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Imidazole compound-containing microcapsulated composition, curable composition using same, and masterbatch type curing agent

A curable composition and compound technology, which is applied in the field of masterbatch-type curing agent and curable composition, can solve the problems of increased compounding frequency, reduced operating efficiency, and limited effective use of the composition, and achieves excellent low-temperature curability , high solvent stability, and high storage stability

Inactive Publication Date: 2012-04-11
ASAHI KASEI E-MATERIALS CORPORATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the compounding frequency increases, the work efficiency decreases, and the effective use amount of the composition is limited.

Method used

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  • Imidazole compound-containing microcapsulated composition, curable composition using same, and masterbatch type curing agent
  • Imidazole compound-containing microcapsulated composition, curable composition using same, and masterbatch type curing agent
  • Imidazole compound-containing microcapsulated composition, curable composition using same, and masterbatch type curing agent

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0234] Dissolve 30.0 g (239.67 mmol, manufactured by Shikoku Chemicals Co., Ltd.) of 1-aminoethyl-2-methylimidazole in 600 mL of acetonitrile, and add dropwise 17 mL of ( 105.92 mmol, Wako Pure Chemical Industries, Ltd.) 1,6-hexamethylene diisocyanate. During the dropwise addition, a white solid started to form and became a slurry. After the dropwise addition, the mixture was stirred at room temperature for 3 hours, and the resulting white solid was collected by filtration and dried under reduced pressure to obtain 41.67 g (yield 94%) of an imidazole compound represented by the following formula (6). The obtained imidazole compound was identified by proton nuclear magnetic resonance spectrum and infrared absorption spectrum. In addition, the low-molecular-weight amine compound present together with the imidazole compound represented by the formula (6) was quantified by the method of the above-mentioned (3) using HPLC.

[0235]

[0236] The obtained white solid was pulveri...

Embodiment 2

[0240] Dissolve 30.0 g (239.67 mmol, manufactured by Shikoku Chemicals Co., Ltd.) of 1-aminoethyl-2-methylimidazole in 600 mL of acetonitrile, and add dropwise 81 mL of ( 235.74 mmol, manufactured by Wako Pure Chemical Industries, Ltd.) n-octadecyl isocyanate. After the dropwise addition, the mixture was stirred at room temperature for 3 hours, and the resulting white solid was collected by filtration and dried under reduced pressure to obtain 93.21 g (yield 94%) of an imidazole compound represented by the following formula (7). The obtained imidazole compound was identified by proton nuclear magnetic resonance spectrum and infrared absorption spectrum. In addition, the low-molecular-weight amine compound present together with the imidazole compound represented by the formula (7) was quantified by the method of the above-mentioned (3) using HPLC.

[0241]

[0242] The obtained white solid was pulverized in the same manner as in Example 1 to obtain a finely powdered imidazo...

Embodiment 3

[0244] Dissolve 30.0 g (239.67 mmol, manufactured by Shikoku Chemicals Co., Ltd.) of 1-aminoethyl-2-methylimidazole in 600 mL of acetonitrile, and add dropwise 30 mL of ( 237.28 mmol, manufactured by Tokyo Chemical Industry Co., Ltd.) cyclohexyl isocyanate. After the dropwise addition, the mixture was stirred at room temperature for 3 hours, and the resulting white solid was collected by filtration and dried under reduced pressure to obtain 55.24 g (yield 93%) of an imidazole compound represented by the following formula (8). The obtained imidazole compound was identified by proton nuclear magnetic resonance spectrum and infrared absorption spectrum. In addition, the low-molecular-weight amine compound present together with the imidazole compound represented by the formula (8) was quantified by the method of the above-mentioned (3) using HPLC.

[0245]

[0246] The obtained white solid was pulverized in the same manner as in Example 1 to obtain a finely powdered imidazole ...

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Abstract

Disclosed are a composition which exhibits excellent curability at low temperatures, high storage stability and high solvent stability when formed into a curing agent for epoxy resins, or the like; a curing agent for epoxy resins using the composition; and an epoxy resin composition. Specifically disclosed is an imidazole compound-containing microcapsulated composition which contains a core that contains an imidazole compound represented by formula (1) and a shell that contains an organic polymer and / or an inorganic compound and covers the surface of the core. (In the formula, R1, R2 and R3 each independently represents a hydrogen atom, a halogen group, an optionally substituted alkyl group having 1-20 carbon atoms, an optionally substituted aromatic group, an optionally substituted alkoxy group having 1-20 carbon atoms or an optionally substituted phenoxy group; Q represents an optionally substituted divalent hydrocarbon having 1-20 carbon atoms; m represents an integer of 1-100; Z represents an organic group having a valence of m; and Y represents a urea bond, a thiourea bond, an amide bond or a thioamide bond represented by formula (G).)

Description

technical field [0001] The present invention relates to a microencapsulated imidazole compound having a specific structure, a curable composition using the same, and a masterbatch type curing agent. Background technique [0002] Epoxy resins are used in a wide range of applications such as coatings, electrical and electronic insulating materials, and adhesives because their cured products have excellent mechanical properties, electrical properties, thermal properties, chemical resistance, and adhesive properties. Currently, an epoxy resin composition generally used is a two-component epoxy resin composition in which two components, an epoxy resin and a curing agent, are mixed at the time of use. The two-component epoxy resin composition can be cured even at room temperature, but on the other hand, since the epoxy resin and the curing agent are stored separately before use, and each compound is measured and mixed as needed immediately before use, it is very difficult to comp...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G59/40C07D233/61C08G59/50C08L63/00C09D7/12C09D163/00C09J11/06C09J163/00
CPCC09K2200/0247C08G59/4014C09K3/10C09D11/52C09K2200/0647C09D5/24C07D233/61C08L63/00C08G59/40C08K9/10
Inventor 伊藤畅浩下田晃义山本久尚
Owner ASAHI KASEI E-MATERIALS CORPORATION
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