Substrate cooling apparatus

A technology for cooling devices and substrates, applied in transportation and packaging, electrical components, semiconductor/solid-state device manufacturing, etc., can solve problems such as ineffective cooling, weak air flow, and inability to effectively take away substrates, so as to improve cooling efficiency and improve The effect of velocity

Inactive Publication Date: 2012-03-21
DAINIPPON SCREEN MTG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When the unit that blows out the air flow uses a fan filter unit with a HEPA filter to supply downdraft air to the substrate being conveyed, the air flow is weak, and the flow velocity of the air flow along the surface of the substrate is almost zero, so it cannot effectively carry the substrate. Take the heat of the substrate and cannot effectively cool
In addition, in the method of blowing the curtain-shaped compressed air from the slit-shaped nozzle to the substrate being conveyed, the heat of the substrate is taken away only at the moment when the air flow touches the substrate, and thereafter, the air flow diffuses to the surroundings, so it is difficult to effectively uniform cooling

Method used

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no. 1 approach

[0045] figure 1 It is a side view which shows the structure of the main part of the board|substrate cooling apparatus 1 which concerns on 1st Embodiment of this invention. exist figure 1 In each of the following figures, in order to clarify the directional relationship in the figures, the XYZ rectangular coordinate system with the Z-axis direction as the vertical direction and the XY plane as the horizontal plane is appropriately marked. In addition, in figure 1 In the drawings and the following figures, the dimensions of each part are exaggerated as necessary for easy understanding.

[0046] The substrate cooling apparatus 1 of the present invention is an apparatus for cooling a heat-processed substrate W (in this embodiment, a rectangular glass substrate for a liquid crystal display device) while conveying it. First, the overall schematic configuration of the substrate cooling device 1 will be described. The main structure of the substrate cooling device 1 includes a rol...

no. 2 approach

[0081] Next, a second embodiment of the present invention will be described. Figure 7 It is a figure which shows the board|substrate cooling apparatus of 2nd Embodiment. The substrate cooling apparatus according to the second embodiment is also an apparatus for cooling the heated substrate W while conveying it. In the first embodiment, the airflow forming mechanism 60 is constituted by the exhaust box 70 and the blower nozzle 80 , but in the second embodiment, the blower nozzle 80 is not provided, and the airflow forming mechanism 60 is constituted by only the exhaust box 70 . In other respects, the substrate cooling device of the second embodiment has the same structure as that of the first embodiment, and the same members as those of the first embodiment are Figure 7 marked with the same reference numerals.

[0082] In the substrate cooling apparatus of the second embodiment, since the blower nozzle 80 is not provided, an air flow is formed in the gas flow path 25 only b...

no. 3 approach

[0087] Next, a third embodiment of the present invention will be described. Figure 8 It is a figure which shows the board|substrate cooling apparatus of 3rd Embodiment. exist Figure 8 In , the same members as those in the first embodiment are given the same reference numerals. The substrate cooling apparatus according to the third embodiment is also an apparatus for cooling the heated substrate W while conveying it.

[0088] In the third embodiment, as in the first embodiment, the air flow forming mechanism 60 is constituted by the exhaust box 70 and the blower nozzle 80 . However, in the third embodiment, the exhaust port 71 and the exhaust box 70 are provided not at the central portion of the wind tunnel portion 20 but near the exit-side end portion. In addition, a pair of upper and lower buckets 50 is provided only at the entrance-side end of the wind tunnel 20 , and the blower nozzle 80 is provided only near the entrance-side buckets 50 . In other respects, the subst...

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Abstract

The present invention provides a substrate cooling apparatus for carrying a substrate and synchronously effectively and uniformly cooling the inside of the substrate surface. The periphery of the carrying path of the substrate (W) formed surrounding a roller carrying mechanism (10) is provided with a wind tunnel unit (20) with both ends open, a gas flow path (25) with both end portions open is formed at the inner side cavity unit of the wind tunnel unit (20) through arranging bucket shaped units (50) at both ends of the wind tunnel unit (20), the central portion in the carrying direction of the wind tunnel unit (20) is provided with an exhaust box (70), and at the periphery of the both ends of the gas flow path there is provided a blower nozzle (80). An air flow is formed inside the gas flow path (25) through blowing air the gas flow path (25) from the blower nozzle (80). Through carrying the heated substrate (W) along the gas flow path, the cooling processing is performed.

Description

technical field [0001] The present invention relates to cooling treatment of thin-plate precision electronic substrates (hereinafter simply referred to as "substrates"), such as heated glass substrates for liquid crystal display devices, glass substrates for PDPs, semiconductor wafers, substrates for storage disks, and substrates for solar cells. Substrate cooling device. Background technique [0002] In the above-mentioned processing step of the substrate, for example, after the substrate coated with a processing liquid such as photoresist is heated to form a film, the substrate is appropriately cooled. Conventionally, the method of cooling a heated substrate generally adopts a method of mounting the substrate on a water-cooled metal cooling plate. In addition, in recent years, in order to improve productivity, the heated substrate is cooled while being conveyed by conveyance rollers cooled by cold coal. Such a substrate cooling device is disclosed in Patent Document 1, f...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/00H01L21/02H01L21/677
CPCH01L21/67011
Inventor 中根慎悟佐藤隆行芳谷光明福原文人山冈英人安陪裕滋石川利治
Owner DAINIPPON SCREEN MTG CO LTD
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