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Resin composition for semiconductor encapsulation, and semiconductor device

一种树脂组合物、半导体的技术，应用在半导体器件、半导体/固态器件零部件、电固体器件等方向，能够解决运送不良、耐焊锡性、耐燃性、成型性特性受损、成品率下降等问题，达到可靠性优异的效果

Active Publication Date: 2012-05-09
SUMITOMO BAKELITE CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In such a semiconductor device, since the thickness of the resin-encapsulated part is thinner than conventional ones, under-filling is likely to occur, or metal wire misalignment during molding is likely to occur, and there is a concern that the yield of the encapsulation process may decrease.
Therefore, in order to improve the flow characteristics of the resin composition, it is easy to think of using a low-molecular-weight epoxy resin or a phenolic resin curing agent, but the same method sometimes occurs as follows. Adhesion can easily cause transportation failure in the molding process, equipment stoppage (decrease in handling), and deterioration of solder resistance, flame resistance, and moldability due to decrease in curability

Method used

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  • Resin composition for semiconductor encapsulation, and semiconductor device
  • Resin composition for semiconductor encapsulation, and semiconductor device
  • Resin composition for semiconductor encapsulation, and semiconductor device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0232] The following components were mixed at room temperature using a mixer, melted and kneaded with a heating roll at 80° C. to 100° C., cooled, and pulverized to obtain a resin composition for semiconductor encapsulation.

[0233]

[0234] The following items were evaluated about the obtained resin composition for semiconductor encapsulation. The evaluation results are shown in Table 2.

[0235] (evaluation item)

[0236] Helical fluidity: Using a low-pressure transfer molding machine (KOHTAKI Seiki Co., Ltd., KTS-15), in a mold for measuring helical fluidity based on EMMI-1-66 at 175°C, injection pressure 6.9MPa, The resin composition was injected under the condition of a pressing time of 120 seconds, and the flow length was measured. The helical fluidity is a parameter of fluidity, and the larger the value, the better the fluidity. The unit is cm. The resin composition obtained in Example 1 was 121 cm and showed good fluidity.

[0237] Flame resistance: Using a lo...

Embodiment 2～20、 comparative example 1～5

[0243] According to the formulations in Tables 2 to 5, a resin composition was produced in the same manner as in Example 1, and evaluated in the same manner as in Example 1 (the numerical units of the components in Tables 2 to 5 are parts by mass, as in Example 1) . The evaluation results are shown in Tables 2 to 5.

[0244] [Table 2]

[0245] Table 2

[0246]

[0247] [table 3]

[0248] table 3

[0249]

[0250] [Table 4]

[0251] Table 4

[0252]

[0253] [table 5]

[0254] table 5

[0255]

[0256] Embodiments 1 to 20 are compositions comprising a phenolic resin (A), an epoxy resin (B) and an inorganic filler (C), wherein the phenolic resin (A) comprises a structural unit represented by formula (1) and Component (A1) composed of a polymer of the structural unit represented by formula (2), these examples include compositions obtained by changing the compounding ratio of the structural unit of the phenolic resin (A), containing other The composition of cu...

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Abstract

Disclosed is a resin composition for semiconductor encapsulation, characterized by comprising a phenolic resin (A) comprising one or more components including a component (A1) constituted of a polymer comprising a first structural unit and a second structural unit, an epoxy resin (B), and an inorganic filler (C). Also disclosed is a semiconductor device characterized by being obtained by encapsulating a semiconductor element with a cured object obtained from the resin composition for semiconductor encapsulation.

Description

technical field [0001] The present invention relates to a resin composition for semiconductor encapsulation and a semiconductor device. Background technique [0002] The demand for miniaturization, light weight, and high performance of electronic devices is endless, and the high integration and high density of semiconductor elements (hereinafter, also referred to as "elements" and "chips") are developing year by year, and the mounting of semiconductor devices Surface mount technology has also appeared in the packaging method (hereinafter, also referred to as "package"), and this technology is becoming more and more popular. As the technology related to such semiconductor devices advances, the requirements for resin compositions for encapsulating semiconductor elements have also become stricter. For example, in the surface mount process, the moisture-absorbing semiconductor device is exposed to high temperature during the soldering process, and the explosive stress of the wa...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G59/62C08K3/00C08K5/49C08L63/00H01L23/29H01L23/31
CPCH01L2224/45015C08G59/621H01L2224/32245H01L2924/15311H01L2924/10253H01L24/45H01L2224/73265H01L24/48H01L2224/32225H01L2924/15747C08L63/00H01L2224/48011H01L2224/48091H01L23/293H01L2224/48247H01L2224/45144C08G59/688H01L2224/48227H01L24/73H01L2924/1301H01L2924/14H01L2924/181H01L2924/00014H01L2924/00H01L2924/00012H01L2924/20752H01L2924/20656C08G59/62C08K3/22C08K3/016H01L23/29H01L23/295
Inventor 和田雅浩
Owner SUMITOMO BAKELITE CO LTD
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