Fabricating method of thermal conducting halogen-free binderless copper clad foil

Abstract

The invention discloses and provides a fabricating method of a thermal conducting halogen-free binderless copper clad foil. The method mainly comprises the following steps of enabling aromatic diamine to react with aromatic dianhydride, adding different thermal conducting fillers with proper amount to the reactants, and then performing polyreaction to produce high temperature resistant polyamic acid; and then coating the polyamic acid on a copper foil, carrying out high temperature cyclization to form polymide with excellent performance on the copper foil surface, thereby obtaining the halogen-free plastic-free covering copper plate with excellent heat conducting performance. The copper foil produced by the method provided by the invention can ensure the best radiation effect of electron products, and the application performances of electron products are ensured. Moreover, the method can be widely used in the fabrication field of copper clad foils.

Description

technical field [0001] The invention relates to a method for making heat-conducting, halogen-free, glue-free, copper-clad copper foil. Background technique [0002] In recent years, with the development of communication technology, personal electronic products have gradually become thinner. The electronic components and circuits in electronic products are mainly based on flexible copper clad laminates (FPCs), which requires that the circuits of flexible copper clad laminates FPCs become increasingly smaller and denser. As information processing speeds up, a large amount of heat is generated inside the equipment. The heat dissipation problem in electronic product equipment has aroused people's attention and attention. As a result, various heat-conducting products came into being, such as aluminum-based copper-clad laminates. Although electronic heat conduction products such as aluminum-based copper-clad laminates on the market have achieved certain results in the applicati...

AI Technical Summary

Problems solved by technology

Although electronic heat conduction products such as aluminum-based copper-clad laminates on the market have achieved certain results in the application of electronic products, the problem of heat dissipation is still a prominent problem in those high-power and large-capacity electronic product bodies, and This problem has affected the performance of the electronic product itself and even caused the electronic product to crash

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