Silicon grease composition with high thermal dissipation and preparation method thereof

Abstract

The invention discloses a silicon grease composition with high thermal dissipation, comprising a component A that is organic polysiloxane, a component B that is alkoxy silane, a component C that is a heat conducting filler, and a component D that is a stabilizer, the ratio of the component A, B, C and D is as follows according to weight part: component A: component B: component C: component D=1: 0.001-0.1: 7-20: 0-0.05. The invention further discloses a preparation method of the silicon grease composition with high thermal dissipation. The product of the invention has high thermal dissipation and keeps proper viscosity and rheological property; the fine clearance of a radiating interface is filled completely, the contact thermal resistance of the interface is decreased, in this way, the heat radiating efficiency of a heating element is improved effectively, meanwhile, the technical requirements of coating and screen painting are satisfied, and the application range is enlarged. In the preparation method, organic solvent is not needed to be used, the production technology is simple and environmental friendly, thereby being convenient for popularization and application.

Description

technical field [0001] The invention relates to the technical field of thermally conductive polymer materials, in particular to a silicone paste composition with high thermal conductivity and a preparation method thereof. Background technique [0002] As electronic devices continue to pack more powerful features into smaller components, design space sizes shrink, limiting the use of large thermal components. The heat energy generated during the use of components is increasing day by day. If the heat cannot be dissipated in time, the rise in temperature will lead to increased gate delay of the device, slowed down operation speed, reduced reliability of the device, and shortened lifespan. Therefore, in the case of shrinking architecture and smaller and smaller operating space, how to effectively remove a large amount of heat from components that generate higher temperatures to ensure sufficient working and service life of the device has become an urgent problem in electrical d...

AI Technical Summary

Problems solved by technology

[0004] However, none of the high heat dissipation silicone paste or similar compositions in the prior art can well solve the heat dissipation problem of high-power components.

For example, in order to fill a large amount of thermally conductive fillers, low-viscosity non-reactive silicone oil is generally used as the base oil, but the base oil is easy to precipitate from the composition during long-term storage or use, especially under high temperature and high humidity conditions, making high heat dissipation The silicone paste layer is easy to dry and pulverize, resulting in an increase in contact thermal resistance and a significant drop in heat dissipation performance

Although the use of silicone resin carrier can solve the problem of silicone oil precipitation, its coating performance is poor, it is difficult to fully fill the tiny gaps in the thermal interface, the thickness of the adhesive layer is large, the contact thermal resistance is high, and the viscosity and rheological properties are poor Used for screen printing, which greatly limits its scope of use

Images