Reflow soldering auxiliary tool and reflow soldering method for flexible circuit board
A flexible circuit board and reflow soldering technology, which is applied in the direction of assembling printed circuits with electrical components, can solve problems such as poor soldering, thermal bending deformation and floating of FPC circuit boards, and achieve high operating efficiency and high qualified rate of processed products , the effect of simple structure
Inactive Publication Date: 2012-09-19
SHANGHAI FPC ELECTRONICS
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Problems solved by technology
[0003] However, during the production and assembly process of FPC circuit boards, during reflow soldering, longer FPC circuit boards are easily bent and deformed by heat. Due to the light weight of the components themselves, the solder feet will float due to the deformation of the FPC circuit board, resulting in poor soldering.
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[0013] The present invention will be described in detail below in conjunction with the accompanying drawings.
[0014] Such as figure 1 , figure 2 As shown, a reflow soldering auxiliary tool for a flexible circuit board includes a bead 1 and a bead placement tray 3. The bead 1 is a flat and elongated structure with the left half and the right half symmetrical to each other. The middle part of the bead 1 is provided with Circular SMT mounter suction part 2, the bead placement tray 3 is provided with a plurality of bead 1 placement slots corresponding to the shape of the bead 1, and the bead 1 is placed in the bead 1 placement grooves of the bead placement tray 3 .
[0015] A reflow soldering method for a flexible circuit board, comprising the steps of: placing a bead placement tray 3 on which a bead 1 is placed in the tray of an SMT placement machine, and writing data of the bead 1 in the program of the SMT placement machine, such as the suction position , bead 1 size, bead...
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The invention discloses a reflow soldering auxiliary tool and method for a flexible circuit board. The reflow soldering auxiliary tool comprises a pressing strip and a pressing strip placing tray, wherein the pressing strip is of a flat and long structure the left half part and the right half part of which are mutually symmetrical, a round absorbing part of an SMT (surface mount technology) chip mounter is arranged at the middle part of the pressing strip, and the pressing strip is placed into the pressing strip placing tray. The method comprises the following steps of: placing the pressing strip placing tray into a tray of the SMT chip mounter, writing information of the pressing strip into a program of the SMT chip mounter, after components are mounted by adopting the SMT chip mounter, lightly sucking the pressing strip like component assembling and placing the pressing strip at the top of two adjacent components, and then sending the whole FPC (flexible printed circuit) tray into a reflow oven to be subjected to reflow soldering processing, and finally after the FPC tray is taken out from the reflow oven, taking down the pressing strip by utilizing tweezers, thus the whole soldering process is completed. The tool and method disclosed by the invention can effectively avoid poor pseudo soldering caused by temperature distortion of FR-4 during reflow soldering.
Description
technical field [0001] The invention relates to a reflow soldering auxiliary tool for a flexible circuit board and a reflow soldering method for the flexible circuit board. Background technique [0002] FPC (Flexibility Printed Circuit), also known as flexible circuit board, is a highly reliable and excellent flexible printed circuit board made of polyimide or polyester film as the base material. FPC circuit board FR-4 reinforcing plate is provided on the back corresponding to the position of welding components. FPC circuit board has the characteristics of high wiring density, light weight and thin thickness. It is mainly used in mobile phones, notebook computers, PDAs, digital cameras, LCM and other products. [0003] However, during the production and assembly process of FPC circuit boards, during reflow soldering, the longer FPC circuit boards are prone to be bent and deformed by heat. Due to the light weight of the components themselves, the solder feet will float due t...
Claims
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Inventor 不公告发明人
Owner SHANGHAI FPC ELECTRONICS