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Photo-sensitivity resin composition

A technology of photosensitive resin and composition, which is applied in the direction of optics, optomechanical equipment, instruments, etc., can solve the problems of photosensitive resin composition without metal adhesion, insufficient hardness, low yield, etc., and achieve good metal adhesion, high Hardness, the effect of avoiding low yield

Active Publication Date: 2012-03-21
DAXIN MATERIALS
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the photosensitive resin composition generally used as a dielectric layer or protective layer does not have good metal adhesion, and often scratches due to insufficient hardness during the manufacturing process, thus causing a problem of low yield

Method used

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  • Photo-sensitivity resin composition

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Embodiment Construction

[0019] The invention provides a photosensitive resin composition which has good adhesion to metal and high hardness. Therefore, the photosensitive resin composition of the present invention can be applied in the touch panel manufacturing process. After exposure and development, it is formed as a dielectric layer between the metal electrodes to improve the adhesion between the dielectric layer and the metal electrodes. Avoid the peeling phenomenon of the dielectric layer and the metal electrode, or form a protective layer covering the metal electrode, so as to avoid the problem of low yield caused by scratching of the protective layer during the manufacturing process.

[0020] The photosensitive resin composition of the present invention comprises (A) a polymer having three or more co-blocks, (B) a monomer having at least one ethylenically unsaturated double bond, (C) having at least one reactive acrylic functional group Polyurethane resin oligomers, (D) inorganic additives mod...

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Abstract

The invention provides a photo-sensitivity resin composition which comprises: (A) a polymer with more than three common blocks, (B) a monomer with at least one ethylenic unsaturated double bond, (C) a polyurethane resin oligomer with at least one reactive acrylic functional group, (D) an inorganic additive modified through the surface of organic silane, (E) organic acid anhydride, (F) a photoinitiator, (G) a functional silane coupling agent, and (H) an organic solvent, wherein each of the common blocks comprises: (A-1) an ethylenic unsaturated monomer containing an acid group, and (A-2) ethylenic unsaturated monomers except (A-1). On the basis of total weight of the photo-sensitivity resin composition, the content of (C) is between 1 weight percent and 20 weight percent.

Description

technical field [0001] The invention relates to a photo-sensitivity resin composition, in particular to a photo-sensitivity resin composition with good metal adhesion and high hardness. Background technique [0002] In order to achieve more convenience, smaller size and more user-friendly, the input methods of many information products have changed from traditional keyboards or mice to touch-sensitive devices. The touch-sensitive device can be assembled on various types of flat-panel displays, so that the flat-panel displays can display images and input operation information. As far as current common touch devices are concerned, capacitive touch panels and resistive touch panels are the most popular. [0003] In a common touch panel manufacturing process, a photosensitive resin composition (photoresist) is usually used as a dielectric layer between metal electrodes or a protective layer covering the metal electrodes. Therefore, the above-mentioned photosensitive resin comp...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/075G03F7/027G06F3/041
Inventor 郭昭辉邱启峰谢育材游哲彦
Owner DAXIN MATERIALS