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Iridium plating solution and electroplate method thereof

A technology of electroplating solution and compound, which is applied in the field of iridium electroplating solution and its electroplating, and can solve problems such as unsatisfactory electrical characteristics

Inactive Publication Date: 2012-04-04
ELECTROPLATING ENGINEERS OF JAPAN LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When a thick iridium plating film is formed in this way, the formation of cracks in the conventional iridium plating solution becomes particularly significant, and the electrical characteristics may not be satisfied.

Method used

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  • Iridium plating solution and electroplate method thereof
  • Iridium plating solution and electroplate method thereof
  • Iridium plating solution and electroplate method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] In this Example 1, the case where Fe is added to the iridium plating solution will be described. The electroplating solution of this embodiment 1 is composed as follows:

[0027] Sodium hexabromoiridate(III)

[0028] 15g / L (converted to metal iridium)

[0029] Boric acid 40g / L

[0030] Disodium malonate 0.02mol / L

[0031] Iron sulfate heptahydrate 0.01g / L (converted to metallic iron)

[0032] In Example 1, as the iridium compound, a compound obtained by adding disodium malonate as a "dicarboxylate" to the above-mentioned sodium hexabromoiridate(III) and storing it in a hot bath at 85°C was used. It was obtained by stirring with a magnetic stirrer for 1 hour. Iron sulfate heptahydrate was added to the iridium electroplating solution so that the electroplating solution contained 0.01 g / L of Fe.

[0033] Next, a gold strike plating treatment was performed on a 2 cm×2 cm brass test piece, and after the gold plating treatment with a thicknes...

Embodiment 2

[0039] In this Example 2, the case where Co is added to the iridium plating solution will be described. The electroplating solution of this embodiment 2 is composed as follows:

[0040] Sodium hexabromoiridate(III)

[0041] 15g / L (converted to metal iridium)

[0042] Boric acid 40g / L

[0043] Disodium citrate 0.05mol / L

[0044] Cobalt sulfate heptahydrate 0.5g / L (converted to metal cobalt)

[0045] In Example 2, as the iridium compound, a compound obtained by adding disodium citrate as a "hydroxycarboxylate" to the above-mentioned sodium hexabromoiridate (III) and storing it in a hot bath at 85°C was used. It was obtained by stirring with a magnetic stirrer for 1 hour. Cobalt sulfate was added to this iridium plating solution so that 0.5 g / L of Co was contained in the plating solution.

[0046] Next, a gold strike plating treatment was performed on a 2 cm×2 cm brass test piece, and after the gold plating treatment with a thickness of 1.0 μm, an iridium ...

Embodiment 3

[0052] In this Example 3, the case where Ni is added to the iridium plating solution will be described. The electroplating solution of this embodiment 3 is composed as follows:

[0053] Sodium hexabromoiridate(III)

[0054] 15g / L (converted to metal iridium)

[0055] Boric acid 40g / L

[0056] Oxalic acid 0.05mol / L

[0057] Nickel sulfate hexahydrate 0.5g / L (converted to metallic nickel)

[0058] In Example 3, as the iridium compound, a compound obtained by adding oxalic acid as "dicarboxylic acid" to the above-mentioned sodium hexabromoiridate (III) and stirring it magnetically while storing it in a hot bath at 85°C was used. obtained by stirring for 1 hour. Nickel sulfate hexahydrate was added to the iridium plating solution so that 0.5 g / L of Ni was contained in the plating solution.

[0059] Next, a gold strike plating treatment was performed on a 2 cm×2 cm brass test piece, and after the gold plating treatment with a thickness of 1.0 μm, an iridium ...

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Abstract

The invention discloses an iridium plating solution capable of forming an iridium electroplate film easily to intensively inhibit generation of cracks, and an electroplate method thereof. An iridium compound iridium plating solution employed by the invention is obtained by adding more than one compound selected from saturated monocarboxylic acid, saturated monocarboxylate, saturated dicarboxylic acid, saturated dicarboxylate, saturated hydroxy carboxylic acid, saturated hydroxy-carboxylate, amide and urea into an iridium (III) complex salt containing halogen as anions and stirring well. The iridium plating solution is characterized by comprising at least one selected from Fe, Co, Ni and Cu.

Description

technical field [0001] The invention relates to an iridium electroplating solution and an electroplating method thereof. Background technique [0002] Iridium is a metal that has high hardness and exhibits good corrosion resistance against high-concentration acids, aqua regia, or halogens. Moreover, its range of applications includes not only decorations but also curing agents or catalysts for specific metals, and it is widely used industrially as anti-corrosion materials and materials for contacts and the like. [0003] As the iridium electroplating liquid when using this iridium, the following iridium electroplating liquid is known: to the iridium (III) complex salt whose anion component is a halogen, add the selected from saturated monocarboxylic acid, saturated monocarboxylic acid salt, saturated dicarboxylic acid, One or more compounds of saturated dicarboxylate, saturated hydroxycarboxylic acid, saturated hydroxycarboxylate, amide, and urea are stirred, and the result...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/54
Inventor 伊东正浩
Owner ELECTROPLATING ENGINEERS OF JAPAN LTD
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