Polyacetal resin composition

Abstract

Disclosed is a polyacetal resin composition which exhibits excellent rigidity, heat distortion temperature, heat conductivity and moldability, while having low specific gravity and low ash content. Specifically disclosed is a polyacetal resin composition which contains, per (a) 100 parts by weight of a polyacetal resin, (b) 10-150 parts by weight of a cellulose powder having an average particle diameter of 5-70 [mu]m, (c) 0.01-3 parts by weight of a hindered phenolic antioxidant, and (d) 0.01-3 parts by weight of at least one nitrogen-containing compound that is selected from among amino triazine compounds, guanamine compounds, hydrazide compounds and polyamides.

Description

technical field [0001] The present invention relates to a polyacetal resin composition that is excellent in rigidity, heat distortion temperature, thermal conductivity, and moldability, and does not cause an increase in specific gravity or ash content during incineration. Background technique [0002] Polyacetal resins have excellent properties in terms of mechanical properties, thermal properties, electrical properties, sliding properties, and moldability, and are widely used mainly as structural materials or mechanical parts in electrical equipment, automobile parts, precision machine parts, etc. As the field of polyacetal resin is used expands, the required properties tend to be more sophisticated, complex, and specialized. [0003] For example, in order to increase the strength and rigidity of polyacetal resin and increase the heat distortion temperature, the method of adding reinforcing materials such as glass-based inorganic filler materials is generally used, but the ...

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Problems solved by technology

However, in this method, the mixing of the polyacetal resin and the pulp tends to be insufficient, and it is difficult to obtain stable and excellent characteristics, so it is not suitable for practical use.

In addition, Japanese Unexamined Patent Publication No. 3-217447 does not disclose at all the improvement of the thermal conductivity and molding processability of the polyacetal resin composition.

[0005] In addition, the invention described in Japanese Patent Application Laid-Open No. 3-28260 improves the thermal stability of polyacetal resin by adding a small amount of stabilizer selected from microcrystalline cellulose and cellulosic cellulose to polyacetal resin. In this invention, the improvement of the rigidity, heat distortion temperature, thermal conductivity, molding processability, etc. of the polyacetal resin composition has not been achieved.

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