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Cutting machining technology for semi-hole plate provided with copper plating holes at plate edges

A processing technology and technology of copper-plated holes, applied in the direction of electrical components, printed circuit manufacturing, printed circuits, etc., can solve problems such as copper deficiency, poor tin intake, and inability to completely eliminate copper warping, so as to reduce scrap, reduce complaints, Eliminate the effect of copper deficiency on the hole wall

Active Publication Date: 2012-03-21
GULTECH WUXI ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] (1) After etching, the PTH half hole on the edge of the board cannot completely eliminate the copper warping phenomenon, and it still needs to spend a small amount of manpower to deal with the copper warping
[0007] (2) After cutting, a small part of the copper will be pulled off, that is, the phenomenon of copper deficiency, which will easily cause bad tin eating

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] Embodiment 1: A kind of cutting processing technology of half-hole plate with copper-plated holes on the edge of the plate, comprising the following process steps:

[0020] (1) Drilling deep holes: Insert the drill bit with a diameter of 2.9mm used for drilling pin holes into the tool holder, start the molding machine, and drill a deep hole with a depth of 4mm on the bakelite board of the molding machine;

[0021] (2) Drilling large holes: Place a pulp board on the bakelite board after the deep hole is drilled in step (1). The four sides of the pulp board are fixed with the bakelite board. On the knife seat, start the forming machine, drill a large hole in the pulp board, the depth of the large hole is 9mm;

[0022] (3) Groove: Firstly, use a milling cutter to cut the edge of the pulp board in a clockwise direction to obtain a groove body. A distance of 0.3mm is reserved between the path of the milling cutter and the outline of the groove body. The milling cutter The d...

Embodiment 2

[0026] Embodiment 2: A kind of processing technology of half-hole plate cutting with copper-plated holes on the edge of the plate, comprising the following process steps:

[0027] (1) Drilling deep holes: Insert the drill bit with a diameter of 3mm used for drilling pin holes into the tool holder, start the molding machine, and drill a deep hole with a depth of 3mm on the bakelite board of the molding machine;

[0028] (2) Drilling large holes: Place a piece of pulp board on the bakelite board after the deep hole is drilled in step (1). The four sides of the pulp board are fixed with the bakelite board. On the knife seat, start the forming machine, drill a large hole in the pulp board, the depth of the large hole is 9mm;

[0029] (3) Groove fishing: firstly, use a milling cutter to cut the edge of the pulp board in a clockwise direction to obtain a groove body, and keep a distance of 0.2mm between the path of the milling cutter and the outline of the groove body, and the milli...

Embodiment 3

[0033] Embodiment 3: A kind of processing technology of half-hole plate cutting with copper-plated holes on the edge of the plate, comprising the following process steps:

[0034] (1) Drilling deep holes: Insert the drill bit with a diameter of 2.95mm used for drilling pin holes into the tool holder, start the molding machine, and drill a deep hole with a depth of 4mm on the bakelite board of the molding machine;

[0035] (2) Drilling large holes: place a piece of pulp board on the bakelite board after the deep hole is drilled in step (1). On the knife seat, start the forming machine, drill a large hole in the pulp board, the depth of the large hole is 9mm;

[0036] (3) Groove: Firstly, use a milling cutter to cut the edge of the pulp board in a clockwise direction to obtain a groove body. A distance of 0.2 mm is reserved between the path of the milling cutter and the outline of the groove body. The milling cutter The diameter of the milling cutter is 0.8mm; then the milling ...

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Abstract

The invention relates to a cutting machining technology for a semi-hole plate provided with copper plating holes at plate edges. The cutting machining technology is characterized by comprising the following technology steps: inserting a drill bit used for drilling pin holes on a cutter holder, starting a forming machine, and drilling deep holes in an electric wood plate of the forming machine; placing a pulp plate on the electric wood plate, fixing four edges of the pulp plate with the electric wood plate, inserting the drill bit used for drilling large holes on the cutter holder, and drilling the large holes in the pulp plate; carrying out cutting machining on the pulp plate to fish out a groove body; selecting pins, inserting the pins on four corners of the pulp plate, sheathing a printed circuit plate, and hitting the pins well; taking out a shaft printed circuit plate to be sheathed on the pins, fixing four edges of the printed circuit plate by masking tape; and carrying out cutting machining on the plate edges of the printed circuit plate. With the cutting machining technology implemented, the requirements on the quality of a semi-hole plate provided with PTHs (plated though hole) at the plate edges can be guaranteed, waste of unqualified products and the complaints of clients are reduced, and the creditworthiness on client terminals is promoted.

Description

technical field [0001] The invention relates to a method for half-hole cutting and processing of a copper-plated hole (PTH) on a printed circuit board by using a forming machine, and belongs to the field of cutting and processing of printed circuit boards. technical background [0002] With the development trend of thinner, integrated and multi-functional consumer electronic products, the design of printed circuit boards is becoming more and more diversified. In the printed circuit board design of consumer electronics products such as mobile phones, digital and Bluetooth headsets, there are more PTH half-hole designs on the board side. [0003] The general processing program for PTH semi-hole plate cutting on the edge of the printed circuit board is designed to select a milling cutter that is as large as the slot width or smaller than the slot width, and cut along the contour. [0004] The edge PTH semi-hole plate cutting processing method on the printed circuit board is th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00
Inventor 孙守军
Owner GULTECH WUXI ELECTRONICS CO LTD
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