Organosilicon-epoxy resin composition and preparation method thereof

A technology of epoxy resin and silicone, applied in the direction of epoxy resin glue, adhesive type, adhesive additive, etc., can solve the problems of poor modification effect and low modification efficiency, improve high temperature resistance, increase Compatibility, effect of improving modification efficiency and effectiveness

Inactive Publication Date: 2012-07-04
HANGZHOU NORMAL UNIVERSITY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In order to solve the problems of low modification efficiency and poor modification effect in the modification of epoxy resin, the present invention

Method used

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  • Organosilicon-epoxy resin composition and preparation method thereof
  • Organosilicon-epoxy resin composition and preparation method thereof
  • Organosilicon-epoxy resin composition and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0021] Example 1:

[0022] Weigh the epoxy resin (A) bisphenol A epoxy resin E-44 parts by weight as 100, and the hydroxyl-terminated polymethylphenylsiloxane (B) (hydroxyl mass fraction is 7.98%) by weight as 20 parts , Epoxy curing agent (C) phthalic anhydride is 180 parts by weight, silicone curing agent (D) aminopropyltrimethoxysilane is 0.8 parts by weight, silicone curing catalyst (E) dibutyl The weight part of tin dilaurate is 0.5.

[0023] After the epoxy resin and the hydroxyl-terminated polymethylphenylsiloxane are uniformly mixed, the epoxy resin curing agent, the organic silicon curing agent and the organic silicon curing catalyst are added and mixed uniformly to obtain composition 1.

Example Embodiment

[0024] Example 2:

[0025] Weigh the epoxy resin (A) bisphenol A epoxy resin E-51 in parts by weight as 100, and hydroxy-terminated polymethylphenylsiloxane (B) (hydroxyl mass fraction is 6.45%) in weight parts as 30 , Epoxy resin curing agent (C) maleic anhydride is 60 parts by weight, silicone curing agent (D) aminopropyltriethoxysilane is 3 parts by weight, silicone curing catalyst (E) stannous octoate The part by weight is 1.

[0026] The preparation method was the same as in Example 1, and the composition 2 was prepared.

Example Embodiment

[0027] Example 3:

[0028] Weigh the epoxy resin (A) bisphenol A epoxy resin E-51 in parts by weight as 100, and hydroxy-terminated polymethylphenylsiloxane (B) (hydroxyl mass fraction is 6.45%) in weight parts as 30 , The epoxy resin curing agent (C) is 30 parts by weight of hexahydrophthalic anhydride, 60 parts by weight of maleic anhydride, 40 parts by weight of tetrahydrophthalic anhydride, and silicone curing agent (D ) The weight part of aminopropyltriethoxysilane is 3, and the weight part of organosilicon curing catalyst (E) stannous octoate is 1.

[0029] The preparation method was the same as in Example 1, and the composition 3 was prepared.

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Abstract

The invention relates to the technical field of organosilicon industry, and provides an organosilicon-epoxy resin composition and a preparation method thereof in order to solve the problems of low modification efficiency and poor modification effect existing in epoxy resin modification. The composition is formed by mixing (A) epoxy resin, (B) hydroxyl-terminated polymethylphenylsiloxane, (C) an epoxy resin curing agent, (D) an organosilicon curing agent and (E) an organosilicon curing catalyst. The preparation method is simple in process, has a good modification effect and can be used as a high-temperature-resistant adhesive.

Description

technical field [0001] The invention relates to the technical field of organosilicon industry, in particular to an organosilicon-epoxy resin composition and a preparation method thereof. Background technique [0002] Epoxy resin has excellent chemical stability, electrical insulation and good bonding performance, and has been widely used in adhesives, coatings, electronic appliances, aerospace and other fields. However, the highly cross-linked structure of epoxy resin greatly reduces its mechanical properties and heat and humidity resistance, which limits its application in some high-tech fields. The combination of silicone and epoxy resin not only maintains the physical and mechanical properties of epoxy resin, but also increases oxidation resistance, heat and humidity resistance, etc., while reducing its internal stress. It has important application prospects and is especially suitable for high temperature resistant adhesives . [0003] In the previous research on modifi...

Claims

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Application Information

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IPC IPC(8): C08L63/02C08L83/06C08G59/58C09J163/02C09J183/06C09J11/06
Inventor 李美江胡自强蒋剑雄来国桥
Owner HANGZHOU NORMAL UNIVERSITY
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