Conductive paste composition for termination electrode, multilayer ceramic capacitor including the same and method of manufacturing thereof
A technology of conductive paste and composition, applied in multilayer capacitors, cable/conductor manufacturing, capacitors, etc., can solve the problems of reduced electrode density coverage, corrosion of glass components, easy penetration of plating solutions, etc.
Inactive Publication Date: 2012-07-04
SAMSUNG ELECTRO MECHANICS CO LTD
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Problems solved by technology
[0008] However, when the terminal electrode layer is thinned, the density of the electrode or the coverage of the electrode is reduced, and in this case, after firing the terminal electrode, the plating solution easily penetrates into the terminal electrode
[0009] If the glass component in the terminal electrode does not have high corrosion resistance to the components in the plating solution, the glass component will be corroded and the plating solution will permeate into the chip through the terminal electrode, thus causing deterioration in chip reliability
Method used
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example 1
[0115] In Example 1, after weighing the formula aSiO 2 -bB 2 o 3 -cAl 2 o 3 -dTM x o y -eR 1 2 O 2 After each component of the composition represented by O was melted at 1400° C. at a heating rate of 10° C. / min, the molten melt was rapidly cooled using twin rollers to form glass flakes. Then, the glass flakes were subjected to a dry grinding process and a wet grinding process using alcohol to obtain glass frit having an average particle size of 3.5 μm.
[0116] Among the components of glass frit, transition metal (TM) and R 1 and R 2 The types and specific contents of are shown in Table 1.
[0117] Comparative Example 1 to Comparative Example 10
[0118] In each of Comparative Example 1 to Comparative Example 10, except in the following formula (aSiO 2 -bB 2 o 3 -cAl 2 o 3 -dTM x o y -eR 1 2 O 2 The kinds and contents of various oxides contained in the glass frit composition represented by O) are not outside the scope defined by the present invention, and...
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Abstract
There are provided a conductive paste composition for a termination electrode, a multilayer ceramic capacitor having the same, and a method thereof. The conductive paste composition for a termination electrode includes a conductive metal powder and a glass frit represented by the following Formula: aSiO2-bB2O3-cAl2O3-dTMxOy-eR12O-fR2O, where TM is a transition metal selected from a group consisting of zinc (Zn), titanium (Ti), copper (Cu), vanadium (V), manganese (Mn), iron (Fe) and nickel (Ni); R1 is selected from a group consisting of lithium (Li), sodium (Na) and potassium (K); R2 is selected from a group consisting of magnesium (Mg), calcium (Ca), strontium (Sr) and barium (Ba); each of x and y is larger than 0; and 'a' ranges from 15 to 70 mol %, 'b' ranges from 15 to 45 mol %, 'c' ranges from 1 to 10 mol %, 'd' ranges from 1 to 50 mol %, 'e' ranges from 2 to 30 mol % and 'f' ranges from 5 to 40 mol %. The conductive paste composition for a termination electrode includes a glass frit compound having improved corrosion resistance to a plating solution, thus effectively preventing the penetration of the plating solution and enhancing chip reliability.
Description
[0001] This application claims priority to Korean Patent Application No. 10-2010-0130318 filed with the Korean Intellectual Property Office on December 17, 2010, the disclosure of which is hereby incorporated by reference. technical field [0002] The present invention relates to a conductive paste composition for terminal electrodes capable of improving chip reliability, a multilayer ceramic capacitor including the conductive paste composition, and a manufacturing method thereof. Background technique [0003] Electronic components manufactured using ceramic materials (e.g., capacitors, inductors, piezoelectric devices, varistors, thermistors, etc.) generally have a ceramic body made of ceramic material, internal electrodes disposed in the ceramic body, and External electrodes (ie, terminal electrodes) on the surface and electrically connected to the internal electrodes. [0004] Among these ceramic electronic components, multilayer ceramic capacitors generally include: a pl...
Claims
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IPC IPC(8): H01B1/16H01B13/00H01G4/30H01G4/232
CPCH01G4/2325H01G4/30H01B1/16
Inventor 许康宪金昶勋孙圣范金智淑具贤熙尹根政李圭夏权祥勋朴明俊
Owner SAMSUNG ELECTRO MECHANICS CO LTD