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Silicon wafer cleaning liquid

A silicon wafer cleaning and concentration technology, applied in the direction of inorganic non-surface active cleaning composition, organic non-surface active cleaning composition, etc., can solve problems such as pollution and difficult handling, achieve thorough cleaning, strong cleaning effect, and improve subsequent use performance effect

Inactive Publication Date: 2012-07-04
ZHENJIANG GANGNAN ELECTRIC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Most of them use hydrochloric acid for cleaning. Hydrochloric acid is a highly corrosive substance, and it is difficult to handle after treatment. If it is placed upside down at will, it will easily cause pollution

Method used

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  • Silicon wafer cleaning liquid
  • Silicon wafer cleaning liquid
  • Silicon wafer cleaning liquid

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0018] Stir and mix 15 parts of surfactant, 5 parts of ethanol, 2 parts of hydrogen fluoride, 2 parts of disodium EDTA, 3 parts of triethanolamine, 0.5 parts of citric acid, and the rest of deionized water to form a cleaning solution. The concentration of ethanol is 90%, and the concentration of citric acid is 10%.

[0019] Performance indicators: 1000 pieces of silicon wafers are cleaned, and the cleaning degree reaches 98.9%.

Embodiment 2

[0021] Stir and mix 20 parts of surfactant, 6 parts of ethanol, 3 parts of hydrogen fluoride, 2 parts of disodium EDTA, 4 parts of triethanolamine, 1 part of citric acid, and the rest of deionized water to form a cleaning solution. The concentration of ethanol is 98%, and the concentration of citric acid is 10%.

[0022] Performance indicators: 1000 pieces of silicon wafers are cleaned, and the cleaning degree reaches 99.9%.

Embodiment 3

[0024] Stir and mix 30 parts of surfactant, 5 parts of ethanol, 2 parts of hydrogen fluoride, 2 parts of disodium EDTA, 3 parts of triethanolamine, 0.5 parts of citric acid, and the rest of deionized water to form a cleaning solution. The concentration of ethanol was 100%, and the concentration of citric acid was 10%.

[0025] Performance index: Clean 1000 pieces of silicon wafers, and the cleaning degree reaches 99.6%.

[0026] The preparation method of the present invention is simple, has no adverse effect on the environment, and has strong detergency on the surface, can maintain the continuity of cleanliness, has a good cleaning effect on materials such as polycrystalline silicon wafers, and improves cleaning speed and durability; the present invention adopts Ethanol cleans the organic contamination on the surface of the silicon wafer. In addition, the oxide layer is cleaned by hydrogen fluoride, so that the cleaning of the silicon wafer is more thorough, and it has a stron...

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Abstract

The invention provides a silicon wafer cleaning liquid, which is formed by stirring and mixing surfactant, alcohol, hydrogen fluoride, ethylene diamine tetraacetic acid (EDTA) disodium, triethanolamine, citric acid and deionized water. The silicon water cleaning liquid is simple in preparation method, free of negative influence on environment, strong in surface detersive power and capable of keeping persistence of cleaness, has good cleaning effect on polycrystalline silicon wafers and other materials, and improves cleaning speed and durable performance. The silicon wafer cleaning liquid uses the alcohol to clean organic contamination on the surface of a silicon wafer, and additionally uses the hydrogen fluoride to clean oxide layers, thereby enabling cleaning of the silicon wafer to be more thoroughly, having strong cleaning effect on metal ions, and improving subsequent using performance of the silicon wafer.

Description

technical field [0001] The invention relates to a cleaning solution, in particular to a cleaning solution for cleaning silicon wafers, and provides a preparation method of the cleaning solution, which belongs to the technical field of silicon wafer processing. Background technique [0002] A silicon wafer is a silicon material that is cut into pieces by processing. Therefore, the silicon material to the usable silicon wafer has to go through multiple processes such as cutting and cleaning. With the development of society, silicon wafers are used more and more, and the processing of silicon wafers has also received more attention. [0003] Cleaning is one of the production processes of silicon wafers, and its cleaning quality has a great influence on the performance of silicon wafers. The main purpose of cleaning is to clean away the sand particles, residual cutting abrasives, metal ions and fingerprints generated during the cutting process, so that the surface of the silic...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C11D7/26C11D7/08
Inventor 聂金根
Owner ZHENJIANG GANGNAN ELECTRIC
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