Photovoltaic inverter IGBT (Insulated Gate Bipolar Transistor) heat-dissipating structure

A photovoltaic inverter, heat dissipation structure technology, applied in photovoltaic power generation, conversion of irreversible DC power input to AC power output, cooling/ventilation/heating transformation, etc. Problems such as low heat conduction efficiency, to achieve the effect of increasing circuit design cost and use cost, good heat dissipation effect, and improving efficiency

Inactive Publication Date: 2012-02-15
郑州朗睿科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In order to reduce the installation space occupied by the boost and inverter circuits and reduce the cost of use, the power circuit of the existing photovoltaic inverter uses the metal plating of the PCB board to conduct the IGBT heat to the heat sink. Since the heat conduction efficiency of the PCB board is not high, If it is necessary to design an external fan for active cooling, it is necessary to increase the fan variable speed control circuit, which increases the circuit design cost and use cost

Method used

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  • Photovoltaic inverter IGBT (Insulated Gate Bipolar Transistor) heat-dissipating structure
  • Photovoltaic inverter IGBT (Insulated Gate Bipolar Transistor) heat-dissipating structure
  • Photovoltaic inverter IGBT (Insulated Gate Bipolar Transistor) heat-dissipating structure

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Embodiment 1

[0019] Embodiment one: see figure 1 , figure 2 . The photovoltaic inverter IGBT heat dissipation structure of the present invention includes one or several IGBT power elements 1 and a PCB board 2, the IGBT power element adopts a patch type IGBT, and the one or several IGBTs are welded on the PCB board, the present invention The difference from the prior art is: based on the characteristics that the source of the IGBT power element needs to be connected, the corresponding square hole 4 is designed on the PCB board corresponding to the source of the IGBT power element, and the size of the inlay in the square hole matches the square hole The corresponding copper block 3 , the source of the IGBT power element is connected to the copper block, and the other side of the copper block is closely connected to the shell of the radiator 5 .

Embodiment 2

[0020] Embodiment two: see figure 1 , figure 2 . The photovoltaic inverter IGBT heat dissipation structure of this embodiment is different from Embodiment 1 in that in order to improve the heat dissipation efficiency of the IGBT and make full use of the heat dissipation area of ​​the PCB board, two sides of the PCB board at the surrounding positions of each square hole on the PCB board 2 The side surface is evenly coated with a metal plating layer 6, and through holes 7 communicating with the two sides of the PCB board are provided at the place where the metal plating layer is applied.

Embodiment 3

[0021] Embodiment three: see figure 1 , figure 2 , the photovoltaic inverter IGBT heat dissipation structure of this embodiment is different from Embodiment 1 or Embodiment 2 in that the copper block 3 is stepped, and the thickness of the copper block 3 is 1 to 3 mm thicker than the PCB board. The size and height of the small steps match the thickness of the PCB, and the large steps on the copper block are 1-3mm larger than the small steps.

[0022] In the heat dissipation structure of the photovoltaic inverter IGBT of the present invention, the metal coating is a tin coating. The copper block 3 is pushed into the square hole 4 on the other side of the PCB 2 and welded on the metal plating 6 . The other side of the copper block 3 is connected to the casing of the radiator 5 of the photovoltaic inverter by tight crimping. The IGBT power element conducts heat to the casing radiator through the metal copper block, reducing the heat loss of the IGBT power element. The efficien...

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Abstract

The invention relates to a power element and a circuit board heat-dissipating structure thereof, in particular to a photovoltaic inverter IGBT (Insulated Gate Bipolar Transistor) heat-dissipating structure. The photovoltaic inverter IGBT heat-dissipating structure comprises an IGBT power element and a PCB (Printed Circuit Board), a surface-mounted IGBT is adopted as the IGBT power element, and is soldered on the PCB, a position on the PCB, which corresponds to the source of the IGBT power element, is designed into a corresponding square hole on the basis of the connection characteristic needed by the source of the IGBT power element, a copper block, the size of which is matched with the square hole, is embedded in the square hole, the source of the IGBT power element is connected with the copper block, and the other side of the copper block is tightly connected with a heat sink. The photovoltaic inverter IGBT heat-dissipating structure takes account of both the heat-dissipating efficiency of the IGBT and the design cost of the PCB, the copper block embedded between the source of the IGBT and the case heat sink is utilized to increase the heat-dissipating efficiency of the IGBT, and the photovoltaic inverter IGBT heat-dissipating structure can help to simplify the circuit of the PCB, optimize the design and reduce the overall design and use cost of a photovoltaic inverter.

Description

technical field [0001] The invention relates to a power element and its circuit board heat dissipation structure, in particular to a photovoltaic inverter IGBT heat dissipation structure. Background technique [0002] At present, in photovoltaic inverters, it is more common to use boost and inverter circuits based on IGBT power devices. Photovoltaic inverters require higher power IGBTs, but the selection of power tube installation and heat dissipation methods is more critical. In order to reduce the installation space occupied by the boost and inverter circuits and reduce the cost of use, the power circuit of the existing photovoltaic inverter uses the metal plating of the PCB board to conduct the IGBT heat to the heat sink. Since the heat conduction efficiency of the PCB board is not high, If it is necessary to design an external fan for active cooling, it is necessary to add a variable speed control circuit for the fan, which increases the cost of circuit design and use. ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H02M7/48H05K7/20
CPCY02E10/56
Inventor 刘晓霞赵金璞许斌
Owner 郑州朗睿科技有限公司
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