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Preparation method of silver-coated copper composite powders

A composite powder, silver-coated copper technology, applied in the direction of coating, etc., can solve the problems of deposition on the inner wall of the plating tank, many times of plating, waste of silver on the silver layer, etc., achieve high conductivity, reduce costs, and strong oxidation resistance performance effect

Inactive Publication Date: 2013-05-29
SHANGHAI JIAOTONG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Invention patent [CN1262043A] discloses a method of preparing silver-coated copper powder by substitution reaction, which is used for the preparation of antibacterial agents, without mentioning the conductive properties of the powder
[0003] The above-mentioned process of electroless silver plating on the surface of copper powder has the disadvantages of complex components of silver ammonia solution, poisonous silver oxide, many times of plating, and some need to carry out electroless plating at a temperature higher than room temperature, and in the process of plating In the process, the silver layer is easily deposited on the inner wall of the plating tank, resulting in the waste of silver

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] Take 40g of copper powder, add 6% dilute sulfuric acid to activate the oxide on the surface of the copper powder, and wash with ultrapure water for 3 times. Add 10g / LSnCl to the washed copper powder after activation 2 Sensitized in hydrochloric acid solution, stirred at room temperature for 2 hours, washed with pure water 3 times for use. Take 1000ml of 100g / L silver nitrate and ammonia water 100g / L. Preparation of mixed reducing solution: 68.5g of L-ascorbic acid and 6.7g of polyvinylpyrrolidone were prepared with ultrapure water, and treated copper powder was added, and stirred for 40 minutes. Then, mix the above-mentioned mixed reducing solution and silver ammonia solution under high-speed stirring, control the reaction temperature at 25° C., and the reaction time is 10 minutes. Finally, the precipitate was washed three times with ultrapure water, and then washed once with absolute alcohol, and finally dried in a blast drying oven at 50° C. for 24 hours, and pulver...

Embodiment 2

[0023] Take 30g of copper powder, add 8% dilute sulfuric acid for activation to remove oxides on the surface of the copper powder, and wash with pure water twice. Add 6g / LSnCl to the washed copper powder after activation 2 Sensitized in hydrochloric acid solution, stirred at room temperature for 1.5 hours, washed with pure water 3 times for use. Get the silver nitrate of 1000ml120g / L, ammoniacal liquor 130g / L. Preparation of mixed reducing solution: 77.6g of L-ascorbic acid and 8.1g of ammonium stearate were prepared with ultrapure water, and treated copper powder was added, and stirred for 50 minutes. Then, the above-mentioned mixed reducing solution and silver ammonia solution were mixed under high-speed stirring, the reaction temperature was controlled at 20° C., and the reaction time was 15 minutes. After the reaction was settled for 1 hour, the supernatant was poured out to obtain the precipitate. Finally, the precipitate was washed three times with ultrapure water, and...

Embodiment 3

[0025] Take 25g of copper powder, add 5% dilute sulfuric acid for activation to remove oxides on the surface of the copper powder, and wash with pure water twice. Add 5g / LSnCl to the washed copper powder after activation 2 Sensitized in hydrochloric acid solution, stirred at room temperature for 1 hour, washed with pure water 3 times for use. Get the silver nitrate of 1000ml130g / L, ammoniacal liquor 140g / L. Preparation of mixed reducing solution: L-ascorbic acid 82.5g, gelatin 9.5g were prepared with ultrapure water, and treated copper powder was added, and stirred for 45 minutes. Then, mix the above-mentioned mixed reducing solution and silver ammonia solution under high-speed stirring, control the reaction temperature at 15°C, and the reaction time is 10 minutes. Finally, the precipitate was washed three times with ultrapure water, and then washed once with absolute alcohol, and finally dried in a blast drying oven at 55°C for 24 hours, and powdered.

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PUM

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Abstract

The invention relates to a preparation method of silver-coated copper composite powders. The method comprises the steps of activating and sensitizing copper powders, dispersing the processed copper powders in a mixed reduction solution, carrying out chemical plating, washing and drying to obtain powders. Compared with the prior art, the preparation method provided by the invention conducts chemical silver plating process on the surface of copper powders with simple components and technology at the room temperature, so that the obtained silver-coated copper powders have electromigration resistance capacity, high conductivity and strong antioxidation property, and meanwhile the cost of an electronic paste can be greatly lowered.

Description

technical field [0001] The invention relates to a preparation method of a silver-coated copper composite powder for electronic paste, in particular, the obtained silver-coated copper powder has electromigration resistance, high electrical conductivity and strong oxidation resistance. Background technique [0002] With the continuous development of modern high-tech, electronic equipment is widely used in various industries in society, and the problems of electromagnetic interference (EMI) and electromagnetic compatibility (EMC) caused by it are becoming more and more serious. In response to this phenomenon, conductive rubber, as an efficient electromagnetic shielding material, has important scientific research value. As a conductive filler, silver powder has high conductivity and oxidation resistance, but it is very prone to electromigration under hot and humid conditions and DC voltage, resulting in short circuit, and the price is expensive. The shielding effect is poor, it...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B22F1/02C23C18/44C23C18/18
Inventor 胡晓斌宗志杰李浩然赵斌元
Owner SHANGHAI JIAOTONG UNIV