On-line test structure for Seebeck coefficient of polysilicon-metal thermocouple

A Seebeck coefficient and online testing technology, applied in thermometer testing/calibration, measuring devices, measuring heat, etc., can solve problems such as difficult process, heat radiation and other effects can not be completely eliminated, complex test structure, etc., to achieve simple and reliable calculation , test methods and test parameter values ​​are stable, and the effect of low test requirements
CN102608153AInactive Publication Date: 2012-07-25SOUTHEAST UNIV
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
SOUTHEAST UNIV
Publication Date
2012-07-25
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention discloses an on-line test structure for Seebeck coefficient of a polysilicon-metal thermocouple. The technology is implemented in a way that: respectively measuring the actual temperature difference between the cold end and the hot end of the thermocouple in the thermal steady state by using two temperature measurement resistors, measuring the open-circuit voltage of the thermocouple pile, and carrying out simple calculation to obtain the Seebeck coefficient of the polysilicon-metal thermocouple. The test structure disclosed by the invention is simple and convenient to manufacture, and can be obtained by a common MEMS surface working technique, thereby avoiding complex suspended structure and body processing technique. The measured temperatures are actual temperatures of thehot end and the cold end of the thermocouple pile in the thermal steady state, and people do not need to consider the influence of radiation, convection and other factors; and thus, the test requirements are low, the test method and tested parameter values are stable, and the calculation is simple and reliable.
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Description

technical field

[0001] The invention relates to an on-line testing technology of material parameters in a micro-electro-mechanical system, in particular to an on-line testing structure of the Seebeck coefficient of a polysilicon-metal thermocouple. Background technique

[0002] Thermocouples are widely used as a common heat sensor that effectively converts heat into voltage. Polysilicon and metal are the basic materials for the manufacture of microelectromechanical system devices. Using polysilicon-metal thermocouples for thermal sensing is a commonly used sensing technology in microelectromechanical systems (MEMS).

[0003] The Seebeck coefficient is an important parameter to measure the sensitivity of the thermocouple, and its size is determined by the properties of the material forming the thermocouple. Because MEMS materials will be affected by the processing process and produce changes in material parameters, the designer needs to understand the real situation of the m...

Claims

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