Electromagnetic oven without microlite board

Abstract

The invention relates to an electromagnetic oven without a microlite board. The electromagnetic oven comprises a base and a control panel, wherein a thermal-insulation cover is arranged on the base, and a certain distance is reserved between the thermal-insulation cover and the base, thereby together forming an electrical apparatus assembly cavity; a pan lining assembly is arranged at the concave of the thermal-insulation cover; and the pan lining assembly is hung at the outer edge of the thermal-insulation cover. Compared with the prior art, the electromagnetic oven provided by the invention has the following beneficial effects: 1) the thermal-insulation cover is additionally arranged on the base and used for replacing the microlite board, so as to reduce the cost, and the thermal-insulation cover can play roles in thermal insulation and effective positioning of the pan lining assembly, thereby solving the problems that the electromagnetic oven in the prior art has a poor cooking effect, the pan lining assembly is easily moved during operation, and the like; and 2) by means of a spring, a sensor penetrates through the central hole of the thermal-insulation cover, abuts against the lower part of a pan lining, and directly induces the internal temperature of the pan lining, thus accurate temperature control is realized, and the competitiveness of the product in the market is realized, and the electromagnetic oven without the microlite board has the characteristics of simple and reasonable structure, high heat utilization efficiency, long service life and convenience for processing and manufacturing.

Description

technical field [0001] The invention relates to an electromagnetic cooker, in particular to an electromagnetic cooker without a microcrystalline plate. Background technique [0002] Chinese Patent Document No. CN101113928Y disclosed a temperature sensor structure of an induction cooker on January 30, 2008, which includes a microcrystalline plate, a thermistor, etc., and is characterized in that: the copper plate and the thermistor form a temperature sensor, It can be in close contact with the stainless steel pot, so as to accurately detect the temperature in the pot, and install a heat insulation layer between the microcrystalline plate and the coil. It is said that due to the close contact between the temperature sensor and the bottom of the stainless steel pot, the temperature control of this structure is very precise, so as to realize the intelligent control of cooking without oil fume and stewing rice. The current induction cooker cannot accurately detect the temperature...

AI Technical Summary

Problems solved by technology

However, the cooking pot (stainless steel pot) in this structure is directly placed on the microcrystalline plate for operation, so it cannot be effectively positioned, and it is easy to move and cause some safety hazards, which is not convenient for users to operate. At the same time, the cost of the microcrystalline plate is relatively high. Restricted the promotion and application of products

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