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Metamaterial substrate and preparation method thereof

A technology of metamaterials and substrates, applied in the field of metamaterials, can solve the problems of high loss and high dielectric constant of PCB substrates, and achieve the effects of light weight, low dielectric constant and loss, and wide application fields

Inactive Publication Date: 2012-05-30
KUANG CHI INST OF ADVANCED TECH +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the realization of the metamaterial structure is mainly completed by making metal wires on the PCB. The traditional PCB substrate has a high dielectric constant and a large loss. The dielectric constant of the tetrafluoroethylene substrate with the lowest dielectric constant on the market is generally higher than that of the PCB. 2.5, unable to meet the requirements of some high-demand metamaterial design

Method used

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  • Metamaterial substrate and preparation method thereof
  • Metamaterial substrate and preparation method thereof
  • Metamaterial substrate and preparation method thereof

Examples

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preparation example Construction

[0023] A method for preparing a metamaterial substrate, the method for preparing comprises the following steps:

[0024] a. Mix the microsphere foaming agent and thermoplastic polymer melt, stir to form a uniform mixing system, and then vacuum defoam for 5-10 minutes;

[0025] Specifically, the thermoplastic polymer is any one of polyethylene, polypropylene, polystyrene or polyvinyl chloride;

[0026] b. Heat the mixed system to the foaming temperature of the microsphere foaming agent to allow the microspheres to fully expand;

[0027] Specifically, the content of the hollow microspheres in the prepared substrate is controlled by controlling the ratio of the microsphere foaming agent, and the ratio of the microsphere foaming agent is adjusted according to the required dielectric constant of the substrate in practical applications. The greater the addition ratio of the foaming agent, the smaller the dielectric constant of the substrate; at the same time, the pore size of the h...

Embodiment 1

[0032] Embodiment one: if figure 1 as shown,

[0033] a. Mix the microsphere foaming agent and polyethylene melt, stir to form a uniform mixing system, and then vacuum defoam for 5 minutes. The shell of the microsphere foaming agent is a thermoplastic acrylic resin polymer, and the inner core is composed of alkane gas Spherical plastic particles, generally 20 microns in diameter;

[0034] b. Heat the mixed system to the foaming temperature of the microsphere foaming agent at 150°C, let the microspheres fully expand, the alkane gas in the shell expands, and the volume of the foaming agent can rapidly expand to 25 times its own;

[0035] c. Inject the fully foamed mixed system into a prefabricated mold, then cool and demould, and prepare a metamaterial substrate containing hollow microspheres.

[0036] A metamaterial substrate containing hollow microspheres is prepared by using a microsphere foaming agent, and the density and dielectric constant of the substrate are reduced by...

Embodiment 2

[0037] Embodiment two: if figure 2 as shown,

[0038] The difference between the second embodiment and the first embodiment is that the alkane gas spherical plastic particles in the inner core are different, and the alkane gas particles with a larger expansion rate than the first embodiment are used, and the volume of the foaming agent can expand to its own volume. 30-70 times, the preparation is relative to the metamaterial substrate with a lower dielectric constant than that of Example 1, using different alkane gas particles, and the expansion ratio of the microsphere foaming agent is different, so that the dielectric constant of the metamaterial substrate prepared Also different; the greater the expansion rate of the microsphere foaming agent, the larger the pore size of the hollow microsphere, and the smaller the dielectric constant.

[0039] It should be understood that the use of a microsphere blowing agent with a larger volume than the alkane gas particles in Example ...

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Abstract

The invention provides a metamaterial substrate and a preparation method thereof. A metamaterial substrate with hollow microspheres is prepared by using a microsphere foaming agent, and the density and dielectric constant of the substrate are reduced by introducing air; a material with thermoplastic polymer as a main body is used as the substrate, which has a light mass, a small dielectric constant, low loss, and wide application fields when compared with hard ceramic materials; By controlling the ratio of the microsphere foaming agent and selecting microsphere foaming agents with different expansion ratios, metamaterial substrates with different dielectric constants can be prepared, and the application is expanded.

Description

【Technical field】 [0001] The invention relates to the field of metamaterials, in particular to a substrate and a preparation method of a metamaterial. 【Background technique】 [0002] Metamaterials refer to some artificial composite structures or composite materials with extraordinary physical properties that natural materials do not have. Through the orderly design of the structure on the key physical scale of the material, it is possible to break through the limitations of some apparent natural laws, so as to achieve supernormal material functions beyond the ordinary properties inherent in nature. The properties and functions of metamaterials mainly come from their internal structures rather than the materials that make them up, so a lot of research work has been done to design and synthesize metamaterials. In 2000, Smith et al. of the University of California pointed out that the composite structure of periodically arranged metal wires and split-ring resonators (SRR) can ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08J9/32C08L23/06C08L23/12C08L25/06C08L27/06
Inventor 刘若鹏赵治亚法布里奇亚・盖佐何雪涵
Owner KUANG CHI INST OF ADVANCED TECH
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