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Manufacturing method of array substrate, array substrate and display device

A production method and array substrate technology, which are applied in semiconductor/solid-state device manufacturing, instruments, semiconductor devices, etc., can solve problems such as difficult to meet the size of LCD TV drive circuits, difficult to make breakthroughs, opacity of visible light, etc., to achieve reduction The number of patterning processes, the reduction of production costs, and the effect of eliminating deposition processes

Active Publication Date: 2014-12-24
BOE TECH GRP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Although polycrystalline silicon has superior performance, its preparation process is complicated, its cost is high, and it is not transparent to visible light; and with the continuous improvement of TFT performance, the technology of hydrogenating amorphous silicon has matured, and its semiconductor mobility generally does not exceed 1cm 2 ·V -1 ·s -1 , it is difficult to have a breakthrough improvement, and the existing hydrogenated amorphous silicon TFT has been difficult to meet the needs of LCD TVs with increasing size and higher performance driving circuits

Method used

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  • Manufacturing method of array substrate, array substrate and display device
  • Manufacturing method of array substrate, array substrate and display device
  • Manufacturing method of array substrate, array substrate and display device

Examples

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Embodiment 1

[0061] like figure 1 As shown, in this embodiment, the fabrication method of the array substrate adopts three patterning processes based on slit photolithography technology, so that the patterns of the source electrode 5a, the drain electrode 5b and the pattern of the pixel electrode 4 are formed by one patterning process. The principle of the slit lithography technology is to set a slit of a specific size on the mask to control the transmittance of light by generating optical diffraction, thereby selectively controlling the thickness of the photoresist. The photoresist is preferably formed by spin coating.

[0062] The manufacturing method of the array substrate specifically includes the following steps:

[0063] s101. Forming patterns of gate electrodes 1 and gate lines 9 on the substrate through a first patterning process.

[0064] Specifically, such as figure 2 As shown in (a) and 2(b), a gate film is deposited on the substrate, and then a layer of photoresist is coate...

Embodiment 2

[0088] The difference between the manufacturing method of the array substrate described in this embodiment and the manufacturing method described in Embodiment 1 is that:

[0089] 1) The active layer film is made of In 2 o 3 production; The transparent conductive film adopts in 2 O 3 The surface of the active layer film is doped with Zn or Sn by plasma implantation. Formed on the surface of the active layer film.

[0090] 2) The source and drain electrodes are made of the same material as the pixel electrodes, that is, ion implantation The advanced method carries out surface treatment to active layer film, makes the surface of described active layer film A transparent conductive film and a source-drain metal film are formed at the same time. And because the source and drain electrodes and the pixel The materials used for the electrode are the same, and the gate insulating layer 2, the active layer 3, the source electrode 5a, When patterning the data line ...

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Abstract

Provided are an array substrate manufacturing method, an array substrate and a display device. The array substrate manufacturing method comprises: respectively forming a gate electrode (1), an active layer (3), a source electrode (5a), a drain electrode (5b) and a pixel electrode (4) through a configuration process. The source electrode (5a), the drain electrode (5b) and the pixel electrode (4) are formed through a primary configuration process.

Description

technical field [0001] The invention belongs to the technical field of display manufacturing, and in particular relates to a method for manufacturing an array substrate, an array substrate manufactured by the method, and a display device including the array substrate. Background technique [0002] With the development of display manufacturing technology, liquid crystal display technology has developed rapidly, and has gradually replaced traditional picture tube displays and become the mainstream of future flat panel displays. At present, the vast majority of liquid crystal displays are active matrix liquid crystal displays (AM-LCD, Active Matrix Liquid Crystal Display), among them, thin film transistor liquid crystal display (TFT-LCD, Thin Film Transistor LCD) Features such as low and no radiation have occupied a dominant position in the current flat panel display market. [0003] Because amorphous silicon (a-Si) is easy to prepare in a large area at low temperature and the...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/77H01L27/02
CPCH01L29/66969G02F2001/136236H01L27/1288H01L29/7869G02F1/1362H01L27/3262G02F1/136236H10K59/1213
Inventor 宁策刘翔
Owner BOE TECH GRP CO LTD