Metal supporting vertical structure fluorescent powderless white light LED
A metal-supported, phosphor-free technology, applied in electrical components, electrical solid-state devices, circuits, etc., can solve the problems of large light decay, poor luminous stability of phosphors, and low effective light conversion efficiency, and achieve improved heat dissipation performance and external appearance. The effect of quantum effect enhancement
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Embodiment 1
[0017] Through epitaxial technology, P-type heavily doped yellow AlGaInP LEDs and N-type heavily doped blue silicon carbide (SiC) substrate GaN-based LEDs were obtained respectively. A Ni / Ag / Au alloy layer is deposited on the P-type GaN layer as an ohmic contact alloy reflective layer by using electron beam evaporation equipment. Then, the GaN-based LED device is bonded to the Cu / Al alloy support substrate with the coating layer as the contact surface through a bonding machine. Then, use dry etching (such as ICP) to completely peel off the SiC substrate to expose the heavily doped N-type GaN surface, and obtain a blue-emitting GaN-based LED with metal support. The P-type heavily doped GaAs surface of the yellow AlGaInP LED is in contact with the N-type heavily doped surface of the blue-emitting GaN-based LED with a metal support, and the double LED chips are bonded. Then, the GaAs substrate is etched away by chemical methods, and part of the AlGaInP LED is removed by etching ...
Embodiment 2
[0019] Through epitaxial technology, P-type heavily doped red-yellow AlGaInP LEDs and N-type heavily doped blue sapphire (Al 2 o 3 ) Substrate GaN-based LED. A Ni / Ag / Au alloy layer is deposited on the P-type GaN layer as an ohmic contact alloy reflective layer by using electron beam evaporation equipment. Then, the GaN-based LED device is bonded to the Ni / Cu alloy support substrate with the coating layer as the contact surface through a bonding machine. Al by laser lift-off 2 o 3 The substrate is removed, and the heavily doped N-type GaN surface is completely peeled off to obtain a blue-emitting GaN-based LED with a metal support. The P-type heavily doped GaAs surface of the red-yellow AlGaInP LED is in contact with the N-type heavily doped surface of the blue-emitting GaN-based LED with a metal support, and the double LED chips are bonded. Then, the GaAs substrate is etched away by chemical methods, and part of the AlGaInP LED is removed by etching technology to reach th...
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