Surface activation modification technology for environment-friendly magnesium hydroxide flame retardant special for insulating materials
A technology of magnesium hydroxide and insulating materials, applied in fibrous fillers, dyed organic silicon compound treatment, dyed low-molecular organic compound treatment, etc., can solve the problems of large decline in mechanical properties, large smoke generation, health and safety hazards, etc. problems, achieve high peel strength, increase specific surface area, and excellent electrical properties
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Embodiment approach 1
[0024] Add 3KG stearic acid, 100KG magnesium hydroxide (average particle size: 5μm), 0.5KG sodium tripolyphosphate, and 2KG zinc borate together into a high-speed mixer for surface activation modification. The stirring speed is 900 r / min, and the temperature is 105°C for 45 minutes.
[0025] Take 50 parts (parts by weight, the same below) of benzoxazine type epoxy resin (epoxy equivalent 280), 30 parts of phosphorus-containing epoxy resin, 20 parts of bisphenol A novolac epoxy resin, and 3 parts of dicyandiamide , 0.5 parts of 2-methylimidazole, 25 parts of modified magnesium hydroxide prepared by the present invention, and 20 parts of dimethylformamide are used as solvents, stirred and mixed to make glue.
[0026] Glue mixing, gluing, thermoforming, processing inspection and other processes refer to the current mature process steps in the field of laminates. Among them, the hot pressing temperature is 175°C and the pressure is 45 kg / cm 2 , The hot pressing time is 60 minute...
Embodiment approach 2
[0028] Add 1.5KG silane KH550, 100KG magnesium hydroxide (average particle size 5μm), 0.5KG sodium silicate, and 2KG zinc borate into a high-speed mixer for surface activation modification. The stirring speed is 900 r / min and the temperature is 105 ℃, the time is 45min.
[0029] Take 50 parts (parts by weight, the same below) of benzoxazine type epoxy resin (epoxy equivalent 280), 30 parts of phosphorus-containing epoxy resin, 20 parts of bisphenol A novolac epoxy resin, and 3 parts of dicyandiamide , 0.5 parts of 2-methylimidazole, 25 parts of modified magnesium hydroxide prepared by the present invention, and 20 parts of dimethylformamide are used as solvents, stirred and mixed to make glue.
[0030] Glue mixing, gluing, thermoforming, processing inspection and other processes refer to the current mature process steps in the field of laminates. Among them, the hot pressing temperature is 175°C and the pressure is 45 kg / cm 2 , The hot pressing time is 60 minutes.
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