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Solder-coated component, process for producing same, and method for mounting same

An installation method and solder technology, applied in the direction of electrical components, manufacturing tools, welding/cutting media/materials, etc., can solve the problems of reduced reliability, poor solderability, poor solder wettability, etc., and achieve bending resistance and tensile resistance Excellent deepness and the effect of improving solder wettability

Active Publication Date: 2014-09-03
SENJU METAL IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When mounting the case element with such a surface treatment on the substrate, the solder was applied only to the substrate side, and no solder was applied to the case element side. When observing the mounting state, the overall amount of solder was small. Solder wettability is poor, so the current situation is that it is difficult to form soldering problems such as fillets that meet the requirements during surface mounting.
[0012] iv. In addition, it is considered to perform molten solder coating on the soldering surface of the shielding shell, but because the copper-zinc-nickel alloy and stainless steel used in the shielding shell have poor solderability, it is necessary to use a strong active flux for molten solder coating
In this method, even if cleaning is performed after soldering, highly corrosive residue tends to remain, reducing reliability

Method used

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  • Solder-coated component, process for producing same, and method for mounting same
  • Solder-coated component, process for producing same, and method for mounting same
  • Solder-coated component, process for producing same, and method for mounting same

Examples

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no. 1 Embodiment approach

[0052] figure 1 The shield case 100 shown as the first embodiment constitutes an example of a solder-applied component, and is used for electromagnetically shielding electronic components (not shown) mounted on the printed circuit board 10 . Here, the solder-coated component refers to a metal component such as a shield case that has been subjected to a surface treatment in which a nickel film and a tin alloy film of a predetermined thickness are sequentially provided on a metal component such as a shield case, and Lead-free molten solder is coated on this tin-plated alloy film. In the present invention, the base material refers to the forming material of the shield case and the like, and the base material is also composed of metal member materials such as iron and Kovar, in addition to copper-zinc-nickel alloy and stainless steel.

[0053] In addition, the predetermined nickel film refers to a nickel film having a film thickness of 0.3 μm to 2.0 μm, more preferably a film thi...

no. 2 Embodiment approach

[0092] Next, refer to Figure 7 A shield case 200 as a second embodiment will be described. Figure 7 The shield case 200 shown constitutes an example of a solder-applied component, and is used to electromagnetically shield electronic components (not shown) mounted on the printed circuit board 10 as in the first embodiment. The shield case 200 is constituted by a cover member 12 and a frame member 21 whose main structure is reinforced. The frame member 21 has a width W2 of about 38 mm, a length L2 of about 60 mm, and a height H2 of about 2 mm, as in the first embodiment. The frame member 21 is soldered on the printed circuit board 10 . As the printed circuit board 10, the printed circuit board described in the first embodiment is used.

[0093] In the shield case 200, the main structure of the inner side of the frame member 21 is reinforced. In this example, the frame member 21 has beam portions 21a, 21b intersecting in a cross shape. The width of the beam portion 21a is ...

no. 3 Embodiment approach

[0109] Next, refer to Figure 12 A tuner case 300 as a third embodiment will be described. Figure 12 The illustrated tuner housing 300 constitutes an example of a solder-coated component for electromagnetic shielding of a tuner component (not shown) mounted on the tuner circuit board 30 .

[0110] The tuner case 300 is composed of a frame member 31 and a cover member 32 . The width W3 of the frame member 31 is about 18 mm, the length L3 is about 22 mm, and the height H3 is about 2 mm. The frame member 31 is soldered on the tuner circuit board 30 . A land pattern 30 a is provided on the tuner circuit board 30 , and a circuit board in which a tuner circuit is embedded in the printed circuit board 10 described in the first embodiment is used. The frame member 31 and the cover member 32 are made of copper-zinc-nickel alloy material 1, SUS304, SUS316, SUS430, or the like. The frame member 31 is soldered on the land pattern 30a.

[0111]In this example, the inside of the frame...

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Abstract

The present invention provides a solder coating component capable of forming a fillet portion over the entire range of an arbitrary soldering region of a housing component and reliably and firmly bonding it to a substrate without generating solder unjoined portions, voids, etc. And its manufacturing method and installation method. As shown in FIG. 1, the shielding case (100) has a frame member (11) that has been subjected to surface treatment. The surface treatment is as follows: a nickel film and a tin-plated film of a predetermined film thickness are sequentially provided, and the tin-plated film is Lead-free molten solder is coated on the alloy film. The frame member (11) is processed into the shape of the shielding case (100), and thereafter, a nickel film and a tin alloy film are sequentially formed on one or all parts of the shielding case (100) to perform primer treatment. One part or all parts of the frame member (11) are coated with a surface treatment of molten solder, and a part of the shield case (100) is shaped as a soldering surface for surface mounting.

Description

technical field [0001] The present invention relates to a solder coating component applicable to a shield case for electromagnetically shielding an electronic component mounted on a substrate, and a substrate reinforcement frame for reinforcing a short and thin substrate, as well as a manufacturing method and a mounting method thereof. Background technique [0002] In recent years, in information processing devices such as mobile phones, personal computers, audio / video equipment, imaging equipment such as electron microscopes, various medical equipment, TV tuners, and wireless communication The tendency of electronic circuits that operate with frequency signals in units of hundreds of MHz to tens of GHz. In electronic circuits that operate at such a high frequency, in order to prevent electromagnetic wave interference between electronic components mounted on the substrate and between electronic circuits, block electromagnetic influences on the outside, and prevent malfunctio...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K9/00B23K1/20B23K101/42
CPCB23K35/0238B23K35/262B23K1/0016H05K9/0032B23K1/20
Inventor 佐藤勇渡边光司铃木道雄东刚宪出口睦伊东雅哉
Owner SENJU METAL IND CO LTD