Novel lead frame

Abstract

The invention discloses a novel lead frame. The lead frame comprises a plurality of frame units horizontally arranged side by side, wherein each frame unit comprises a radiation area, a chip area and a pin area; the radiation area is connected above the chip area; an electroplated metal layer is arranged on the surface of the chip area; the pin area is connected below the chip area; and more than a circle of groove the same as the profile of a carried chip is arranged on the chip area; and more than one layer of step edge and more than one convex plate are respectively arranged on the two sides of the chip area. The lead frame has simple structure, strong adherence, good product quality and high safety performance and is convenient to use.

Description

technical field [0001] The invention relates to a semiconductor element, in particular to a novel lead frame. Background technique [0002] As the chip carrier of integrated circuits, the lead frame is a key structural part that realizes the electrical connection between the lead-out end of the chip's internal circuit and the outer lead by means of a bonding gold wire, forming an electrical circuit. It acts as a bridge connecting the external wire. Lead frames are required in most semiconductor integrated blocks, and lead frames are important basic materials in the electronic information industry. The lead frame needs to install chips on the surface of the chip area, and then use resin to mold the chips and fix them into an integral semiconductor element. The traditional chip part has a planar structure, and the strip electroplating method is used, which is easy to leave small uneven and protruding solder joints. When the lead frames are stacked together, there will be fric...

AI Technical Summary

Problems solved by technology

The traditional chip part is a planar structure, and the strip plating method is used, which is easy to leave uneven and protruding small solder joints. When the lead frames are stacked together, there will be friction between them, which will cause scratches on the plating area of ​​the chip part and affect the product. Quality; the chip area of ​​the lead frame carries and connects the chip. The chip is usually bonded to the chip area. The surface of the chip area is smooth. When the adhesive silver paste is dripped on the chip area, there is easy residual air between the chip area and the chip. The resin encapsulates the lead After the frame, the heat generated by the product makes the resin and air thermally expand. Due to the different thermal expansion coefficients of the two, the product is damaged, and the lead frame with a smooth surface of the resin package is not strong in adhesion, and it is easy to peel off, affecting normal and safe use; When the frame unit is divided, the cutting operation of the connecting plate of the overall structure is difficult, time-consuming and laborious, and it is easy to cause damage and deformation of the lead frame, making it unusable

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