Method of silver paste grouting process for high-precision circuit board

Abstract

The invention provides a method of silver paste grouting process for high-precision circuit boards. The method comprises the following steps: polishing the green oil plane of the circuit board downwards so as to smoothen the plane of the circuit board; packaging and fixing a grouting tool on the table plane of a silk-screen machine; aligning the screen and regulating the screen distance so as to align a pattern adopted by a screen board with a pattern desired by a produced machine type; regulating angles of a scraper and a turning knife of the silk-screen machine; further regulating the silk-screen pressure and regulating the viscosity of the silver paste; then grouting from the green oil plane to the back plane; placing the grouting circuit board statically for more than 4H; putting the grouting circuit board in an oven of 50-150 DEG C to be baked in three sections; and finally cooling and taking out of the oven so as to obtain the high-precision circuit board. The circuit board produced by the method is not only small in size and thickness, but also saves energy and electricity, has excellent stability, good conductivity, strong smoothness and reliability and excellent printing ability, bending ability and extremely strong adhesion; and the method has the characteristics of being low in temperature, rapid in curing production period, high in cost performance, low in cost, free of the three waste pollution and the like.

Description

technical field [0001] The invention relates to a hole filling method for a circuit board, in particular to a silver paste hole filling process for a high-precision circuit board. Background technique [0002] As we all know, the circuit board is an important electronic component to realize the interconnection of electronic components and a support for electronic components. It is mainly divided into single-sided circuit boards, double-sided circuit boards and multi-sided circuit boards. At present, the via holes of double-sided circuit boards mainly adopt the sinking copper electroplating (PTH) hole filling process, and the via holes of single-sided circuit boards mainly adopt the carbon oil filling process, but they have the following problems in the production of hole filling: 1. A large amount of wastewater will be discharged during the process of copper paste electroplating and carbon oil filling, which increases the difficulty of wastewater treatment, causes environ...

AI Technical Summary

Problems solved by technology

At present, the via holes of double-sided circuit boards mainly adopt the sinking copper electroplating (PTH) hole filling process, and the via holes of single-sided circuit boards mainly adopt the carbon oil filling process, but they have the following problems in the production of hole filling: 1. A large amount of wastewater will be discharged during the process of copper paste electroplating and carbon oil filling, which increases the difficulty of wastewater treatment, causes environmental pollution, and increases production costs. Strong, not power-saving, energy-saving, and large in size and thickness, it is not suitable for ultra-thin electronic and electrical products; third, the filling process is not very convenient to operate, and the route holes need special manual welding; and the copper paste electroplating filling process Easy to foam and separate, and the carbon oil filling process has a long production cycle