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Glass/resin laminate, and electronic device using same

A technology for electronic equipment and laminates, applied in glass/slag layered products, synthetic resin layered products, electronic equipment, etc., can solve the problem of poor operability of glass substrates, chemical resistance and moisture permeability of resin substrates. problems, etc., to achieve the effects of excellent surface flatness and heat resistance, improved workability, and warpage suppression

Active Publication Date: 2012-05-30
ASAHI GLASS CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When the strength of the glass substrate decreases due to thinning, the handleability of the glass substrate deteriorates
It should be noted that, from the viewpoint of operability, a resin substrate can be used instead of a glass substrate, but resin substrates have problems in terms of chemical resistance, moisture permeability resistance, etc.

Method used

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  • Glass/resin laminate, and electronic device using same
  • Glass/resin laminate, and electronic device using same
  • Glass/resin laminate, and electronic device using same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0193] In embodiment 1, as test piece, manufacture figure 1 A glass / resin laminate 10 is shown.

[0194] (Cleaning process of glass substrate 12)

[0195] As the glass substrate 12 , an alkali-free glass substrate (manufactured by Asahi Glass Co., Ltd., AN100) obtained by a float method with a width of 500 mm and a thickness of 70 μm was used. The average coefficient of linear expansion of the glass substrate 12 is 38×10 -7 / °C.

[0196] Both surfaces of the glass substrate 12 are activated by UV cleaning. Then, the glass substrate 12 is wound up into a roll shape while laminating protective films on both surfaces of the glass substrate 12 .

[0197] (Surface treatment of glass substrate 12)

[0198] While unwinding the glass substrate 12 wound into a roll, the protective films laminated on both sides of the glass substrate 12 are peeled off, and the surface 12 a of the glass substrate 12 that contacts the resin layer 14 is subjected to silane coupling treatment. Specif...

Embodiment 2

[0210] In embodiment 2, as test piece, manufacture figure 2 A glass / resin laminate 20 is shown.

[0211] (glass substrate 12)

[0212] As the glass substrate 12 , a non-alkali glass substrate (manufactured by Asahi Glass Co., Ltd., AN100) obtained by a float method with a length of 500 mm×a width of 500 mm×a thickness of 45 μm was used. The average coefficient of linear expansion of the glass substrate 12 is 38×10 -7 / °C.

[0213] (resin layer 14)

[0214] As the resin layer 14 , a heat-resistant polyimide film having a length of 500 mm×a width of 500 mm×a thickness of 30 μm produced in the same manner as in Example 1 was used. The average linear expansion coefficient of the heat-resistant polyimide film is 30×10 -7 / °C, and the difference between the average linear expansion coefficient of the glass substrate 12 is 8×10 -7 / °C.

[0215] (Manufacture of thermoplastic polyimide film as adhesive layer 22)

[0216] After replacing nitrogen in the reaction vessel equipped...

Embodiment 3

[0231] In embodiment 3, manufacture as test piece with the method different from embodiment 1 figure 1 A glass / resin laminate 10 is shown.

[0232] (Cleaning process of glass substrate 12)

[0233] As the glass substrate 12 , an alkali-free glass substrate (manufactured by Asahi Glass Co., Ltd., AN100) obtained by a float method with a width of 500 mm and a thickness of 70 μm was used. The average coefficient of linear expansion of the glass substrate 12 is 38×10 -7 / °C.

[0234] Both surfaces of the glass substrate 12 are activated by UV cleaning. Then, the glass substrate 12 is wound up into a roll shape while laminating protective films on both surfaces of the glass substrate 12 .

[0235] (Surface treatment of glass substrate 12)

[0236] While unwinding the glass substrate 12 wound into a roll, the protective films laminated on both sides of the glass substrate 12 are peeled off, and the surface 12 a of the glass substrate 12 that contacts the resin layer 14 is subj...

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Abstract

Disclosed is a glass / resin laminate comprising a glass substrate and a resin layer, wherein the resin layer contains a polyimide that is obtained by polycondensing an aromatic diamine having a benzoxazole structure and an aromatic tetracarboxylic acid anhydride, the difference between the average linear expansion coefficient of the glass substrate and the average linear expansion coefficient of the resin layer for the range of 25-300 DEG C is from -100 10-7 / DEG C to +100 10-7 / DEG C, and the glass substrate forms at least one outermost layer of the laminate.

Description

technical field [0001] The present invention relates to a glass / resin laminate having a glass substrate and a resin layer, and an electronic device using the same. Background technique [0002] In recent years, electronic devices (electronic components) such as organic EL panels, solar cells, and thin-film secondary batteries have been gradually reduced in thickness and weight, and glass substrates used in these electronic devices are gradually reduced in thickness. When the intensity|strength of a glass substrate falls by thinning, the handleability of a glass substrate will deteriorate. In addition, from the viewpoint of workability, a resin substrate may be used instead of a glass substrate, but the resin substrate has problems in terms of chemical resistance, moisture permeability resistance, and the like. [0003] Therefore, recently, a glass / resin laminate in which a resin layer (resin substrate) is provided between two glass substrates (glass film) has been proposed ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B17/10H05B33/02
CPCB32B17/10B32B2315/08B32B2379/08B32B2457/206Y10T156/1195Y10T428/24942Y10T428/266Y10T428/31623B32B27/16H05B33/02B32B7/12B32B2457/00
Inventor 近藤聪
Owner ASAHI GLASS CO LTD
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