Silicon-based power device structure based on substrate bias technology
A technology for power devices and substrates, applied in semiconductor devices, electrical components, circuits, etc., can solve the problems of small safe working area, difficult manufacturing process, and low reliability.
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[0045] By adopting the silicon-based power device structure based on the substrate bias technology of the present invention, a power device with high breakdown voltage and low conduction loss with excellent performance can be obtained, especially a high-voltage silicon-based power device of 600V-1200V can be realized. The silicon-based high-voltage device structure based on the substrate bias technology provided by the present invention includes a buried layer silicon-based power device structure based on the substrate bias technology ( Figure 6 and Figure 7 ), D-RESURF silicon-based power device structure based on substrate bias technology ( Figure 8 ) and variable doped silicon-based power device structure based on substrate bias technology ( Figure 9 ). The silicon-based device structure based on substrate bias technology can be combined with surface termination technology to form a variety of device structures. These termination technologies and structures are field ...
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