Ultrafast bright dipping chemical nickel-plating solution
An electroless nickel plating and solution technology, which is applied in the field of electroless nickel plating solution with ultra-fast light emission, can solve the problems of inability to meet product technical requirements and environmental emission requirements.
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example 1
[0032] Example 1, the contents of each component in the nickel plating solution are as follows:
[0034] Sodium hypophosphite 30 g / L
[0035] Citric acid 5 g / L
[0036] Lactic acid 35 g / L
[0037] Propionic acid 25 g / L
[0038] Malic acid 4.5 g / L
[0039] Succinic acid 4 g / L
[0040] Tellurium dioxide 1mg / L
[0041] Antimony Potassium Tartrate 35mg / L
[0042] Potassium iodate 15mg / L
[0043] 3-thio-isothiourea propanesulfonic acid inner salt 14mg / L
[0044] Sodium dodecyl sulfate 45mg / L
[0045] The nickel plating solution obtained according to this ratio can produce a fully bright nickel plating layer in about 2 minutes and 40 seconds under the working conditions of solution pH=4.8 and operating temperature of 88°C.
example 2
[0046] Example 2, the content of each component in the nickel plating solution is as follows:
[0048] Sodium hypophosphite 30 g / L
[0049] Citric acid 5 g / L
[0050] Lactic acid 35 g / L
[0051] Propionic acid 25 g / L
[0052] Malic acid 4.5 g / L
[0053] Succinic acid 4 g / L
[0054] Sodium thiosulfate 0.53mg / L
[0055] Potassium iodate 11mg / L
[0056] Tellurium dioxide 0.8mg / L
[0057] Antimony Potassium Tartrate 38mg / L
[0058] Sodium thiocyanate 0.32mg / L
[0059] Sodium dodecyl sulfate 40mg / L
[0060] The nickel plating solution obtained according to this ratio can produce a fully bright nickel plating layer in about 2 minutes and 55 seconds under the working conditions of solution pH=4.8 and operating temperature of 88°C.
[0061] To sum up, the present invention designs an ultra-fast electroless nickel plating solution for the special performance requirements of the nickel plating layer on the surface of the aluminum heat sink, which...
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