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Organosilicon-epoxy resin composition and preparation method thereof

A technology of epoxy resin and silicone, applied in the direction of epoxy resin glue, adhesive type, adhesive additive, etc., can solve the problems of poor modification effect and low modification efficiency, improve high temperature resistance, increase Compatibility, effect of improving modification efficiency and effectiveness

Inactive Publication Date: 2012-07-04
HANGZHOU NORMAL UNIVERSITY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In order to solve the problems of low modification efficiency and poor modification effect in the modification of epoxy resin, the present invention proposes an organosilicon-epoxy resin composition and a preparation method thereof. The preparation method has simple process and good modification effect

Method used

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  • Organosilicon-epoxy resin composition and preparation method thereof
  • Organosilicon-epoxy resin composition and preparation method thereof
  • Organosilicon-epoxy resin composition and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] Weigh 100 parts by weight of epoxy resin (A) bisphenol A epoxy resin E-44, and 20 parts by weight of hydroxyl-terminated polymethylphenylsiloxane (B) (the mass fraction of hydroxyl group is 7.98%) , The weight part of epoxy resin curing agent (C) phthalic anhydride is 180, the weight part of silicone curing agent (D) aminopropyltrimethoxysilane is 0.8, the weight part of silicone curing catalyst (E) dibutyl The weight part of tin dilaurate is 0.5.

[0023] After mixing the epoxy resin and the hydroxyl-terminated polymethylphenylsiloxane uniformly, adding an epoxy resin curing agent, a silicone curing agent and a silicone curing catalyst, and mixing uniformly to prepare Composition 1.

Embodiment 2

[0025] Weigh 100 parts by weight of epoxy resin (A) bisphenol A epoxy resin E-51, and 30 parts by weight of hydroxyl-terminated polymethylphenylsiloxane (B) (hydroxyl mass fraction is 6.45%) , The epoxy resin curing agent (C) has 60 parts by weight of maleic anhydride, the silicone curing agent (D) has 3 parts by weight of aminopropyltriethoxysilane, and the silicone curing catalyst (E) has stannous octoate The weight part is 1.

[0026] The preparation method is the same as in Example 1, and a composition 2 is prepared.

Embodiment 3

[0028] Weigh 100 parts by weight of epoxy resin (A) bisphenol A epoxy resin E-51, and 30 parts by weight of hydroxyl-terminated polymethylphenylsiloxane (B) (hydroxyl mass fraction is 6.45%) , Epoxy resin curing agent (C) The weight part of hexahydrophthalic anhydride is 30, the weight part of maleic anhydride is 60, the weight part of tetrahydrophthalic anhydride is 40, the silicone curing agent (D ) The weight part of aminopropyltriethoxysilane is 3, and the weight part of the organosilicon curing catalyst (E) stannous octoate is 1.

[0029] The preparation method is the same as in Example 1, and a composition 3 is obtained.

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Abstract

The invention relates to the technical field of organosilicon industry, and provides an organosilicon-epoxy resin composition and a preparation method thereof in order to solve the problems of low modification efficiency and poor modification effect existing in epoxy resin modification. The composition is formed by mixing (A) epoxy resin, (B) hydroxyl-terminated polymethylphenylsiloxane, (C) an epoxy resin curing agent, (D) an organosilicon curing agent and (E) an organosilicon curing catalyst. The preparation method is simple in process, has a good modification effect and can be used as a high-temperature-resistant adhesive.

Description

technical field [0001] The invention relates to the technical field of organosilicon industry, in particular to an organosilicon-epoxy resin composition and a preparation method thereof. Background technique [0002] Epoxy resin has excellent chemical stability, electrical insulation and good bonding performance, and has been widely used in adhesives, coatings, electronic appliances, aerospace and other fields. However, the highly cross-linked structure of epoxy resin greatly reduces its mechanical properties and heat and humidity resistance, which limits its application in some high-tech fields. The combination of silicone and epoxy resin not only maintains the physical and mechanical properties of epoxy resin, but also increases oxidation resistance, heat and humidity resistance, etc., while reducing its internal stress. It has important application prospects and is especially suitable for high temperature resistant adhesives . [0003] In the previous research on modifi...

Claims

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Application Information

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IPC IPC(8): C08L63/02C08L83/06C08G59/58C09J163/02C09J183/06C09J11/06
Inventor 李美江胡自强蒋剑雄来国桥
Owner HANGZHOU NORMAL UNIVERSITY
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