On-line film-thickness direct monitoring system of optical characteristics of substrate and method

Abstract

The invention discloses an on-line film-thickness direct monitoring system of optical characteristics of a substrate and a method. The method specifically comprises first enabling a light source to vertically irradiate a monitoring substrate arranged close to the outer side of the center of a rotating clamping apparatus, collecting reflected or transmitted optical signals through an optical receiver, and obtaining plating film thickness of the substrate; second comparing the monitored film thickness with the needed film thickness, and controlling whether to perform continuous plating according to comparison results; and third repeating the steps until plating of a film layer on the monitoring substrate is finished. The on-line film-thickness direct monitoring system directly monitors workpieces placed close to the outer side of the center of the rotating clamping apparatus, the workpieces arranged at the position can rotate along with the rotating clamping apparatus during the film coating process, the plating film thickness of the workpieces arranged at the position is substantially the same as plating film thickness of workpieces at other positions, the shortcomings that an existing film layer monitoring method can be overcome during the plating process, the film thickness plating control is more convenient and easier, and accordingly optical products with high quality are obtained.

Description

[0001] technical field [0002] The invention relates to the field of optics, in particular to an online film thickness direct monitoring system and method for substrate optical properties. [0003] Background technique [0004] Obtaining a uniform film thickness is an important guarantee for the consistency, repeatability and high quality of the optical properties of the coated substrate. The main factors affecting the uniformity of film thickness are the emission characteristics of the evaporation source and the relative position of the evaporation source and the workpiece to be plated. The material molecules evaporated by the evaporation source radiate toward the workpiece to be plated, so that the probability of obtaining evaporated molecules is different between the workpiece and the workpiece, thus forming a thin film with an uneven thickness distribution. The general solution is to use a rotary fixture and add a film thickness adjustment plate in the vacuum chamber....

AI Technical Summary

Problems solved by technology

[0006] 1. The monitoring piece is fixed at the center of the rotating jig, and the rotating jig and the film thickness adjustment plate have no adjustment effect on it, so that there will be a relatively large difference in the thickness of the coating film between the monitoring piece and the workpiece, so that the actual The coating thickness of the workpiece is very different from the required coating thickness, which affects the accuracy of the coating thickness

[0007] 2. Since the indirect monitoring optical path is located in the center of the vacuum chamber, it is easily interfered by the stray light of the evaporation source, which affects the signal accuracy and accuracy, and also affects the accuracy of the coating film thickness.

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