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Photosensitive modified polyimide resin composition and use thereof

一种聚酰亚胺树脂、聚酰亚胺的技术，应用在感光材料加工、光学、光机械设备等方向，能够解决难以保护羟基等问题，达到密合性优异、耐化学药品性优异、保存稳定性良好的效果

Active Publication Date: 2012-05-16
HEFEI HANZHIHE MATERIAL SCI & TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In Patent Document 5, it is difficult to protect the desired hydroxyl group by similarly reacting a hydroxyl-terminated etherimide oligomer, a diol compound, (a compound having a (meth)acryloyl group), and a diisocyanate compound.

Method used

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  • Photosensitive modified polyimide resin composition and use thereof
  • Photosensitive modified polyimide resin composition and use thereof
  • Photosensitive modified polyimide resin composition and use thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～8、 comparative example 1～3

[0105] Preparation of positive photosensitive resin composition

[0106] In each of the varnishes (base varnishes) obtained in Synthesis Examples 1 to 2 and Synthesis Comparative Example 1, naphthoquinone diazide sulfonate (manufactured by Daito Chemicals Co., Ltd.) : DTEP-350, PA-6, produced by Toyo Goseisha: 4NT-300), as a flame retardant (large Kagami Corporation: SPB-100, Daihachi Chemical Industry: PX-200, Clarion and Japan: EXOLIT OP 935) were mixed to prepare a photosensitive modified polyimide resin composition (photosensitive ink). Then, about 1 wt% of a leveling agent (manufactured by Cytec Corporation: XL480) was added to the solid content of the polymer, and after final stirring and mixing, defoaming was performed under vacuum to obtain a positive photosensitive modified polyimide resin composition.

[0107] Developability evaluation: photosensitive development test

[0108]Each positive-type photosensitive modified polyimide resin composition obtained in this w...

Embodiment 1～6 and comparative example 1～4

[0113] The following items were evaluated about the photosensitive modified polyimide resin composition shown in said Table 2, and the result is shown in following Table 3.

[0114] Flexibility

[0115] Each flame retardant modified polyimide composition is coated on the substrate by screen printing with a stainless steel plate of 165-3D mesh (mesh), and prebaked by a hot air oven (90 ° C × 30 minutes) to remove the composition The solvent in the solution was used to obtain a photoresist film with a thickness of 14-17 μm. The coating film compounded with photoresist was developed with a developer at 40°C for 2 minutes, washed with deionized water, dried in a hot air oven at 120°C for 60 minutes, and then dried at 180°C for 30 minutes. The thickness of the obtained polyimide film was about 15 μm. About the obtained polyimide film, the coated surface was bent 180 degrees outside, and the presence or absence of a crack in a dried film was visually judged. Judgment criteria are...

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Abstract

Disclosed are: a photosensitive modified polyimide resin composition having excellent electrical properties and adhesion properties, also having excellent heat resistance, flexibility, bending properties, low warpage properties, chemical resistance and storage stability, and having photo-fabrication properties; a resin film formed from the composition; a printed circuit board or a flexible printed circuit board (FPC), each of which has the film as an insulating and protective film or an interlayer insulation film; and others. The photosensitive modified polyimide resin composition comprises a modified polyimide containing a flexible structure (e.g., a polycarbonate) in the main chain and having a specific structure, a photosensitizer, a heat-curing agent, and a solvent.

Description

technical field [0001] The present invention relates to a photoformable ( ) photosensitive modified polyimide resin composition and a resin film formed from the composition, a printed wiring board or a flexible printed wiring board (FPC) having the film as an insulating protective film or an interlayer insulating film, and the like. Background technique [0002] In recent years, polyimide resins, polyamideimide resins, polyurethane resins, epoxy resins, and the like have been used as insulating protective films for flexible wiring boards and the like. When manufacturing this wiring board, a photosensitive material is used for forming a pattern circuit, forming a protective layer on the surface of the wiring board and the pattern circuit, forming an interlayer insulating film, and the like. The photosensitive material can be roughly classified into a liquid type and a film type. In either case, the cured film must be excellent in heat resistance and electrical properties, ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/023C08G73/10C08K5/49C08L79/08
CPCY10S430/107C08G18/346H05K2201/0154C08G18/73C08G18/44H05K3/287C08G18/10C08L79/08C08G73/1042G03F7/40C08G73/1035C08G18/7678G03F7/0233
Inventor 五岛敏之M.S.温濑川繁昌许荣花
Owner HEFEI HANZHIHE MATERIAL SCI & TECH CO LTD
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