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Thermo-sensitive acrylate pressure-sensitive adhesive and adhesive tape and preparation method of adhesive and adhesive tape

A technology of pressure-sensitive adhesive and pressure-sensitive adhesive tape, applied in the field of pressure-sensitive adhesive, can solve the problems of difficult and easy peeling of products, difficult to meet the requirements of low temperature viscosity, unfavorable cutting and fixing operation of electronic components, etc.

Inactive Publication Date: 2012-07-04
新丰杰力电工材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Patent CN101522846A needs to be heated to 120°C to reduce the viscosity of the rubber surface. Although the maximum expansion temperature of the thermal expansion agent can be reduced, the initial expansion temperature of the expansion agent will also be reduced correspondingly, which is not conducive to the cutting and fixing of electronic components.
Secondly, the patent JP-A-2002-003800 describes that the heat-peelable pressure-sensitive adhesive tape has a lower foaming temperature, but it is difficult to balance the adhesive strength at low temperature and the peeling force after foaming expansion
Patents JP-A-2002-121505 or JP-A-2004-018761 also exist that it is difficult to peel off some products after heating and foaming after satisfying low-temperature viscosity;

Method used

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  • Thermo-sensitive acrylate pressure-sensitive adhesive and adhesive tape and preparation method of adhesive and adhesive tape
  • Thermo-sensitive acrylate pressure-sensitive adhesive and adhesive tape and preparation method of adhesive and adhesive tape
  • Thermo-sensitive acrylate pressure-sensitive adhesive and adhesive tape and preparation method of adhesive and adhesive tape

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] A heat-sensitive acrylate pressure-sensitive adhesive, which is formed by radical polymerization of the following components by weight:

[0020]

[0021]

[0022] First, dissolve N-methylolacrylamide in acrylic acid, stir well to make it dissolve evenly, and dissolve 0.9 parts of azobisisobutyronitrile in 120 parts of ethyl acetate, and mix the two solutions after the dissolution is completed. mix. Then add the above-mentioned isooctyl acrylate, vinyl acetate, and hydroxyethyl acrylate and stir to mix evenly.

[0023] Add 40 parts of ethyl acetate into the reactor and raise the temperature to 75°C. After the reflux is stable, slowly add 1 / 2 of the above mixed solution dropwise, and finish adding dropwise in 1 hour, and control the reaction temperature at 78-80°C; Add 20 parts of ethyl acetate with 0.2 parts of azobisisobutyronitrile dropwise, and finish the dropwise addition within 10 minutes, and keep it warm for 1 hour; hours, the reaction temperature is contr...

Embodiment 2

[0027] A heat-sensitive acrylate pressure-sensitive adhesive, which is formed by radical polymerization of the following components by weight:

[0028]

[0029]

[0030] First, dissolve N-methylolacrylamide in acrylic acid, stir well to make it dissolve evenly, and dissolve 0.9 parts of azobisisobutyronitrile in 120 parts of ethyl acetate, and mix the two solutions after the dissolution is completed. mix. Add the above-mentioned isooctyl acrylate, vinyl acetate, methyl methacrylate, and hydroxyethyl acrylate and stir to mix evenly.

[0031] Add 40 parts of ethyl acetate into the reactor and raise the temperature to 75°C. After the reflux is stable, slowly add 1 / 2 of the above mixed solution dropwise, and finish adding dropwise in 1 hour, and control the reaction temperature at 78-80°C; Add 20 parts of ethyl acetate with 0.2 parts of azobisisobutyronitrile dropwise, and finish the dropwise addition within 10 minutes, and keep it warm for 1 hour; hours, the reaction temp...

Embodiment 3

[0035] A heat-sensitive acrylate pressure-sensitive adhesive, which is formed by radical polymerization of the following components by weight:

[0036]

[0037]

[0038] First, dissolve N-methylolacrylamide in acrylic acid, stir well to make it dissolve evenly, and dissolve 0.9 parts of azobisisobutyronitrile in 120 parts of ethyl acetate, and mix the two solutions after the dissolution is completed. mix. Add the above-mentioned isooctyl acrylate, vinyl acetate, butyl acrylate, and hydroxyethyl acrylate and stir to mix evenly.

[0039]Add 40 parts of ethyl acetate into the reactor and raise the temperature to 75°C. After the reflux is stable, slowly add 1 / 2 of the above mixed solution dropwise, and finish adding dropwise in 1 hour, and control the reaction temperature at 78-80°C; Add 20 parts of ethyl acetate with 0.2 parts of azobisisobutyronitrile dropwise, finish the dropwise addition within 10 minutes, and keep it warm for 1 hour; -2.5 hours, the reaction temperatu...

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Abstract

The invention relates to a thermo-sensitive acrylate pressure-sensitive adhesive and adhesive tape and a preparation method of the adhesive and the adhesive tape. The thermo-sensitive acrylate pressure-sensitive adhesive is prepared from the following components in parts by weight: 30-70 parts of isooctyl acrylate, 100-200 parts of vinyl acetate, 0-15 parts of methyl methacrylate, 0-30 parts of butyl acrylate, 3-10 parts of acrylic acid, 5-20 parts of hydroxyethyl acrylate, 0.3-3 parts of N-hydroxymethyl acrylamide, 0.2-3 parts of azobisisobutyronitrile and 350-400 parts of ethyl acetate by subjecting to free radical polymerization. The adhesive tape is prepared by the steps of: adding TDI (Toluene Diisocyanate) isocyanurate (toluene diisocyanate tripolymer) and trimethylolpropane-tris(3-aziridinyl) propionate to the pressure-sensitive adhesive, then coating on a polyester film, and carrying out cross-linking reaction. At normal temperature, the adhesive tape has stickiness to a steel plate not more than 1N / m; after being heated to 80 DEG C, the adhesive tape has stickiness to the steel plate not less than 80N / m; and after the temperature is kept at 80 DEG C for 10min, when the adhesive tape is removed, the phenomenon of adhesive residue or adhesive overflowing is not existed.

Description

technical field [0001] The invention belongs to the field of pressure-sensitive adhesives, in particular to a heat-sensitive acrylate pressure-sensitive adhesive, an adhesive tape and a preparation method thereof. Background technique [0002] In recent years, with the miniaturization of electronic components, there have been major problems in their production process and improvement of production efficiency, especially the method of efficiently and non-destructively stripping and recycling small electronic components is a big problem. Therefore, if such components are processed within a certain temperature range, the change in the viscosity of the adhesive tape can be changed through the temperature range, which can effectively recycle small electronic components. [0003] At present, the heat-sensitive pressure-sensitive adhesive tapes involved mainly use the temperature range change to make the heat-expandable microspheres expand and cause the adhesive surface to change t...

Claims

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Application Information

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IPC IPC(8): C09J131/04C09J7/02C09J11/06C08F218/08
Inventor 何俊
Owner 新丰杰力电工材料有限公司