of 120 μm.

[0032] 2. Connection steps and methods:

[0033] (1) Si to be connected 3N 4 The end face of the ceramic sample is polished with 3.5um diamond abrasive paste, and the amorphous solder foil 2 and copper foil 3 are polished with No. 5 metallographic sandpaper before connection; then they are placed in acetone for ultrasonic cleaning for 10 minutes;

[0034] (2) The cleaned amorphous solder foil 2, copper foil 3, Si 3 N 4 Ceramic 1 by Si 3 N 4 Ceramic 1, amorphous solder foil 2, copper foil 3, amorphous solder foil 2, Si 3 N 4 The ceramics 1 are sequentially fitted tightly in the special brazing fixture; at the same time, a small weight is...

Embodiment 3

[0038] 1. Selection of middle layer components:

[0039] 1. The composition and content of amorphous solder foil 2 are as follows: Ti: 42.0%; Zr: 30%; B: 0.1%; the rest is Cu; the total mass percentage content is 100%, and the thickness is 35 μm. level products.

[0040] 2. The copper foil 3 is an industrial-grade product with a purity of 99.9% and a thickness of 100 μm.

[0041] 2. Connection steps and methods:

[0042] (1) Si to be connected 3 N 4 The end face of the ceramic sample is polished with 3.5um diamond abrasive paste, and the amorphous solder foil 2 and copper foil 3 are polished with No. 5 metallographic sandpaper before connection; then they are placed in acetone for ultrasonic cleaning for 10 minutes;

[0043] (2) The cleaned amorphous solder foil 2, copper foil 3, Si 3 N 4 Ceramic 1 by Si 3 N 4 Ceramic 1, amorphous solder foil 2, copper foil 3, amorphous solder foil 2, Si 3 N 4 The ceramics 1 are assembled tightly in the special brazing fixture in seq...

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Abstract

The invention discloses an interlayer assembly for connecting Si3N4 ceramics and a method. The interlayer assembly comprises two sheets of amorphous brazing material foil and a sheet of copper foil, wherein, the amorphous brazing foil and the copper foil are appressed and assembled in a way that the sheet of copper foil is arranged between the two sheets of amorphous brazing material foil. The method provided in the invention is as follows: Si3N4 ceramic samples to be connected and an interlayer assembly are rubbed, polished and cleaned; one Si3N4 ceramic, one sheet of amorphous brazing material foil, the sheet of copper foil, another sheet of amorphous brazing material foil and another Si3N4 ceramic are sequentially appressed and assembled, and then are put in a vacuum furnace for soldering. The invention enables high-temperature strength of a connector to be improved and has the advantages of a simple process and convenient implementation.

Description

technical field [0001] The present invention relates to a Si 3 N 4 The connection of ceramics, more specifically, involves a connection of Si 3 N 4 The ceramic intermediate layer component and method belong to the field of ceramic welding materials. Background technique [0002] Si 3 N 4 Ceramic is a kind of promising engineering structural ceramic material, its main application fields are heat engine, wear-resistant parts and heat exchanger, etc. It is an important material for manufacturing new ceramic engines. With Si 3 N 4 With the wide application of ceramic materials, people pay more and more attention to Si 3 N 4 Ceramic / Si 3 N 4 Research on ceramic (metal) connections. Active brazing technology has become the preferred technology for metal / ceramic connection due to its simple process, high connection strength, good repeatability of results, wide adaptability of joint size and shape, and relatively low cost. And a lot has been achieved. The biggest disad...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C03B37/00
Inventor 邹家生许祥平高飞严铿
Owner JIANGSU UNIV OF SCI & TECH