Two-dimensional and three-dimensional integrated imaging measurement system

Abstract

The invention discloses a two-dimensional and three-dimensional integrated imaging measurement system, which is characterized by being composed of an astigmatism automatic focusing unit, a light source unit, a Linnik interference unit and an image receiving unit. According to the two-dimensional and three-dimensional integrated imaging measurement system, disclosed by the invention, a fixed system framework is used for integrating a plurality of advanced imaging technologies so as to efficiently meet various precise measurement requirements; the two-dimensional and three-dimensional integrated imaging measurement system is mainly applied to testing of two-dimensional geometrical parameters of a micro-part structure, detecting of the machining, the quality and the surface appearance of MEMS (Micro-electromechanical Systems), IC (Integrated Circuit) and optical micro-devices, and medical measurement of biological tissues and the like.

Description

technical field [0001] The invention relates to a two-dimensional and three-dimensional integrated imaging measurement system, in particular to two-dimensional geometric parameter testing of micro-part structures, processing of MEMS, IC and optical micro-devices, detection of quality and surface topography, and medical measurement of biological tissues. Background technique [0002] In recent years, with the rapid development of high-tech industries such as semiconductors, MEMS, ICs, optical micro-devices and nanotechnology, how to complete product design, processing and testing in the shortest time has become an important issue in the industry. At present, the technology of precision processing and manufacturing at home and abroad is constantly improving, making the specifications of many micro-optics, micro-electronics, and micro-semiconductor products reach the micro-nano level. Therefore, detection technology has become a key factor in determining product quality and mark...

AI Technical Summary

Problems solved by technology

However, when dealing with multiple measurement requirements and various samples to be tested, these technologies will encounter certain limitations. For example, the two-dimensional image measurement system of the microscope with auto-focus function cannot obtain the surface three micro-topography ;Because the Michelson and Mirau type interference microscope objectives cannot compensate the optical path difference between the reference arm and the measurement arm, the optical profiler cannot cope with the measurement of film thickness, gap and tomographic images, nor can it measure stress and birefringence changes; Linnik interference structure It is very difficult to adjust the accurate focus of the reference arm and the measurement arm, as well as the optical path difference between the two arms, and lacks a fast and convenient auto-focus function; in addition, these are added for various complex measurement samples and measurement requirements Measuring instruments are bound to be extremely expensive

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