Unlock instant, AI-driven research and patent intelligence for your innovation.

Thin chip ceramic substrate and manufacturing method thereof

A ceramic substrate, thin sheet technology, applied in the field of electronic new material manufacturing, can solve the problem of difficult to meet the bulk density, bending strength, thermal conductivity, dimensional tolerance flatness and other problems at the same time, to improve physical and chemical properties and mechanical properties, reduce Internal stress, the effect of improving flatness

Inactive Publication Date: 2012-06-20
吕佳佳 +1
View PDF5 Cites 9 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, 96 ceramics with traditional technology can only meet the traditional requirements in Table 1, and it is difficult to meet new requirements such as bulk density, flexural strength, thermal conductivity, dimensional tolerance, and flatness at the same time.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Thin chip ceramic substrate and manufacturing method thereof
  • Thin chip ceramic substrate and manufacturing method thereof
  • Thin chip ceramic substrate and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] Main raw materials and ceramic formula: 97% by weight of calcined α-alumina micropowder with D50 of 1.05 μm, 2.3% by weight of talc powder with an average particle size of 2.5 μm, 0.7% by weight of dioxide with an average particle size of 0.87 μm Lanthanum superfine powder.

[0033] Other formulations: the amount of solvent added is 31% of the total weight of ceramic raw materials, and the solvent is specifically a mixed solvent of toluene-n-butanol-dehydrated alcohol with a weight ratio of 4:1:2; the binder is 5.7% of the total weight of ceramic raw materials. %, polyvinyl butyral is used; the plasticizing and dispersing mixture is adjusted according to the fluidity of the slurry, and its weight is half of the binder.

[0034] Mixing method: the first ball milling is 36hrs for the mixing and grinding of solvent and ceramic raw materials, and the second ball milling is 15-20hrs (the time can be slightly longer) for the mixing of other raw and auxiliary materials and the...

Embodiment 2

[0046] Ratio of main raw materials and ceramics: 96% by weight of calcined α-alumina powder with a D50 of 1.2 μm, 3.3% by weight of talc powder with an average particle size of 3.1 μm, and 0.7% by weight of praseodymium oxide with an average particle size of 0.65 μm ultrafine powder.

[0047] Other formulations: the solvent is 27% of the total weight of the ceramic raw material, which is a mixed solvent of toluene-n-butanol in a ratio of 3:1; the binder is 5.5% of the total weight of the ceramic raw material, and the binder is polyvinyl butyral; The plasticizing and dispersing mixture is flexibly adjusted according to the fluidity of the slurry, and its weight is half that of the binder.

[0048] Mixing method: 39hrs of first ball milling is for mixing and grinding of solvent and ceramic raw materials, and 12-15hrs of second ball milling is for mixing of other raw and auxiliary materials and adjustment of casting characteristics.

[0049] Degassing-casting method into strips:...

Embodiment 3

[0057] Main raw materials and ceramic formula: 96.5% by weight of calcined α-alumina fine powder with a D50 of 1.9 μm, 2.95% by weight of talcum powder with an average particle size of 1.2 μm, 0.55% by weight of dioxide with an average particle size of 0.8 μm Cerium ultrafine powder.

[0058] Other formulas: solvent is 38% of ceramic raw material gross weight, is the mixed solvent of toluene-n-butanol by 8:3; Binding agent is 7% of ceramic raw material gross weight, and composition is PVB:PVA of 6:4 weight ratio Mixture; the plasticizing and dispersing mixing agent is flexibly adjusted according to the fluidity of the slurry, and its weight is half of the binder.

[0059] Mixing method: 42 hours of primary ball milling is for mixing and grinding of solvent and ceramic raw materials, and 10-15 hours of secondary ball milling is for mixing of other raw and auxiliary materials and adjustment of casting characteristics.

[0060] Degassing-casting method into strips: after vacuum ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
sizeaaaaaaaaaa
flexural strengthaaaaaaaaaa
breakdown field strengthaaaaaaaaaa
Login to View More

Abstract

The invention relates to a thin chip ceramic substrate and a manufacturing method thereof. The thin chip ceramic substrate is prepared from a ceramic raw material, a solvent, a binder, and a plasticizer-dispersant mixture, wherein the ceramic raw materials comprise (by weight percentages) calcined alpha-alumina micropowders of D50 0.5-2.0 mum 96-97, talc powders of average particle size 0.6-5.0 mum 2.0-3.5, and rare earth oxide super micro powders 0.5-1.0; the solvent is an organic mixed solvent 20-40% of the ceramic raw material weight; the binder weight is 4-8% of the ceramic raw material weight; and the plasticizer-dispersant mixture weight is half of the binder weight. The invention adds a rare earth oxide in a substrate, so that physicochemical properties and mechanical properties ofthe substrate are improved.

Description

technical field [0001] The invention belongs to the technical field of new electronic material manufacturing, and relates to an alumina ceramic substrate, in particular to a ceramic substrate for chip resistors and a manufacturing method thereof. Background technique [0002] Alumina ceramics are one of the most widely used ceramic materials, and are widely used in various daily-use ceramics and fine ceramics. At present, alumina ceramics are also widely used in the field of ceramic substrates, which are usually divided into medium-alumina porcelain, high-alumina porcelain, 85 porcelain, 90 porcelain, and 95 porcelain according to the weight ratio of alumina in ceramic products. Most of the ceramic substrates for chip resistors are ceramics with high alumina content above 90 porcelain, which have good comprehensive performance in terms of mechanical properties, thermal conductivity, dielectric properties and cost performance. However, with the continuous improvement of peop...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): C04B35/10C04B35/622
Inventor 余奕发吕佳佳马明臻
Owner 吕佳佳
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com